Li-Han Hsu

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Layout context-based cell timing characterization
- Patent number 12,210,811
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Zhe-Wei Jiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 12,205,866
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Chia Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,191,224
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked via structure disposed on a conductive pillar of a semicond...
- Patent number 12,191,239
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intrusion detection apparatus for an information handling system
- Patent number 12,185,455
- Issue date Dec 31, 2024
- Dell Products L.P.
- Chun-Che Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for context aware circuit design
- Patent number 12,175,180
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Chung Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Magnetic tunnel junction device and method of forming same
- Patent number 12,154,608
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Jhih Shen
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and integrated circuit in hybrid row height st...
- Patent number 12,074,069
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jerry Chang-Jui Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate structure and method of forming the same
- Patent number 12,015,070
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure of semiconductor device
- Patent number 11,996,325
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic tunnel junction device and method of forming same
- Patent number 11,990,167
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Jhih Shen
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package with redistribution structure and manufacturi...
- Patent number 11,955,439
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for dynamic lithographic exposure
- Patent number 11,880,140
- Issue date Jan 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jun-Yih Yu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Layout context-based cell timing characterization
- Patent number 11,853,676
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Zhe-Wei Jiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for context aware circuit design
- Patent number 11,816,413
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Chung Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metal gates of transistors having reduced resistivity
- Patent number 11,810,819
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,810,846
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit in hybrid row height structure
- Patent number 11,791,213
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jerry Chang-Jui Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit testing and manufacture using multiple timing libraries
- Patent number 11,783,106
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ravi Babu Pittu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Contact structure for semiconductor device
- Patent number 11,776,847
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Yu Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked via structure disposed on a conductive pillar of a semicond...
- Patent number 11,756,870
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Routers and methods for traffic management
- Patent number 11,706,137
- Issue date Jul 18, 2023
- Synology Inc.
- Li-Fong Hsu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,652,063
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Orientation-adjustment mechanism
- Patent number 11,638,360
- Issue date Apr 25, 2023
- Wistron NeWeb Corp.
- Lan-Chun Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Opening in the pad for bonding integrated passive device in InFO pa...
- Patent number 11,612,057
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with redistribution structure and manufacturi...
- Patent number 11,581,268
- Issue date Feb 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layout context-based cell timing characterization
- Patent number 11,531,802
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Zhe-Wei Jiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Self-aligned spacers and method forming same
- Patent number 11,532,515
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Tsang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for dynamic lithographic exposure
- Patent number 11,520,237
- Issue date Dec 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jun-Yih Yu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,515,229
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250105090
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chia Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED VIA STRUCTURE DISPOSED ON A CONDUCTIVE PILLAR OF A SEMICOND...
- Publication number 20250096092
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR CONTEXT AWARE CIRCUIT DESIGN
- Publication number 20250086371
- Publication date Mar 13, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Li-Chung Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250087550
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS BUFFER IN INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240413097
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RINGS IN INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240413101
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING SHALLOW TRENCH FOR DICING AND STRUCTURES THEREOF
- Publication number 20240413102
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT IN HYBRID ROW HEIGHT STRUCTURE
- Publication number 20240395622
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jerry Chang-Jui KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging of Dies Including TSVs using Sacrificial Carrier
- Publication number 20240339370
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufactoring Co., Ltd.
- Chien-Fu Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE IN HYBRID ROW HEIGHT STRUCTURE
- Publication number 20240332083
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jerry Chang-Jui KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure of Semiconductor Device
- Publication number 20240274467
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURI...
- Publication number 20240222291
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYDROSOL PREPARATION SYSTEM
- Publication number 20240216830
- Publication date Jul 4, 2024
- PEOPLEFISH ENERGY INTIATIVE CO., LTD.
- LI-Ling HSU
- B67 - OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS LIQUID...
Information Patent Application
LAYOUT CONTEXT-BASED CELL TIMING CHARACTERIZATION
- Publication number 20240095434
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- ZHE-WEI JIANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240071947
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT IN HYBRID ROW HEIGHT STRUCTURE
- Publication number 20240030069
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jerry Chang-Jui KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Magnetic Tunnel Junction Device and Method of Forming Same
- Publication number 20240021230
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Jhih Shen
- G11 - INFORMATION STORAGE
Information Patent Application
Metal Gates of Transistors Having Reduced Resistivity
- Publication number 20240021473
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ching TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20240021474
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Lid.
- Yun-Yu HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Packages and Resulting Structures
- Publication number 20230402429
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Fu Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR CONTEXT AWARE CIRCUIT DESIGN
- Publication number 20230401369
- Publication date Dec 14, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Li-Chung Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20230378041
- Publication date Nov 23, 2023
- Taiwan Semiconduction Manufacturing Co., Ltd.
- Chia-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT IN HYBRID ROW HEIGHT STRUCTURE
- Publication number 20230377976
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jerry Chang-Jui KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED VIA STRUCTURE DISPOSED ON A CONDUCTIVE PILLAR OF A SEMICOND...
- Publication number 20230369189
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTRUSION DETECTION APPARATUS FOR AN INFORMATION HANDLING SYSTEM
- Publication number 20230328878
- Publication date Oct 12, 2023
- Dell Products L.P.
- Chun-Che Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20230282614
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURI...
- Publication number 20230154863
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYOUT CONTEXT-BASED CELL TIMING CHARACTERIZATION
- Publication number 20230107940
- Publication date Apr 6, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- ZHE-WEI JIANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND APPARATUS FOR DYNAMIC LITHOGRAPHIC EXPOSURE
- Publication number 20230075146
- Publication date Mar 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-Yih Yu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230054020
- Publication date Feb 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Layout context-based cell timing characterization

Semiconductor device

Semiconductor package and manufacturing method thereof

Stacked via structure disposed on a conductive pillar of a semicond...

Intrusion detection apparatus for an information handling system

Systems and methods for context aware circuit design

Magnetic tunnel junction device and method of forming same

Semiconductor device and integrated circuit in hybrid row height st...

Gate structure and method of forming the same

Interconnect structure of semiconductor device

Magnetic tunnel junction device and method of forming same

Semiconductor package with redistribution structure and manufacturi...

Method and apparatus for dynamic lithographic exposure

Layout context-based cell timing characterization

Systems and methods for context aware circuit design

Metal gates of transistors having reduced resistivity

Semiconductor device and method of manufacture

Integrated circuit in hybrid row height structure

Circuit testing and manufacture using multiple timing libraries

Contact structure for semiconductor device

Stacked via structure disposed on a conductive pillar of a semicond...

Routers and methods for traffic management

Semiconductor package and method of forming the same

Orientation-adjustment mechanism

Opening in the pad for bonding integrated passive device in InFO pa...

Semiconductor package with redistribution structure and manufacturi...

Layout context-based cell timing characterization

Self-aligned spacers and method forming same

Method and apparatus for dynamic lithographic exposure

Semiconductor package and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

STACKED VIA STRUCTURE DISPOSED ON A CONDUCTIVE PILLAR OF A SEMICOND...

SYSTEMS AND METHODS FOR CONTEXT AWARE CIRCUIT DESIGN

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

STRESS BUFFER IN INTEGRATED CIRCUIT PACKAGE AND METHOD

SEAL RINGS IN INTEGRATED CIRCUIT PACKAGE AND METHOD

FORMING SHALLOW TRENCH FOR DICING AND STRUCTURES THEREOF

INTEGRATED CIRCUIT IN HYBRID ROW HEIGHT STRUCTURE

Packaging of Dies Including TSVs using Sacrificial Carrier

SEMICONDUCTOR DEVICE IN HYBRID ROW HEIGHT STRUCTURE

Interconnect Structure of Semiconductor Device

SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURI...

HYDROSOL PREPARATION SYSTEM

LAYOUT CONTEXT-BASED CELL TIMING CHARACTERIZATION

SEMICONDUCTOR PACKAGE AND METHOD

INTEGRATED CIRCUIT IN HYBRID ROW HEIGHT STRUCTURE

Magnetic Tunnel Junction Device and Method of Forming Same

Metal Gates of Transistors Having Reduced Resistivity

CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE

Methods of Forming Packages and Resulting Structures

SYSTEMS AND METHODS FOR CONTEXT AWARE CIRCUIT DESIGN

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

INTEGRATED CIRCUIT IN HYBRID ROW HEIGHT STRUCTURE

STACKED VIA STRUCTURE DISPOSED ON A CONDUCTIVE PILLAR OF A SEMICOND...

INTRUSION DETECTION APPARATUS FOR AN INFORMATION HANDLING SYSTEM

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURI...

LAYOUT CONTEXT-BASED CELL TIMING CHARACTERIZATION

METHOD AND APPARATUS FOR DYNAMIC LITHOGRAPHIC EXPOSURE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF