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New Taipei City, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
11,996,345
Issue date
May 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Coplanar control for film-type thermal interface
Patent number
11,973,005
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Yu-Hsun Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method
Patent number
11,942,403
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Chien Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of manufacturing the same
Patent number
11,923,259
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Pu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming the same
Patent number
11,901,255
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Chien Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adhesive and thermal interface material on a plurality of dies cove...
Patent number
11,894,287
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,869,822
Issue date
Jan 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of fabricating the same
Patent number
11,855,003
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Pu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming package structure
Patent number
11,855,054
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Chien Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices and methods of manufacture
Patent number
11,830,821
Issue date
Nov 28, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of semiconductor package using jig
Patent number
11,804,468
Issue date
Oct 31, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally conductive material in the recess of an encapsulant and s...
Patent number
11,756,802
Issue date
Sep 12, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating package structure
Patent number
11,756,855
Issue date
Sep 12, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and method of forming the same
Patent number
11,742,323
Issue date
Aug 29, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Chien Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High efficiency heat dissipation using thermal interface material film
Patent number
11,705,381
Issue date
Jul 18, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
11,699,597
Issue date
Jul 11, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Li-Hui Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming package structure
Patent number
11,664,286
Issue date
May 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adhesive and thermal interface material on a plurality of dies cove...
Patent number
11,626,344
Issue date
Apr 11, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having passivation layer and method of manufac...
Patent number
11,605,579
Issue date
Mar 14, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packages and methods of forming same
Patent number
11,527,418
Issue date
Dec 13, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of manufacturing the same
Patent number
11,521,905
Issue date
Dec 6, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Pu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method
Patent number
11,495,526
Issue date
Nov 8, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Chien Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Underfill between a first package and a second package
Patent number
11,488,843
Issue date
Nov 1, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of fabricating the same
Patent number
11,456,287
Issue date
Sep 27, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Hsien-Pin Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming the same
Patent number
11,424,174
Issue date
Aug 23, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Chien Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dummy structure of stacked and bonded semiconductor device
Patent number
11,393,783
Issue date
Jul 19, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Li-Hui Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optical signal processing package structure
Patent number
11,302,683
Issue date
Apr 12, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Chien Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and forming method thereof
Patent number
11,296,051
Issue date
Apr 5, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chin-Fu Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adhesive and thermal interface material on a plurality of dies cove...
Patent number
11,239,136
Issue date
Feb 1, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
Patent number
11,239,138
Issue date
Feb 1, 2022
Taiwan Semiconductor Manufacturing Company
Li-Hui Cheng
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING
Publication number
20240096732
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hao CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING PACKAGE STRUCTURE AND PACKAGE STRUCTURE THEREFROM
Publication number
20240079399
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Chien Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
Publication number
20240071847
Publication date
Feb 29, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yi-Huan Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240071857
Publication date
Feb 29, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Chien Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Packages and Methods of Forming the Same
Publication number
20240038623
Publication date
Feb 1, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Ping-Yin Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPLANAR CONTROL FOR FILM-TYPE THERMAL INTERFACE
Publication number
20240014100
Publication date
Jan 11, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Hsun Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-TIM PACKAGES AND METHOD FORMING SAME
Publication number
20230378020
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Ping-Yin Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20230378130
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Chien Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
Publication number
20230378017
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Ping-Yin Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING JIG
Publication number
20230369283
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
Publication number
20230360995
Publication date
Nov 9, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High Efficiency Heat Dissipation Using Thermal Interface Material Film
Publication number
20230317552
Publication date
Oct 5, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY AND DEHUMIDIFICATION METHOD THEREOF
Publication number
20230316992
Publication date
Oct 5, 2023
ViewSonic International Corporation
Jia-Shin Tsai
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230290650
Publication date
Sep 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Li-Hui Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230290704
Publication date
Sep 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230290714
Publication date
Sep 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Ping-Yin Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE
Publication number
20230253276
Publication date
Aug 10, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hao CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVE...
Publication number
20230230898
Publication date
Jul 20, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hao CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20230146652
Publication date
May 11, 2023
Taiwan Semiconductor Manufacturing company Ltd.
JING-CHENG LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230075735
Publication date
Mar 9, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Pu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230065884
Publication date
Mar 2, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230048302
Publication date
Feb 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Ping-Yin Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Package and Method
Publication number
20230052821
Publication date
Feb 16, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Chien Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20230026141
Publication date
Jan 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230021005
Publication date
Jan 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Wen-Chih Chiou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Heat Dissipation Structures for Integrated Circuit Packages and Met...
Publication number
20230014913
Publication date
Jan 19, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ASSEMBLY INCLUDING A PACKAGE LID HAVING A STEP REGION AND M...
Publication number
20230011493
Publication date
Jan 12, 2023
Taiwan Semiconductor Manufacturing Company Limited
Ping-Yin HSIEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20220406676
Publication date
Dec 22, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Ping-Yin Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH EFFICIENCY HEAT DISSIPATION USING THERMAL INTERFACE MATERIAL FILM
Publication number
20220392823
Publication date
Dec 8, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Devices and Methods of Manufacture
Publication number
20220384355
Publication date
Dec 1, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS