Li-Ming Teng

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electrical fuse (e-fuse) one-time programmable (OTP) device and man...
- Patent number 12,255,133
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Alexander Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array boundary structure to reduce dishing
- Patent number 12,127,399
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-type high voltage devices fabrication for embedded memory
- Patent number 12,096,621
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei Cheng Wu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,058,856
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to embed planar FETs with finFETs
- Patent number 12,015,029
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to embed planar FETS with FINFETS
- Patent number 11,830,875
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,825,651
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,758,721
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 11,742,348
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Feng Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an array boundary structure to reduce dishing
- Patent number 11,706,914
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and manufacturing method thereof
- Patent number 11,600,618
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,594,620
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to embed planar FETs with finFETs
- Patent number 11,355,493
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask design for embedded memory
- Patent number 11,282,846
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Feng Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-type high voltage devices fabrication for embedded memory
- Patent number 11,264,396
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array boundfary structure to reduce dishing
- Patent number 11,211,388
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,950,611
- Issue date Mar 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including non-volatile...
- Patent number 10,950,715
- Issue date Mar 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including non-volatile...
- Patent number 10,943,996
- Issue date Mar 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,879,253
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask design for embedded memory
- Patent number 10,325,919
- Issue date Jun 18, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Feng Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,325,918
- Issue date Jun 18, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,283,512
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with gate electrode embedded in substrate
- Patent number 10,164,074
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded HKMG non-volatile memory
- Patent number 9,876,021
- Issue date Jan 23, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded HKMG non-volatile memory
- Patent number 9,842,848
- Issue date Dec 12, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 9,093,427
- Issue date Jul 28, 2015
- National Chiao Tung University
- Po-Tsun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,975,164
- Issue date Mar 10, 2015
- National Chiao Tung University
- Po-Tsun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistor with UV light absorber layer
- Patent number 8,969,868
- Issue date Mar 3, 2015
- National Chiao Tung University
- Han-Ping D. Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Algorithm integrating system and integrating method thereof
- Patent number 8,744,796
- Issue date Jun 3, 2014
- HOY Technologies Co., Ltd.
- Chun-Chia Chen
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
MULTI-TYPE HIGH VOLTAGE DEVICES FABRICATION FOR EMBEDDED MEMORY
- Publication number 20240373627
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Cheng Wu
- G11 - INFORMATION STORAGE
Information Patent Application
ARRAY BOUNDARY STRUCTURE TO REDUCE DISHING
- Publication number 20240373626
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240365542
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Cheng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO EMBED PLANAR FETS WITH FINFETS
- Publication number 20240290786
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING INDUCTOR AND METHOD OF MANUFACTURING TH...
- Publication number 20240071911
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Haklay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO EMBED PLANAR FETS WITH FINFETS
- Publication number 20240021614
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230380155
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Cheng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20230352482
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Feng TENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY BOUNDARY STRUCTURE TO REDUCE DISHING
- Publication number 20230301075
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND ROUTING STRUCTURE FOR STACKED WAFERS
- Publication number 20230260942
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLOTTED BOND PAD IN STACKED WAFER STRUCTURE
- Publication number 20230245987
- Publication date Aug 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230067962
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alexander KALNITSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230013047
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Che CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220302114
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO EMBED PLANAR FETS WITH FINFETS
- Publication number 20220285344
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20220271031
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Feng TENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-TYPE HIGH VOLTAGE DEVICES FABRICATION FOR EMBEDDED MEMORY
- Publication number 20220181340
- Publication date Jun 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY BOUNDARY STRUCTURE TO REDUCE DISHING
- Publication number 20220115391
- Publication date Apr 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO EMBED PLANAR FETS WITH FINFETS
- Publication number 20210288048
- Publication date Sep 16, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210202513
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210202721
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210118895
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-TYPE HIGH VOLTAGE DEVICES FABRICATION FOR EMBEDDED MEMORY
- Publication number 20200381442
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Wei Cheng Wu
- G11 - INFORMATION STORAGE
Information Patent Application
MASK DESIGN FOR EMBEDDED MEMORY
- Publication number 20190393235
- Publication date Dec 26, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Li-Feng Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20190287981
- Publication date Sep 19, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20190229124
- Publication date Jul 25, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCUTRE AND METHOD OF FABRICATING THE SAME
- Publication number 20190148389
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20190097028
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei Cheng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180151581
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180151707
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS

Li-Ming Teng

Person

Patents Grantslast 30 patents

Electrical fuse (e-fuse) one-time programmable (OTP) device and man...

Array boundary structure to reduce dishing

Multi-type high voltage devices fabrication for embedded memory

Semiconductor device and manufacturing method thereof

Method to embed planar FETs with finFETs

Method to embed planar FETS with FINFETS

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and method for forming the same

Method of forming an array boundary structure to reduce dishing

Integrated circuit structure and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Method to embed planar FETs with finFETs

Mask design for embedded memory

Multi-type high voltage devices fabrication for embedded memory

Array boundfary structure to reduce dishing

Semiconductor device and manufacturing method thereof

Method of manufacturing semiconductor device including non-volatile...

Method of manufacturing semiconductor device including non-volatile...

Semiconductor device and manufacturing method thereof

Mask design for embedded memory

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device with gate electrode embedded in substrate

Embedded HKMG non-volatile memory

Embedded HKMG non-volatile memory

Method for fabricating semiconductor device

Method of manufacturing semiconductor device

Thin film transistor with UV light absorber layer

Algorithm integrating system and integrating method thereof

Patents Applicationslast 30 patents

MULTI-TYPE HIGH VOLTAGE DEVICES FABRICATION FOR EMBEDDED MEMORY

ARRAY BOUNDARY STRUCTURE TO REDUCE DISHING

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD TO EMBED PLANAR FETS WITH FINFETS

SEMICONDUCTOR DEVICE HAVING INDUCTOR AND METHOD OF MANUFACTURING TH...

METHOD TO EMBED PLANAR FETS WITH FINFETS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

ARRAY BOUNDARY STRUCTURE TO REDUCE DISHING

BOND ROUTING STRUCTURE FOR STACKED WAFERS

SLOTTED BOND PAD IN STACKED WAFER STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME

INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD TO EMBED PLANAR FETS WITH FINFETS

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

MULTI-TYPE HIGH VOLTAGE DEVICES FABRICATION FOR EMBEDDED MEMORY

ARRAY BOUNDARY STRUCTURE TO REDUCE DISHING

METHOD TO EMBED PLANAR FETS WITH FINFETS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MULTI-TYPE HIGH VOLTAGE DEVICES FABRICATION FOR EMBEDDED MEMORY

MASK DESIGN FOR EMBEDDED MEMORY

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCUTRE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF