LI-WEI YIN

Person

HSINCHU, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 12,132,050
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 12,062,582
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Chao Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having dielectric structure extending into...
- Patent number 12,027,608
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for processing substrates or wafers
- Patent number 11,948,810
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Chao Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 11,894,370
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,823,958
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shiang-Bau Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 11,502,076
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cut-fin isolation regions and method forming same
- Patent number 11,171,236
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shiang-Bau Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 11,114,549
- Issue date Sep 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,069,579
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shiang-Bau Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cutting metal gates in fin field effect transistors
- Patent number 10,872,897
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Wei Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cutting metal gates in fin field effect transistors
- Patent number 10,658,372
- Issue date May 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Wei Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cutting metal gates in fin field effect transistors
- Patent number 10,424,588
- Issue date Sep 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Wei Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 10,325,912
- Issue date Jun 18, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20240371869
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332420
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chieh CHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE W-SHAPED PROFILE FOR STRUCTURES
- Publication number 20240321739
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jih-Sheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING DIELECTRIC STRUCTURE EXTENDING INTO...
- Publication number 20240313091
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PROCESSING SUBSTRATES OR WAFERS
- Publication number 20240249957
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Chao YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE STRUCTURE PROFILE
- Publication number 20240120388
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Wei Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20240113112
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240096630
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Wei Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096806
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHAO-HSUAN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240072170
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Wei Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20230378003
- Publication date Nov 23, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Li-Chao YIN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20230377990
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shiang-Bau Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Forming the Same
- Publication number 20230027789
- Publication date Jan 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Wei Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20220384269
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TREATING SEMICONDUCTOR WAFER
- Publication number 20220351948
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- HUNG-BIN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cut-Fin Isolation Regions and Method Forming Same
- Publication number 20220059685
- Publication date Feb 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shiang-Bau Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20210351084
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shiang-Bau Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20210280695
- Publication date Sep 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR ETCHING
- Publication number 20210249232
- Publication date Aug 12, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- HUNG-BIN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor devices
- Publication number 20210217670
- Publication date Jul 15, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Chao Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cutting Metal Gates in Fin Field Effect Transistors
- Publication number 20200279854
- Publication date Sep 3, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Li-Wei Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20200126868
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiang-Bau Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cut-Fin Isolation Regions and Method Forming Same
- Publication number 20200044070
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiang-Bau Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cutting Metal Gates in Fin Field Effect Transistors
- Publication number 20200020701
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Li-Wei Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20190165137
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- RYAN CHIA-JEN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PROCESSING SUBSTRATES OR WAFERS
- Publication number 20190148177
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Chao YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cutting Metal Gates in Fin Field Effect Transistors
- Publication number 20190139969
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Li-Wei Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20190131298
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20190131297
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- RYAN CHIA-JEN CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor structure cutting process and structures formed thereby

Method of manufacturing semiconductor devices

Semiconductor structure having dielectric structure extending into...

Apparatus for processing substrates or wafers

Semiconductor structure cutting process and structures formed thereby

Semiconductor device and method

Semiconductor structure cutting process and structures formed thereby

Cut-fin isolation regions and method forming same

Semiconductor structure cutting process and structures formed thereby

Semiconductor device and method

Cutting metal gates in fin field effect transistors

Cutting metal gates in fin field effect transistors

Cutting metal gates in fin field effect transistors

Semiconductor structure cutting process and structures formed thereby

Patents Applicationslast 30 patents

Semiconductor Structure Cutting Process and Structures Formed Thereby

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

TUNABLE W-SHAPED PROFILE FOR STRUCTURES

SEMICONDUCTOR STRUCTURE HAVING DIELECTRIC STRUCTURE EXTENDING INTO...

APPARATUS FOR PROCESSING SUBSTRATES OR WAFERS

TUNABLE STRUCTURE PROFILE

Semiconductor Structure Cutting Process and Structures Formed Thereby

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND METHOD

Semiconductor Devices and Methods of Forming the Same

Semiconductor Structure Cutting Process and Structures Formed Thereby

METHOD FOR TREATING SEMICONDUCTOR WAFER

Cut-Fin Isolation Regions and Method Forming Same

SEMICONDUCTOR DEVICE AND METHOD

Semiconductor Structure Cutting Process and Structures Formed Thereby

APPARATUS AND METHOD FOR ETCHING

Method of manufacturing semiconductor devices

Cutting Metal Gates in Fin Field Effect Transistors

Semiconductor Device and Method

Cut-Fin Isolation Regions and Method Forming Same

Cutting Metal Gates in Fin Field Effect Transistors

Semiconductor Structure Cutting Process and Structures Formed Thereby

APPARATUS FOR PROCESSING SUBSTRATES OR WAFERS

Cutting Metal Gates in Fin Field Effect Transistors

Semiconductor Structure Cutting Process and Structures Formed Thereby

Semiconductor Structure Cutting Process and Structures Formed Thereby