Li Ying Kuo

Person

Hsin Chu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Antenna module and electronic device
- Patent number 12,095,143
- Issue date Sep 17, 2024
- Wistron NeWeb Corporation
- Li-Kai Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with multiple types of underfill and method forming the same
- Patent number 12,087,733
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill structure for semiconductor packages and methods of formi...
- Patent number 12,080,617
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,051,668
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing thereof
- Patent number 12,027,624
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface materials, 3D semiconductor packages and methods...
- Patent number 12,021,008
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,015,023
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy die placement without backside chipping
- Patent number 11,990,429
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill structure for semiconductor packages and methods of formi...
- Patent number 11,842,936
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,699,674
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sawing underfill in packaging processes
- Patent number 11,637,086
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sawing underfill in packaging processes
- Patent number 11,631,654
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill structure for semiconductor packages and methods of formi...
- Patent number 11,621,205
- Issue date Apr 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing thereof
- Patent number 11,552,195
- Issue date Jan 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy die placement without backside chipping
- Patent number 11,515,267
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface materials, 3D semiconductor packages and methods...
- Patent number 11,482,465
- Issue date Oct 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture of a semiconductor device
- Patent number 11,201,097
- Issue date Dec 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,164,824
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture of a semiconductor device
- Patent number 11,121,050
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,101,236
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a dummy die of an integrated circuit having an em...
- Patent number 11,101,260
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill structure for semiconductor packages and methods of formi...
- Patent number 11,075,133
- Issue date Jul 27, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,024,616
- Issue date Jun 1, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,879,194
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy die placement without backside chipping
- Patent number 10,861,799
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sawing underfill in packaging processes
- Patent number 10,840,215
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-to-die gap control for semiconductor structure and method
- Patent number 10,157,879
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sawing underfill in packaging processes
- Patent number 9,620,430
- Issue date Apr 11, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-to-die gap control for semiconductor structure and method
- Patent number 8,963,334
- Issue date Feb 24, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die structure and method of fabrication thereof
- Patent number 8,828,848
- Issue date Sep 9, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240387546
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- PO-YING CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240332422
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240297166
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA STRUCTURE AND MOBILE DEVICE
- Publication number 20240283169
- Publication date Aug 22, 2024
- WISTRON NEWEB CORP.
- Li-Kai KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA STRUCTURE
- Publication number 20240266735
- Publication date Aug 8, 2024
- WISTRON NEWEB CORP.
- Li-Kai KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240071849
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-You Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH MULTIPLE TYPES OF UNDERFILL AND METHOD FORMING THE SAME
- Publication number 20230395564
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULE AND ELECTRONIC DEVICE
- Publication number 20230378635
- Publication date Nov 23, 2023
- WISTRON NEWEB CORPORATION
- LI-KAI KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT AND ANTENNA STRUCTURE
- Publication number 20230363089
- Publication date Nov 9, 2023
- WISTRON NEWEB CORPORATION
- Li-Kai KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20230299033
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill Structure for Semiconductor Packages and Methods of Formi...
- Publication number 20230253280
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20230119370
- Publication date Apr 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Die Placement Without Backside Chipping
- Publication number 20230092361
- Publication date Mar 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Interface Materials, 3D Semiconductor Packages and Methods...
- Publication number 20220375814
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages With Multiple Types of Underfill and Method Forming The Same
- Publication number 20220367413
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20220336662
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Forming the Same
- Publication number 20210384154
- Publication date Dec 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill Structure for Semiconductor Packages and Methods of Formi...
- Publication number 20210358825
- Publication date Nov 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20210320097
- Publication date Oct 14, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill Structure for Semiconductor Packages and Methods of Formi...
- Publication number 20210210400
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sawing Underfill in Packaging Processes
- Publication number 20210125964
- Publication date Apr 29, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Die Placement Without Backside Chipping
- Publication number 20210118817
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIALS, 3D SEMICONDUCTOR PACKAGES AND METHODS...
- Publication number 20210118770
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Chung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD STRUCTURE
- Publication number 20210104477
- Publication date Apr 8, 2021
- Macronix International Co., Ltd.
- Chih-Ching Eric SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20210066211
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sawing Underfill in Packaging Processes
- Publication number 20210057383
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Die Placement Without Backside Chipping
- Publication number 20200365525
- Publication date Nov 19, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200365571
- Publication date Nov 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Forming the Same
- Publication number 20200075527
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill Structure for Semiconductor Packages and Methods of Formi...
- Publication number 20200006181
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Li Ying Kuo

Person

Patents Grantslast 30 patents

Antenna module and electronic device

Packages with multiple types of underfill and method forming the same

Underfill structure for semiconductor packages and methods of formi...

Semiconductor package and method of forming the same

Semiconductor devices and methods of manufacturing thereof

Thermal interface materials, 3D semiconductor packages and methods...

Integrated circuit package and method of forming same

Dummy die placement without backside chipping

Underfill structure for semiconductor packages and methods of formi...

Semiconductor package and method of forming the same

Sawing underfill in packaging processes

Sawing underfill in packaging processes

Underfill structure for semiconductor packages and methods of formi...

Semiconductor devices and methods of manufacturing thereof

Dummy die placement without backside chipping

Thermal interface materials, 3D semiconductor packages and methods...

Method of manufacture of a semiconductor device

Package structure and method of fabricating the same

Method of manufacture of a semiconductor device

Semiconductor package and method of forming the same

Method of forming a dummy die of an integrated circuit having an em...

Underfill structure for semiconductor packages and methods of formi...

Package structure and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Dummy die placement without backside chipping

Sawing underfill in packaging processes

Die-to-die gap control for semiconductor structure and method

Sawing underfill in packaging processes

Die-to-die gap control for semiconductor structure and method

Die structure and method of fabrication thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

ANTENNA STRUCTURE AND MOBILE DEVICE

ANTENNA STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD

PACKAGES WITH MULTIPLE TYPES OF UNDERFILL AND METHOD FORMING THE SAME

ANTENNA MODULE AND ELECTRONIC DEVICE

FLEXIBLE PRINTED CIRCUIT AND ANTENNA STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

Underfill Structure for Semiconductor Packages and Methods of Formi...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

Dummy Die Placement Without Backside Chipping

Thermal Interface Materials, 3D Semiconductor Packages and Methods...

Packages With Multiple Types of Underfill and Method Forming The Same

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

Semiconductor Package and Method of Forming the Same

Underfill Structure for Semiconductor Packages and Methods of Formi...

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

Underfill Structure for Semiconductor Packages and Methods of Formi...

Sawing Underfill in Packaging Processes

Dummy Die Placement Without Backside Chipping

THERMAL INTERFACE MATERIALS, 3D SEMICONDUCTOR PACKAGES AND METHODS...

PAD STRUCTURE

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Sawing Underfill in Packaging Processes

Dummy Die Placement Without Backside Chipping

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Package and Method of Forming the Same

Underfill Structure for Semiconductor Packages and Methods of Formi...