Lien-Chen Chiang

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Wire bonding device and method of eliminating defective bonding wire
- Patent number 9,355,989
- Issue date May 31, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Sheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame structure having blocking surfaces and semiconductor pac...
- Patent number 7,459,770
- Issue date Dec 2, 2008
- Siliconware Precision Industries Co., Ltd.
- Wen-Shan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for improving molding reliability and semiconductor pack...
- Patent number 7,180,161
- Issue date Feb 20, 2007
- Siliconware Precision Industries Co., Ltd.
- Lien-Chen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having tapering support bars and leads
- Patent number 6,696,749
- Issue date Feb 24, 2004
- Siliconware Precision Industries Co., Ltd.
- Chin-Yuan Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for chip with testing contact pad connected t...
- Patent number 6,642,735
- Issue date Nov 4, 2003
- Siliconware Precision Industries Co., Ltd.
- Lien-Chen Chiang
- G01 - MEASURING TESTING
Information Patent Grant
Quad flat non-leaded package structure for housing CMOS sensor
- Patent number 6,476,469
- Issue date Nov 5, 2002
- Siliconware Precision Industries Co., Ltd.
- Chin-Yuan Hung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20160141217
- Publication date May 19, 2016
- Siliconware Precision Industries Co., Ltd.
- Pei-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE, PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20160126176
- Publication date May 5, 2016
- Siliconware Precision Industries Co., Ltd.
- Tso-Chia Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING DEVICE AND METHOD OF ELIMINATING DEFECTIVE BONDING WIRE
- Publication number 20160079198
- Publication date Mar 17, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Sheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package and fabrication method thereof
- Publication number 20080308951
- Publication date Dec 18, 2008
- Siliconware Precision Industries Co., Ltd.
- Yuan-Chun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame structure and semiconductor package integrated with the...
- Publication number 20070111395
- Publication date May 17, 2007
- Siliconware Precision Industries Co., Ltd.
- Wen-Shan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame for improving molding reliability and semiconductor pack...
- Publication number 20060006505
- Publication date Jan 12, 2006
- Siliconware Precision Industries Co., Ltd.
- Lien-Chen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package for chip with testing contact pad
- Publication number 20020070747
- Publication date Jun 13, 2002
- Lien-Chen Chiang
- G01 - MEASURING TESTING
Information Patent Application
Package of an image sensor device
- Publication number 20020060358
- Publication date May 23, 2002
- Chin-Yuan Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Quad flat non-leaded package structure for housing CMOS sensor
- Publication number 20020060357
- Publication date May 23, 2002
- Chin-Yuan Hung
- H01 - BASIC ELECTRIC ELEMENTS

Lien-Chen Chiang

Person

Patents Grantslast 30 patents

Wire bonding device and method of eliminating defective bonding wire

Lead frame structure having blocking surfaces and semiconductor pac...

Lead frame for improving molding reliability and semiconductor pack...

Package structure having tapering support bars and leads

Semiconductor package for chip with testing contact pad connected t...

Quad flat non-leaded package structure for housing CMOS sensor

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

PACKAGE SUBSTRATE, PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

WIRE BONDING DEVICE AND METHOD OF ELIMINATING DEFECTIVE BONDING WIRE

Semiconductor package and fabrication method thereof

Lead frame structure and semiconductor package integrated with the...

Lead frame for improving molding reliability and semiconductor pack...

Semiconductor package for chip with testing contact pad

Package of an image sensor device

Quad flat non-leaded package structure for housing CMOS sensor