Lihua Bao

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Shanghai, CN

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Patents Applicationslast 30 patents

Information Patent Application
Method of Avoiding Resin Outflow from the Wafer Scribe line in WLCSP
- Publication number 20120142165
- Publication date Jun 7, 2012
- Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE PROCESS WITH IMPROVED DIE ATTACH METHOD FOR U...
- Publication number 20110294262
- Publication date Dec 1, 2011
- Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS