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Lim T. Beng
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Pasir Ris Gardens, SG
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last 30 patents
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Patent Grant
Packaged semiconductor device utilizing leadframe attached on a sem...
Patent number
5,563,443
Issue date
Oct 8, 1996
Texas Instruments Incorporated
Lim T. Beng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor device having stress absorbing film
Patent number
5,466,888
Issue date
Nov 14, 1995
Hitachi, Ltd.
Lim T. Beng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor device having stress absorbing film
Patent number
5,406,028
Issue date
Apr 11, 1995
Hitachi, Ltd.
Lim T. Beng
H01 - BASIC ELECTRIC ELEMENTS