Claims
- 1. An integrated circuit device in a molded package comprising:
- an integrated circuit device having bond pads thereon, said bond pads being arranged in a center portion of said integrated circuit device, a center line extending along said center portion and bisecting said integrated circuit device;
- a lead frame attached to a surface of said integrated circuit device, said lead frame including first and second support ties, said first and second support ties extending the entire length of said integrated circuit device and positioned generally parallel to said center line, said first support tie extending beyond a first edge of said package through which said center line passes during the process for molding said molded package and not extending to a second edge of said molded package opposite from said first edge of said molded package, said second support tie extending beyond said second edge of said molded package during the process for molding said molded package and not extending to said first edge of said molded package; and
- injected plastic encasing said integrated circuit and a portion of said lead frame to form said molded package.
- 2. An integrated circuit device as in claim 1 further comprising bonding wires extending from said lead frame to said bond pads.
- 3. An integrated circuit device as in claim 1 wherein said lead frame comprises an iron alloy.
- 4. An integrated circuit device as in claim 1 wherein said lead frame further comprises first and second support tabs, said first support tab positioned along a line through the portion of said first support which is parallel to said center line but separated from said first support tie and extending through said second edge of said molded package, said second support tab positioned along a line through the portion of said second support tie which is parallel to said center line but separated from said second support tie and extending through said first edge of said molded package.
- 5. An integrated circuit device as in claim 1 wherein said support ties are connected to at least one of said bond pads by a bond wire.
- 6. An integrated circuit device as in claim 1 wherein said support ties include bends.
Parent Case Info
This is a division of application Ser. No. 08/107,101 , filed 03/13/93.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
5331201 |
Nishino |
Jul 1994 |
|
5442233 |
Anjoh et al. |
Aug 1995 |
|
Divisions (1)
|
Number |
Date |
Country |
Parent |
107101 |
Mar 1993 |
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