Liming Tsau

Person

Irvine, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor product with edge integrity detection structure
- Patent number 12,216,153
- Issue date Feb 4, 2025
- Avago Technologies International Sales Pte. Limited
- Xiaoming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cantilevered power planes to provide a return current path for high...
- Patent number 12,191,243
- Issue date Jan 7, 2025
- Avago Technologies International Sales Pte. Limited
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with serpentine conductor and method of...
- Patent number 12,068,232
- Issue date Aug 20, 2024
- Avago Technologies International Sales Pte. Limited
- Michael Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics integration in semiconductor packages
- Patent number 11,906,802
- Issue date Feb 20, 2024
- Avago Technologies International Sales Pte. Limited
- Mayank Mayukh
- G02 - OPTICS
Information Patent Grant
Redistribution metal and under bump metal interconnect structures a...
- Patent number 11,049,829
- Issue date Jun 29, 2021
- Avago Technologies International Sales Pte. Limited
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die edge crack and delamination detection
- Patent number 10,629,504
- Issue date Apr 21, 2020
- Avago Technologies International Sales Pte. Limited
- Ennis T. Ogawa
- G01 - MEASURING TESTING
Information Patent Grant
Redistribution metal and under bump metal interconnect structures a...
- Patent number 10,504,862
- Issue date Dec 10, 2019
- Avago Technologies International Sales Pte. Limited
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with die edge assurance structure
- Patent number 9,741,667
- Issue date Aug 22, 2017
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Rong Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with fuse window and a monitoring window over a s...
- Patent number 8,106,476
- Issue date Jan 31, 2012
- Broadcom Corporation
- Robert I. Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal (MIM) capacitor
- Patent number 7,329,955
- Issue date Feb 12, 2008
- Broadcom Corporation
- Liming Tsau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density metal capacitor using dual-damascene copper interconnect
- Patent number 7,187,015
- Issue date Mar 6, 2007
- Broadcom Corporation
- Liming Tsau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density metal capacitor using via etch stopping layer as field...
- Patent number 7,049,204
- Issue date May 23, 2006
- Broadcom Corporation
- Liming Tsau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for one-time programmed memory through direct-tun...
- Patent number 7,009,891
- Issue date Mar 7, 2006
- Broadcom Corporation
- Vincent Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
System and method for one-time programmed memory through direct-tun...
- Patent number 6,985,387
- Issue date Jan 10, 2006
- Broadcom Corporation
- Vincent Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
System and method for one-time programmed memory through direct-tun...
- Patent number 6,960,819
- Issue date Nov 1, 2005
- Broadcom Corporation
- Vincent Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Metal bond pad for integrated circuits allowing improved probing ab...
- Patent number 6,952,053
- Issue date Oct 4, 2005
- Broadcom Corporation
- Tzu Hsin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method to screen defect related reliability failures in...
- Patent number 6,950,355
- Issue date Sep 27, 2005
- Broadcom Corporation
- Surya Battacharya
- G11 - INFORMATION STORAGE
Information Patent Grant
High-density metal capacitor using dual-damascene copper interconnect
- Patent number 6,902,972
- Issue date Jun 7, 2005
- Broadcom Corporation
- Liming Tsau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density metal capacitor using dual-damascene copper interconnect
- Patent number 6,833,604
- Issue date Dec 21, 2004
- Broadcom Corporation
- Liming Tsau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density metal capacitor using via etch stopping layer as field...
- Patent number 6,803,306
- Issue date Oct 12, 2004
- Broadcom Corporation
- Liming Tsau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-damascene interconnect structures and methods of fabricating same
- Patent number 6,417,094
- Issue date Jul 9, 2002
- Newport Fab, LLC
- Bin Zhao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CANTILEVERED POWER PLANES TO PROVIDE A RETURN CURRENT PATH FOR HIGH...
- Publication number 20250096108
- Publication date Mar 20, 2025
- Avago Technologies International Sales Pte. Limited
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH SERPENTINE CONDUCTOR AND METHOD OF...
- Publication number 20240395689
- Publication date Nov 28, 2024
- Avago Technologies International Sales Pte. Limited
- Michael Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonics Integration in Semiconductor Packages
- Publication number 20240151921
- Publication date May 9, 2024
- Avago Technologies International Sales Pte. Limited
- Mayank Mayukh
- G02 - OPTICS
Information Patent Application
Substrate with Differing Dielectric Constants
- Publication number 20240145392
- Publication date May 2, 2024
- Avago Technologies International Sales Pte. Limited
- Dharmendra Saraswat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microfluidic Channels for Cooling Hybrid Bonded Interfaces
- Publication number 20240128156
- Publication date Apr 18, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge Seal for Bonded Stacks of Different Size Semiconductor Devices
- Publication number 20240038613
- Publication date Feb 1, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elastomer Interconnection Substrate Layer
- Publication number 20240038641
- Publication date Feb 1, 2024
- Avago Technologies International Sales Pte. Limited
- Dharmendra Saraswat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Interconnection Structure
- Publication number 20240038645
- Publication date Feb 1, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Side Wall Interconnection
- Publication number 20240038724
- Publication date Feb 1, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Antennas on Side Wall of 3D Stacked Die
- Publication number 20240039141
- Publication date Feb 1, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mixed Dielectric Materials for Improving Signal Integrity of Integr...
- Publication number 20230395444
- Publication date Dec 7, 2023
- Avago Technologies International Sales Pte. Limited
- Mayank Mayukh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Packaging Heterogeneous Area Array Interconnections
- Publication number 20230369267
- Publication date Nov 16, 2023
- Avago Technologies International Sales Pte. Limited
- Sam Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonics Integration in Semiconductor Packages
- Publication number 20230367087
- Publication date Nov 16, 2023
- Avago Technologies International Sales Pte. Limited
- Mayank Mayukh
- G02 - OPTICS
Information Patent Application
Cantilevered Power Planes to Provide a Return Current Path for High...
- Publication number 20230369191
- Publication date Nov 16, 2023
- Avago Technologies International Sales Pte. Limited
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Cores, Variable Width Vias, and Offset Vias
- Publication number 20230352383
- Publication date Nov 2, 2023
- Avago Technologies International Sales Pte. Limited
- Dharmendra Saraswat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PRODUCT WITH EDGE INTEGRITY DETECTION STRUCTURE
- Publication number 20230296664
- Publication date Sep 21, 2023
- Avago Technologies International Sales Pte. Limited
- Xiaoming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH SERPENTINE CONDUCTOR AND METHOD OF...
- Publication number 20230138918
- Publication date May 4, 2023
- Avago Technologies International Sales Pte. Limited
- Michael Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION METAL AND UNDER BUMP METAL INTERCONNECT STRUCTURES A...
- Publication number 20200105698
- Publication date Apr 2, 2020
- Avago Technologies International Sales Pte. Limited
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION METAL AND UNDER BUMP METAL INTERCONNECT STRUCTURES A...
- Publication number 20190123007
- Publication date Apr 25, 2019
- Avago Technologies General IP (Singapore) PTE. LTD.
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE EDGE CRACK AND DELAMINATION DETECTION
- Publication number 20170323835
- Publication date Nov 9, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Ennis T. OGAWA
- G01 - MEASURING TESTING
Information Patent Application
Integrated Circuit with Die Edge Assurance Structure
- Publication number 20160300800
- Publication date Oct 13, 2016
- BROADCOM CORPORATION
- Rong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for monitoring fuse integrity in a semiconductor die and rel...
- Publication number 20090045400
- Publication date Feb 19, 2009
- BROADCOM CORPORATION
- Robert I. Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High voltage transistor
- Publication number 20080042221
- Publication date Feb 21, 2008
- Liming Tsau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-insulator-metal (MIM) capacitor
- Publication number 20060145295
- Publication date Jul 6, 2006
- BROADCOM CORPORATION
- Liming Tsau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal bond pad for integrated circuits allowing improved probing ab...
- Publication number 20060022225
- Publication date Feb 2, 2006
- BROADCOM CORPORATION
- Tzu Hsin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for one-time programmed memory through direct-tun...
- Publication number 20050219889
- Publication date Oct 6, 2005
- BROADCOM CORPORATION
- Vincent Chen
- G11 - INFORMATION STORAGE
Information Patent Application
High-density metal capacitor using dual-damascene copper interconnect
- Publication number 20050161765
- Publication date Jul 28, 2005
- Broadcom Corporation
- Liming Tsau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High density metal capacitor using via etch stopping layer as field...
- Publication number 20040248372
- Publication date Dec 9, 2004
- Broadcom Corporation
- Liming Tsau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-density metal capacitor using dual-damascene copper interconnect
- Publication number 20040232520
- Publication date Nov 25, 2004
- Liming Tsau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for one-time programmed memory through direct-tun...
- Publication number 20040212037
- Publication date Oct 28, 2004
- Broadcom Corporation
- Vincent Chen
- G11 - INFORMATION STORAGE

Liming Tsau

Person

Patents Grantslast 30 patents

Semiconductor product with edge integrity detection structure

Cantilevered power planes to provide a return current path for high...

Integrated circuit package with serpentine conductor and method of...

Photonics integration in semiconductor packages

Redistribution metal and under bump metal interconnect structures a...

Die edge crack and delamination detection

Redistribution metal and under bump metal interconnect structures a...

Integrated circuit with die edge assurance structure

Semiconductor die with fuse window and a monitoring window over a s...

Metal-insulator-metal (MIM) capacitor

High-density metal capacitor using dual-damascene copper interconnect

High density metal capacitor using via etch stopping layer as field...

System and method for one-time programmed memory through direct-tun...

System and method for one-time programmed memory through direct-tun...

System and method for one-time programmed memory through direct-tun...

Metal bond pad for integrated circuits allowing improved probing ab...

System and method to screen defect related reliability failures in...

High-density metal capacitor using dual-damascene copper interconnect

High density metal capacitor using dual-damascene copper interconnect

High density metal capacitor using via etch stopping layer as field...

Dual-damascene interconnect structures and methods of fabricating same

Patents Applicationslast 30 patents

CANTILEVERED POWER PLANES TO PROVIDE A RETURN CURRENT PATH FOR HIGH...

INTEGRATED CIRCUIT PACKAGE WITH SERPENTINE CONDUCTOR AND METHOD OF...

Photonics Integration in Semiconductor Packages

Substrate with Differing Dielectric Constants

Microfluidic Channels for Cooling Hybrid Bonded Interfaces

Edge Seal for Bonded Stacks of Different Size Semiconductor Devices

Elastomer Interconnection Substrate Layer

Semiconductor Package Interconnection Structure

Semiconductor Package with Side Wall Interconnection

Integrated Antennas on Side Wall of 3D Stacked Die

Mixed Dielectric Materials for Improving Signal Integrity of Integr...

3D Packaging Heterogeneous Area Array Interconnections

Photonics Integration in Semiconductor Packages

Cantilevered Power Planes to Provide a Return Current Path for High...

Multilayer Cores, Variable Width Vias, and Offset Vias

SEMICONDUCTOR PRODUCT WITH EDGE INTEGRITY DETECTION STRUCTURE

INTEGRATED CIRCUIT PACKAGE WITH SERPENTINE CONDUCTOR AND METHOD OF...

REDISTRIBUTION METAL AND UNDER BUMP METAL INTERCONNECT STRUCTURES A...

REDISTRIBUTION METAL AND UNDER BUMP METAL INTERCONNECT STRUCTURES A...

DIE EDGE CRACK AND DELAMINATION DETECTION

Integrated Circuit with Die Edge Assurance Structure

Method for monitoring fuse integrity in a semiconductor die and rel...

High voltage transistor

Metal-insulator-metal (MIM) capacitor

Metal bond pad for integrated circuits allowing improved probing ab...

System and method for one-time programmed memory through direct-tun...

High-density metal capacitor using dual-damascene copper interconnect

High density metal capacitor using via etch stopping layer as field...

High-density metal capacitor using dual-damascene copper interconnect

System and method for one-time programmed memory through direct-tun...