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Linda J. Mayer
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Denville, NJ, US
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last 30 patents
Information
Patent Grant
High speed copper electroplating process and bath therefor
Patent number
4,555,315
Issue date
Nov 26, 1985
OMI International Corporation
Stephen C. Barbieri
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Bath and process for high speed nickel electroplating
Patent number
4,411,744
Issue date
Oct 25, 1983
Occidental Chemical Corporation
Donald R. Rosegren
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Process for high speed nickel and gold electroplate system and arti...
Patent number
4,411,965
Issue date
Oct 25, 1983
Occidental Chemical Corporation
Donald R. Rosegren
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Process for the electrodeposition of palladium
Patent number
4,401,527
Issue date
Aug 30, 1983
Occidental Chemical Corporation
Robert Duva
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Process and composition for the electrodeposition of tin and tin al...
Patent number
4,381,228
Issue date
Apr 26, 1983
Occidental Chemical Corporation
Robert J. Teichmann
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Electroplating tin and tin alloys and baths therefor
Patent number
4,347,107
Issue date
Aug 31, 1982
Hooker Chemicals & Plastics Corp.
Robert J. Teichmann
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Electrodeposition of bright copper
Patent number
4,336,114
Issue date
Jun 22, 1982
Hooker Chemicals & Plastics Corp.
Linda J. Mayer
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR