Ling-Yi CHUANG

Person

Hefei, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Packaging method and packaging structure thereof
- Patent number 12,040,298
- Issue date Jul 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,984,417
- Issue date May 14, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming same
- Patent number 11,973,045
- Issue date Apr 30, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,876,064
- Issue date Jan 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,855,032
- Issue date Dec 26, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating copper pillar bump structure with solder supp...
- Patent number 11,798,885
- Issue date Oct 24, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer stacking method and wafer stacking structure
- Patent number 11,545,468
- Issue date Jan 3, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,488,917
- Issue date Nov 1, 2022
- GHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer stacking method and wafer stacking structure
- Patent number 11,348,873
- Issue date May 31, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, memory device, semiconductor device and me...
- Patent number 11,282,789
- Issue date Mar 22, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240339423
- Publication date Oct 10, 2024
- CXMT Corporation
- LING-YI CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SAME
- Publication number 20240055325
- Publication date Feb 15, 2024
- Changxin Memory Technologies, Inc.
- Kaimin LV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING SEMICONDUC...
- Publication number 20240055408
- Publication date Feb 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Kaimin LV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240055420
- Publication date Feb 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Kaimin LV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUC...
- Publication number 20240057350
- Publication date Feb 15, 2024
- Changxin Memory Technologies, Inc.
- LING-YI CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240057349
- Publication date Feb 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- LING-YI CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, METHOD FOR MANUFACTURING SEMICONDUCTOR STR...
- Publication number 20240055399
- Publication date Feb 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Kaimin LV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, METHOD FOR MANUFACTURING SEMICONDUCTOR STR...
- Publication number 20240057351
- Publication date Feb 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- LING-YI CHUANG
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240057353
- Publication date Feb 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- LING-YI CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240055333
- Publication date Feb 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- LING-YI CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DEVICE
- Publication number 20240057352
- Publication date Feb 15, 2024
- ChangXin Memory Technologies, Inc.
- LING-YI CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR MEMORY
- Publication number 20230413539
- Publication date Dec 21, 2023
- Changxin Memory Technologies, Inc.
- Ling-Yi CHUANG
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20230352317
- Publication date Nov 2, 2023
- LING-YI CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER WARPAGE ADJUSTMENT STRUCTURE AND METHOD FOR MANUFACTURING THE...
- Publication number 20230343667
- Publication date Oct 26, 2023
- CHANGXING MEMORY TECHNOLOGIES, INC.
- LING-YI CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20230230945
- Publication date Jul 20, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING SAME
- Publication number 20230230959
- Publication date Jul 20, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR...
- Publication number 20230223264
- Publication date Jul 13, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND SEMICONDUCTOR STRUCTURE
- Publication number 20230154867
- Publication date May 18, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING SAME
- Publication number 20230017846
- Publication date Jan 19, 2023
- Changxin Memory Technologies, Inc.
- Ling-Yi CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20230011266
- Publication date Jan 12, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE
- Publication number 20230009114
- Publication date Jan 12, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD AND PACKAGING STRUCTURE THEREOF
- Publication number 20230010585
- Publication date Jan 12, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230005866
- Publication date Jan 5, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20230005867
- Publication date Jan 5, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230005849
- Publication date Jan 5, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20230005868
- Publication date Jan 5, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SAME
- Publication number 20220415784
- Publication date Dec 29, 2022
- Changxin Memory Technologies, Inc.
- Ling-Yi CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure And Manufacturing Method Thereof
- Publication number 20220148990
- Publication date May 12, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure And Manufacturing Method Thereof
- Publication number 20220115352
- Publication date Apr 14, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MOLDING STRUCTURE, WAFER LEVEL CHIP SCALE PACKAGING STRUCTURE...
- Publication number 20210287917
- Publication date Sep 16, 2021
- Changxin Memory Technologies, Inc.
- Ling-Yi CHUANG
- H01 - BASIC ELECTRIC ELEMENTS

Ling-Yi CHUANG

Person

Patents Grantslast 30 patents

Packaging method and packaging structure thereof

Semiconductor structure and manufacturing method thereof

Semiconductor structure and method for forming same

Semiconductor structure and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Method of fabricating copper pillar bump structure with solder supp...

Wafer stacking method and wafer stacking structure

Semiconductor structure and manufacturing method thereof

Wafer stacking method and wafer stacking structure

Semiconductor structure, memory device, semiconductor device and me...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING SEMICONDUC...

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR

METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUC...

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE, METHOD FOR MANUFACTURING SEMICONDUCTOR STR...

SEMICONDUCTOR STRUCTURE, METHOD FOR MANUFACTURING SEMICONDUCTOR STR...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR MEMORY

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

WAFER WARPAGE ADJUSTMENT STRUCTURE AND METHOD FOR MANUFACTURING THE...

PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR...

CHIP STRUCTURE AND SEMICONDUCTOR STRUCTURE

PACKAGE STRUCTURE AND METHOD FOR FABRICATING SAME

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE

PACKAGING METHOD AND PACKAGING STRUCTURE THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SAME

Semiconductor Structure And Manufacturing Method Thereof

Semiconductor Structure And Manufacturing Method Thereof

CHIP MOLDING STRUCTURE, WAFER LEVEL CHIP SCALE PACKAGING STRUCTURE...