Linhui Yuan

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TORTOLA, VG

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating integrated circuit packaging with etched base
- Patent number 10,424,492
- Issue date Sep 24, 2019
- TWISDEN LTD.
- Loke Chew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit substrate containing photoimageable dielectric m...
- Patent number 10,190,218
- Issue date Jan 29, 2019
- TWISDEN LTD.
- Loke Chew Low
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Integrated Circuit Substrate Containing Photoimageable Dielectric M...
- Publication number 20180209046
- Publication date Jul 26, 2018
- Twisden Ltd.
- Loke Chew Low
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20180197754
- Publication date Jul 12, 2018
- Twisden Ltd.
- Loke Chew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING PIN UP INTERCONNECT
- Publication number 20170323830
- Publication date Nov 9, 2017
- Twisden Ltd.
- Loke Chew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE LAYER INTEGRATED CIRCUIT PACKAGE
- Publication number 20170323826
- Publication date Nov 9, 2017
- Twisden Ltd.
- Loke Chew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING I-SHAPED INTERCONNECT
- Publication number 20170323829
- Publication date Nov 9, 2017
- Twisden Ltd.
- Loke Chew Low
- H01 - BASIC ELECTRIC ELEMENTS