Lior Shiv

Person

Hilleroed, DK

People

Patents Grantslast 30 patents

Information Patent Grant
Opto-electronic device package with a semiconductor-based sub-mount...
- Patent number 8,729,591
- Issue date May 20, 2014
- TSMC Solid State Lighting Ltd.
- Jochen Kuhmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process for package with light emitting device on a sub...
- Patent number 7,732,234
- Issue date Jun 8, 2010
- Hymite A/S
- Christoffer Graae Greisen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of through-wafer electrical interconnections and other st...
- Patent number 7,732,240
- Issue date Jun 8, 2010
- Hymite A/S
- Lior Shiv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of through-wafer electrical interconnections and other st...
- Patent number 7,662,710
- Issue date Feb 16, 2010
- Hymite A/S
- Lior Shiv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a package for a micro component
- Patent number 7,553,695
- Issue date Jun 30, 2009
- Hymite A/S
- Lior Shiv
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Formation of through-wafer electrical interconnections and other st...
- Patent number 7,531,445
- Issue date May 12, 2009
- Hymite A/S
- Lior Shiv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication and use of polished silicon micro-mirrors
- Patent number 7,470,622
- Issue date Dec 30, 2008
- Hymite A/S
- Lior Shiv
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
OPTO-ELECTRONIC DEVICE PACKAGE WITH A SEMICONDUCTOR-BASED SUB-MOUNT...
- Publication number 20100210045
- Publication date Aug 19, 2010
- Hymite A/S
- Jochen F. Kuhmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-BASED SUBMOUNT WITH ELECTRICALLY CONDUCTIVE FEED-THRO...
- Publication number 20100176507
- Publication date Jul 15, 2010
- Hymite A/S
- Lior Shiv
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Formation of Through-Wafer Electrical Interconnections and Other St...
- Publication number 20100015734
- Publication date Jan 21, 2010
- Hymite A/S
- Lior Shiv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation of Through-Wafer Electrical Interconnections and Other St...
- Publication number 20090191704
- Publication date Jul 30, 2009
- Hymite A/S
- Lior Shiv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication Process for Package With Light Emitting Device On A Sub...
- Publication number 20080199982
- Publication date Aug 21, 2008
- Hymite A/S
- Christoffer Graae Greisen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACERS FOR WAFER BONDING
- Publication number 20080164606
- Publication date Jul 10, 2008
- Christoffer Graae Greisen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF THROUGH-WAFER ELECTRICAL INTERCONNECTIONS AND OTHER ST...
- Publication number 20080076195
- Publication date Mar 27, 2008
- Hymite A/S
- Lior Shiv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sealed Package With Glass Window for Optoelectronic Components, and...
- Publication number 20070120041
- Publication date May 31, 2007
- Lior Shiv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication and use of polished silicon micro-mirrors
- Publication number 20060283836
- Publication date Dec 21, 2006
- Lior Shiv
- G02 - OPTICS
Information Patent Application
Thin package for a micro component
- Publication number 20060210234
- Publication date Sep 21, 2006
- Lior Shiv
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microelectromechanical systems (MEMS) devices integrated in a herme...
- Publication number 20050269688
- Publication date Dec 8, 2005
- Lior Shiv
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Person

Patents Grantslast 30 patents

Opto-electronic device package with a semiconductor-based sub-mount...

Fabrication process for package with light emitting device on a sub...

Formation of through-wafer electrical interconnections and other st...

Formation of through-wafer electrical interconnections and other st...

Method of fabricating a package for a micro component

Formation of through-wafer electrical interconnections and other st...

Fabrication and use of polished silicon micro-mirrors

Patents Applicationslast 30 patents

OPTO-ELECTRONIC DEVICE PACKAGE WITH A SEMICONDUCTOR-BASED SUB-MOUNT...

SEMICONDUCTOR-BASED SUBMOUNT WITH ELECTRICALLY CONDUCTIVE FEED-THRO...

Formation of Through-Wafer Electrical Interconnections and Other St...

Formation of Through-Wafer Electrical Interconnections and Other St...

Fabrication Process for Package With Light Emitting Device On A Sub...

SPACERS FOR WAFER BONDING

FORMATION OF THROUGH-WAFER ELECTRICAL INTERCONNECTIONS AND OTHER ST...

Sealed Package With Glass Window for Optoelectronic Components, and...

Fabrication and use of polished silicon micro-mirrors

Thin package for a micro component

Microelectromechanical systems (MEMS) devices integrated in a herme...