Lisa A. Fanti

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Pressure indicating device
- Patent number 8,984,929
- Issue date Mar 24, 2015
- Praxair Technology, Inc.
- Lisa A. Fanti
- G01 - MEASURING TESTING
Information Patent Grant
Method of forming a bond pad on an I/C chip and resulting structure
- Patent number 7,572,726
- Issue date Aug 11, 2009
- International Business Machines Corporation
- Julie C. Biggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
I/C chip suitable for wire bonding
- Patent number 6,995,475
- Issue date Feb 7, 2006
- International Business Machines Corporation
- Julie C. Biggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inhibition of tin oxide formation in lead free interconnect formation
- Patent number 6,900,142
- Issue date May 31, 2005
- International Business Machines Corporation
- Emanual I. Cooper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial seed layer process for forming C4 solder bumps
- Patent number 6,622,907
- Issue date Sep 23, 2003
- International Business Machines Corporation
- Lisa A. Fanti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrochemical etch for high tin solder bumps
- Patent number 6,468,413
- Issue date Oct 22, 2002
- International Business Machines Corporation
- Lisa A. Fanti
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Underfill preform interposer for joining chip to substrate
- Patent number 6,258,627
- Issue date Jul 10, 2001
- International Business Machines Corporation
- Joseph A. Benenati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process improvements for titanium-tungsten etching in the presence...
- Patent number 6,130,170
- Issue date Oct 10, 2000
- International Business Machines Corporation
- Lawrence D. David
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process improvements for titanium-tungsten etching in the presence...
- Patent number 6,015,505
- Issue date Jan 18, 2000
- International Business Machines Corporation
- Lawrence D. David
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for stabilizing organic additives in electroplating of copper
- Patent number 5,935,402
- Issue date Aug 10, 1999
- International Business Machines Corporation
- Lisa A. Fanti
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper anode assembly for stabilizing organic additives in electrop...
- Patent number 5,908,540
- Issue date Jun 1, 1999
- International Business Machines Corporation
- Lisa A. Fanti
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Dry film resist removal in the presence of electroplated C4's
- Patent number 5,904,156
- Issue date May 18, 1999
- International Business Machines Corporation
- Gerald Gerard Advocate
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
PRESSURE INDICATING DEVICE
- Publication number 20140165706
- Publication date Jun 19, 2014
- Lisa A. Fanti
- G01 - MEASURING TESTING
Information Patent Application
Method of forming a bond pad on an I/C chip and resulting structure
- Publication number 20060081981
- Publication date Apr 20, 2006
- International Business Machines Corporation
- Julie C. Biggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a bond pad on an I/C chip and resulting structure
- Publication number 20050062170
- Publication date Mar 24, 2005
- International Business Machines Corporation
- Julie C. Biggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INHIBITION OF TIN OXIDE FORMATION IN LEAD FREE INTERCONNECT FORMATION
- Publication number 20050026450
- Publication date Feb 3, 2005
- International Business Machines Corporation
- Emanuel I. Cooper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SACRIFICIAL SEED LAYER PROCESS FOR FORMING C4 SOLDER BUMPS
- Publication number 20030155408
- Publication date Aug 21, 2003
- International Business Machines Corporation
- Lisa A. Fanti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of improving uniformity of etching of a film on an article
- Publication number 20020190028
- Publication date Dec 19, 2002
- International Business Machines Corporation
- Kamalesh K. Srivastava
- H01 - BASIC ELECTRIC ELEMENTS

Lisa A. Fanti

Person

Patents Grantslast 30 patents

Pressure indicating device

Method of forming a bond pad on an I/C chip and resulting structure

I/C chip suitable for wire bonding

Inhibition of tin oxide formation in lead free interconnect formation

Sacrificial seed layer process for forming C4 solder bumps

Electrochemical etch for high tin solder bumps

Underfill preform interposer for joining chip to substrate

Process improvements for titanium-tungsten etching in the presence...

Process improvements for titanium-tungsten etching in the presence...

Process for stabilizing organic additives in electroplating of copper

Copper anode assembly for stabilizing organic additives in electrop...

Dry film resist removal in the presence of electroplated C4's

Patents Applicationslast 30 patents

PRESSURE INDICATING DEVICE

Method of forming a bond pad on an I/C chip and resulting structure

Method of forming a bond pad on an I/C chip and resulting structure

INHIBITION OF TIN OXIDE FORMATION IN LEAD FREE INTERCONNECT FORMATION

SACRIFICIAL SEED LAYER PROCESS FOR FORMING C4 SOLDER BUMPS

Method of improving uniformity of etching of a film on an article