Lisa A. Windover

Person

San Francisco, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Optical via to pass signals through a printed circuit board
- Patent number 7,466,880
- Issue date Dec 16, 2008
- Avago Technologies Fiber IP (Singapore) Pte. Ltd.
- Lisa A. Windover
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical via to pass signals through a printed circuit board
- Patent number 7,263,248
- Issue date Aug 28, 2007
- Avago Technologies Fiber IP (Singapore) Pte. Ltd.
- Lisa A. Windover
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Via placement for layer transitions in flexible circuits with high...
- Patent number 7,223,924
- Issue date May 29, 2007
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Steven Rosenau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for optical transmission of wavelength-encoded...
- Patent number 7,092,641
- Issue date Aug 15, 2006
- Avago Technologies Fiber IP (Singapore) Pte. Ltd.
- Lisa A. Windover
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Low cost optical interconnect for fiber optic system
- Patent number 7,020,362
- Issue date Mar 28, 2006
- Jonathan Simon
- G02 - OPTICS
Information Patent Grant
Method and apparatus to enable adaptive equalization at high bandwi...
- Patent number 6,973,105
- Issue date Dec 6, 2005
- Agilent Technologies, Inc.
- Lisa A. Windover
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Folded flex circuit interconnect having a grid array interface
- Patent number 6,879,032
- Issue date Apr 12, 2005
- Agilent Technologies, Inc.
- Steven A. Rosenau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Array of discretely formed optical signal emitters for multi-channe...
- Patent number 6,870,195
- Issue date Mar 22, 2005
- Agilent Technologies, Inc.
- Brian E. Lemoff
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL VIA TO PASS SIGNALS THROUGH A PRINTED CIRCUIT BOARD
- Publication number 20070258676
- Publication date Nov 8, 2007
- Lisa A. Windover
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Communications system employing single-mode lasers and multimode op...
- Publication number 20060039656
- Publication date Feb 23, 2006
- Lisa A. Windover
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method and system for transforming a display into a mirror
- Publication number 20060022897
- Publication date Feb 2, 2006
- Lisa A. Windover
- G02 - OPTICS
Information Patent Application
Via placement for layer transitions in flexible circuits with high...
- Publication number 20050061545
- Publication date Mar 24, 2005
- Steven Rosenau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optical interconnect system and method of communications over an op...
- Publication number 20050047795
- Publication date Mar 3, 2005
- Lisa A. Windover
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Low cost optical interconnect for fiber optic system
- Publication number 20050031265
- Publication date Feb 10, 2005
- Jonathan Simon
- G02 - OPTICS
Information Patent Application
Folded flex circuit interconnect having a grid array interface
- Publication number 20050012199
- Publication date Jan 20, 2005
- Steven A. Rosenau
- G02 - OPTICS
Information Patent Application
Method and apparatus to enable adaptive equalization at high bandwi...
- Publication number 20040184492
- Publication date Sep 23, 2004
- Lisa A. Windover
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Array of discretely formed optical signal emitters for multi-channe...
- Publication number 20040165845
- Publication date Aug 26, 2004
- Brian E. Lemoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical via to pass signals through a printed circuit board
- Publication number 20040156576
- Publication date Aug 12, 2004
- Lisa A. Windover
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Lisa A. Windover

Person

Patents Grantslast 30 patents

Optical via to pass signals through a printed circuit board

Optical via to pass signals through a printed circuit board

Via placement for layer transitions in flexible circuits with high...

Method and apparatus for optical transmission of wavelength-encoded...

Low cost optical interconnect for fiber optic system

Method and apparatus to enable adaptive equalization at high bandwi...

Folded flex circuit interconnect having a grid array interface

Array of discretely formed optical signal emitters for multi-channe...

Patents Applicationslast 30 patents

OPTICAL VIA TO PASS SIGNALS THROUGH A PRINTED CIRCUIT BOARD

Communications system employing single-mode lasers and multimode op...

Method and system for transforming a display into a mirror

Via placement for layer transitions in flexible circuits with high...

Optical interconnect system and method of communications over an op...

Low cost optical interconnect for fiber optic system

Folded flex circuit interconnect having a grid array interface

Method and apparatus to enable adaptive equalization at high bandwi...

Array of discretely formed optical signal emitters for multi-channe...

Optical via to pass signals through a printed circuit board