Liu Wuping

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for fabricating integrated circuits having device contacts
- Patent number 9,443,761
- Issue date Sep 13, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Wei Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit system employing low-k dielectrics and method of...
- Patent number 8,358,007
- Issue date Jan 22, 2013
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Dong Kyun Sohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit hard mask processing system
- Patent number 8,018,061
- Issue date Sep 13, 2011
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Wuping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlled low-k via etch for Cu interconnections
- Patent number 7,906,426
- Issue date Mar 15, 2011
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Wuping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method to prevent charge damage from e-beam curing pr...
- Patent number 7,678,586
- Issue date Mar 16, 2010
- Chartered Semiconductor Manufacturing, Ltd.
- Huang Liu
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Integrated circuit manufacturing method using hard mask
- Patent number 7,615,484
- Issue date Nov 10, 2009
- Chartered Semiconductor Manufacturing Ltd.
- Wuping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protruded contact and insertion of inter-layer-dielectric material...
- Patent number 7,601,607
- Issue date Oct 13, 2009
- Chartered Semiconductor Manufacturing, Ltd.
- Wuping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to fabricate aligned dual damascene openings
- Patent number 7,372,156
- Issue date May 13, 2008
- Chartered Semiconductor Manufacturing Ltd.
- Yeow Kheng Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal barrier cap fabrication by polymer lift-off
- Patent number 7,323,408
- Issue date Jan 29, 2008
- Chartered Semiconductor Manufacturing Ltd.
- Beichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a bond pad structure
- Patent number 7,276,797
- Issue date Oct 2, 2007
- Chartered Semiconductor Manufacturing Ltd.
- Zhang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabrication of a die oxide ring
- Patent number 7,276,440
- Issue date Oct 2, 2007
- Chartered Semiconductor Manufacturing Ltd.
- Fan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-patterning of photo-active dielectric materials for interconne...
- Patent number 7,256,136
- Issue date Aug 14, 2007
- Chartered Semiconductor Manufacturing Ltd.
- Wuping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal barrier cap fabrication by polymer lift-off
- Patent number 7,153,766
- Issue date Dec 26, 2006
- Chartered Semiconductor Manufacturing Ltd.
- Beichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-patterning of photo-active dielectric materials for interconne...
- Patent number 7,012,022
- Issue date Mar 14, 2006
- Chartered Semiconductor Manufacturing Ltd.
- Wuping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a bond pad structure
- Patent number 6,998,335
- Issue date Feb 14, 2006
- Chartered Semiconductor Manufacturing, Ltd.
- Zhang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with simultaneous fabrication of dual damascene...
- Patent number 6,995,087
- Issue date Feb 7, 2006
- Chartered Semiconductor Manufacturing Ltd.
- Wuping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to fabricate aligned dual damascene openings
- Patent number 6,967,156
- Issue date Nov 22, 2005
- Chartered Semiconductor Manufacturing Ltd.
- Yeow Kheng Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUITS HAVING DEVICE CONTACTS AND METHODS FOR FABRICAT...
- Publication number 20160035623
- Publication date Feb 4, 2016
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Wei Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM EMPLOYING LOW-K DIELECTRICS AND METHOD OF...
- Publication number 20100314763
- Publication date Dec 16, 2010
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Dong Kyun Sohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE INTERCONNECT INTEGRATION
- Publication number 20100109155
- Publication date May 6, 2010
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Huang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HARD MASK PROCESSING SYSTEM
- Publication number 20100013104
- Publication date Jan 21, 2010
- Chartered Semiconductor Manufacturing LTD.
- Wuping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HARD MASK PROCESSING SYSTEM
- Publication number 20080265409
- Publication date Oct 30, 2008
- Chartered Semiconductor Manufacturing LTD.
- Wuping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of controlled low-k via etch for Cu interconnections
- Publication number 20080258308
- Publication date Oct 23, 2008
- Wuping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM WITH CARBON ENHANCEMENT
- Publication number 20080230907
- Publication date Sep 25, 2008
- Chartered Semiconductor Manufacturing LTD.
- Wuping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protruded contact and insertion of inter-layer-dielectric material...
- Publication number 20070264820
- Publication date Nov 15, 2007
- Chartered Semiconductor Manufacturing Ltd.
- Wuping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method to prevent charge damage from e-beam curing pr...
- Publication number 20070134941
- Publication date Jun 14, 2007
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Huang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-patterning of photo-active dielectric materials for interconne...
- Publication number 20060128156
- Publication date Jun 15, 2006
- Chartered Semiconductor Manufacturing Ltd.
- Wuping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal barrier cap fabrication by polymer lift-off
- Publication number 20060088995
- Publication date Apr 27, 2006
- Chartered Semiconductor Manufacturing Ltd.
- Beichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for fabricating a bond pad structure
- Publication number 20060071350
- Publication date Apr 6, 2006
- Zhang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to fabricate aligned dual damacene openings
- Publication number 20060003573
- Publication date Jan 5, 2006
- Chartered Semiconductor Manufacturing Ltd.
- Yeow Kheng Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier metal cap structure on copper lines and vias
- Publication number 20050191851
- Publication date Sep 1, 2005
- Chartered Semiconductor Manufacturing Ltd.
- Wuping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabrication of a die oxide ring
- Publication number 20050127495
- Publication date Jun 16, 2005
- Chartered Semiconductor Manufacturing Ltd.
- Fan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for fabricating a bond pad structure
- Publication number 20050127530
- Publication date Jun 16, 2005
- Zhang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-patterning of photo-active dielectric materials for interconne...
- Publication number 20050093158
- Publication date May 5, 2005
- Chartered Semiconductor Manufacturing Ltd.
- Wuping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to fabricate aligned dual damascene openings
- Publication number 20050090095
- Publication date Apr 28, 2005
- Chartered Semiconductor Manufacturing Ltd.
- Yeow Kheng Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal barrier cap fabrication by polymer lift-off
- Publication number 20040137709
- Publication date Jul 15, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Beichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit with simultaneous fabrication of dual damascene...
- Publication number 20040121585
- Publication date Jun 24, 2004
- Chartered Semiconductor Manufacturing LTD.
- Wuping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier metal cap structure on copper lines and vias
- Publication number 20040048468
- Publication date Mar 11, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Wuping Liu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Methods for fabricating integrated circuits having device contacts

Integrated circuit system employing low-k dielectrics and method of...

Integrated circuit hard mask processing system

Method of controlled low-k via etch for Cu interconnections

Structure and method to prevent charge damage from e-beam curing pr...

Integrated circuit manufacturing method using hard mask

Protruded contact and insertion of inter-layer-dielectric material...

Method to fabricate aligned dual damascene openings

Metal barrier cap fabrication by polymer lift-off

Structure and method for fabricating a bond pad structure

Method of fabrication of a die oxide ring

Self-patterning of photo-active dielectric materials for interconne...

Metal barrier cap fabrication by polymer lift-off

Self-patterning of photo-active dielectric materials for interconne...

Structure and method for fabricating a bond pad structure

Integrated circuit with simultaneous fabrication of dual damascene...

Method to fabricate aligned dual damascene openings

Patents Applicationslast 30 patents

INTEGRATED CIRCUITS HAVING DEVICE CONTACTS AND METHODS FOR FABRICAT...

INTEGRATED CIRCUIT SYSTEM EMPLOYING LOW-K DIELECTRICS AND METHOD OF...

RELIABLE INTERCONNECT INTEGRATION

INTEGRATED CIRCUIT HARD MASK PROCESSING SYSTEM

INTEGRATED CIRCUIT HARD MASK PROCESSING SYSTEM

Method of controlled low-k via etch for Cu interconnections

INTEGRATED CIRCUIT SYSTEM WITH CARBON ENHANCEMENT

Protruded contact and insertion of inter-layer-dielectric material...

Structure and method to prevent charge damage from e-beam curing pr...

Self-patterning of photo-active dielectric materials for interconne...

Metal barrier cap fabrication by polymer lift-off

Structure and method for fabricating a bond pad structure

Method to fabricate aligned dual damacene openings

Barrier metal cap structure on copper lines and vias

Method of fabrication of a die oxide ring

Structure and method for fabricating a bond pad structure

Self-patterning of photo-active dielectric materials for interconne...

Method to fabricate aligned dual damascene openings

Metal barrier cap fabrication by polymer lift-off

Integrated circuit with simultaneous fabrication of dual damascene...

Barrier metal cap structure on copper lines and vias