Loic Pierre Louis Renard

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Optical sensor package including a cavity formed in an image sensor...
- Patent number 10,749,067
- Issue date Aug 18, 2020
- STMicroelectronics Pte Ltd
- Loic Pierre Louis Renard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensor package including a cavity formed in an image sensor...
- Patent number 10,347,786
- Issue date Jul 9, 2019
- STMicroelectronics Pte Ltd
- Loic Pierre Louis Renard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensor package including a cavity formed in an image sensor...
- Patent number 9,911,890
- Issue date Mar 6, 2018
- STMicroelectronics Pte Ltd
- Loic Pierre Louis Renard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile camera module with image compensation
- Patent number 9,723,186
- Issue date Aug 1, 2017
- STMicroelectronics Pte Ltd
- Loic Pierre Louis Renard
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
POWER PACKAGE WITH COPPER PLATING AND MOLDING STRUCTURE
- Publication number 20240030115
- Publication date Jan 25, 2024
- STMicroelectronics Pte Ltd
- Loic Pierre Louis RENARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL INTEGRATED CIRCUIT SENSOR PACKAGE USING A STACKED CONFIGURA...
- Publication number 20220368100
- Publication date Nov 17, 2022
- STMicroelectronics Pte Ltd
- Loic Pierre Louis RENARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE INCLUDING A CAVITY FORMED IN AN IMAGE SENSOR...
- Publication number 20190288155
- Publication date Sep 19, 2019
- STMicroelectronics Pte Ltd
- Loic Pierre Louis RENARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE INCLUDING A CAVITY FORMED IN AN IMAGE SENSOR...
- Publication number 20180151772
- Publication date May 31, 2018
- STMicroelectronics Pte Ltd
- Loic Pierre Louis RENARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE INCLUDING A CAVITY FORMED IN AN IMAGE SENSOR...
- Publication number 20180006182
- Publication date Jan 4, 2018
- STMicroelectronics Pte Ltd
- Loic Pierre Louis RENARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH A GROUNDED ELECTRICALLY CONDUC...
- Publication number 20170263565
- Publication date Sep 14, 2017
- STMicroelectronics Pte Ltd
- Loic Pierre Louis RENARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR DEVICE INCLUDING BLACKENED TARNISHABLE BOND W...
- Publication number 20160104805
- Publication date Apr 14, 2016
- STMicroelectronics Pte Ltd
- Loic Pierre Louis Renard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE CAMERA MODULE WITH IMAGE COMPENSATION
- Publication number 20150237245
- Publication date Aug 20, 2015
- STMicroelectronics Pte Ltd
- Loic Pierre Louis Renard
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Loic Pierre Louis Renard

Person

Patents Grantslast 30 patents

Optical sensor package including a cavity formed in an image sensor...

Optical sensor package including a cavity formed in an image sensor...

Optical sensor package including a cavity formed in an image sensor...

Low profile camera module with image compensation

Patents Applicationslast 30 patents

POWER PACKAGE WITH COPPER PLATING AND MOLDING STRUCTURE

OPTICAL INTEGRATED CIRCUIT SENSOR PACKAGE USING A STACKED CONFIGURA...

OPTICAL SENSOR PACKAGE INCLUDING A CAVITY FORMED IN AN IMAGE SENSOR...

OPTICAL SENSOR PACKAGE INCLUDING A CAVITY FORMED IN AN IMAGE SENSOR...

OPTICAL SENSOR PACKAGE INCLUDING A CAVITY FORMED IN AN IMAGE SENSOR...

INTEGRATED CIRCUIT (IC) PACKAGE WITH A GROUNDED ELECTRICALLY CONDUC...

OPTICAL SEMICONDUCTOR DEVICE INCLUDING BLACKENED TARNISHABLE BOND W...

LOW PROFILE CAMERA MODULE WITH IMAGE COMPENSATION