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Santa Clara, CA, US
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Patents Grants
last 30 patents
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Patent Grant
Wafer-level packaging using wire bond wires in place of a redistrib...
Patent number
10,008,469
Issue date
Jun 26, 2018
Invensas Corporation
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out wafer-level packaging using metal foil lamination
Patent number
9,847,238
Issue date
Dec 19, 2017
Invensas Corporation
Xuan Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out wafer-level packaging using metal foil lamination
Patent number
9,646,946
Issue date
May 9, 2017
Invensas Corporation
Xuan Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level packages with mechanically decoupled fan-in and fan-out...
Patent number
9,543,277
Issue date
Jan 10, 2017
Invensas Corporation
Bongsub Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer-level packaging using wire bond wires in place of a redistrib...
Patent number
9,502,372
Issue date
Nov 22, 2016
Invensas Corporation
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Fan-Out Wafer-Level Packaging Using Metal Foil Lamination
Publication number
20170170031
Publication date
Jun 15, 2017
Invensas Corporation
Xuan Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT WAFER-LEVEL PACKAGING USING METAL FOIL LAMINATION
Publication number
20170103957
Publication date
Apr 13, 2017
Invensas Corporation
Xuan Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER-LEVEL PACKAGING USING WIRE BOND WIRES IN PLACE OF A REDISTRIB...
Publication number
20170069591
Publication date
Mar 9, 2017
Invensas Corporation
Rajesh KATKAR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER-LEVEL PACKAGING USING WIRE BOND WIRES IN PLACE OF A REDISTRIB...
Publication number
20160322326
Publication date
Nov 3, 2016
Invensas Corporation
Rajesh KATKAR
H01 - BASIC ELECTRIC ELEMENTS