Loreto Cantillep

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Stacked die assembly having reduced stress electrical interconnects
- Patent number 8,912,661
- Issue date Dec 16, 2014
- Invensas Corporation
- Scott McGrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically interconnected stacked die assemblies
- Patent number 8,723,332
- Issue date May 13, 2014
- Invensas Corporation
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically interconnected stacked die assemblies
- Patent number 8,629,543
- Issue date Jan 14, 2014
- Invensas Corporation
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED DIE ASSEMBLY HAVING REDUCED STRESS ELECTRICAL INTERCONNECTS
- Publication number 20110272825
- Publication date Nov 10, 2011
- Vertical Circuits, Inc.
- Scott McGrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically Interconnected Stacked Die Assemblies
- Publication number 20110037159
- Publication date Feb 17, 2011
- Vertical Circuits, Inc.
- Simon J.S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY INTERCONNECTED STACKED DIE ASSEMBLIES
- Publication number 20080303131
- Publication date Dec 11, 2008
- Vertical Circuits, Inc.
- Simon J.S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS