Louis Lu-Chen Hsu

Person

Fishkill, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Forming semiconductor chip connections
- Patent number 8,236,610
- Issue date Aug 7, 2012
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip-stack with fuse-type through silicon via
- Patent number 8,211,756
- Issue date Jul 3, 2012
- International Business Machines Corporation
- Kai Di Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active inductor for ASIC application
- Patent number 8,115,575
- Issue date Feb 14, 2012
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Thermoelectric 3D cooling
- Patent number 8,030,113
- Issue date Oct 4, 2011
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Structures incorporating semiconductor device structures with reduc...
- Patent number 7,984,408
- Issue date Jul 19, 2011
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures incorporating interconnect structures with improved elec...
- Patent number 7,984,409
- Issue date Jul 19, 2011
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact forming method and related semiconductor device
- Patent number 7,968,949
- Issue date Jun 28, 2011
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric material with a reduced dielectric constant and methods...
- Patent number 7,948,084
- Issue date May 24, 2011
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for making coplanar isolated regions of differ...
- Patent number 7,947,566
- Issue date May 24, 2011
- International Business Machines Corporation
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable through silicon via
- Patent number 7,930,664
- Issue date Apr 19, 2011
- International Business Machines Corporation
- Kai Di Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor FinFET structures with encapsulated gate electrodes a...
- Patent number 7,915,682
- Issue date Mar 29, 2011
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leakage current mitigation in a semiconductor device
- Patent number 7,911,263
- Issue date Mar 22, 2011
- International Business Machines Corporation
- Jong-Ru Guo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device structures with self-aligned doped regions and...
- Patent number 7,898,014
- Issue date Mar 1, 2011
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric 3D cooling
- Patent number 7,893,529
- Issue date Feb 22, 2011
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Hybrid oriented substrates and crystal imprinting methods for formi...
- Patent number 7,875,960
- Issue date Jan 25, 2011
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional chip-stack synchronization
- Patent number 7,863,960
- Issue date Jan 4, 2011
- International Business Machines Corporation
- Ping-Chuan Wang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Programmable through silicon via
- Patent number 7,839,163
- Issue date Nov 23, 2010
- International Business Machines Corporation
- Kai Di Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure to reduce contact resistance on thin silicon-o...
- Patent number 7,833,873
- Issue date Nov 16, 2010
- International Business Machines Corporation
- Brian J Greene
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip-stack with fuse-type through silicon via
- Patent number 7,816,945
- Issue date Oct 19, 2010
- International Business Machines Corporation
- Kai Di Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for implementing enhanced hand shake protocol in microele...
- Patent number 7,809,340
- Issue date Oct 5, 2010
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Crystal imprinting methods for fabricating substrates with thin act...
- Patent number 7,803,700
- Issue date Sep 28, 2010
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic fuses in semiconductor integrated circuits
- Patent number 7,785,934
- Issue date Aug 31, 2010
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BEOL interconnect structures with simultaneous high-k and low-k die...
- Patent number 7,768,130
- Issue date Aug 3, 2010
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for fabricating double-sided SOI wafer scale pack...
- Patent number 7,736,949
- Issue date Jun 15, 2010
- International Business Machines Corporation
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structures for bipolar junction transistors an...
- Patent number 7,737,530
- Issue date Jun 15, 2010
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric material with reduced dielectric constant and methods of...
- Patent number 7,732,322
- Issue date Jun 8, 2010
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for producing multiple size interconnections
- Patent number 7,714,452
- Issue date May 11, 2010
- International Business Machines Corporation
- Lawrence A. Clevenger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure to reduce contact resistance on thin silicon-o...
- Patent number 7,687,865
- Issue date Mar 30, 2010
- International Business Machines Corporation
- Brian J Greene
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making a MCSFET
- Patent number 7,682,913
- Issue date Mar 23, 2010
- International Business Machines Corporation
- Xu Ouyang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with improved electromigration resistance a...
- Patent number 7,666,781
- Issue date Feb 23, 2010
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FINFET WITH REDUCED GATE TO FIN OVERLAY SENSITIVITY
- Publication number 20120146112
- Publication date Jun 14, 2012
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTORS WITH LOW K SIDEWALL SPACERS AND METHODS OF...
- Publication number 20120126342
- Publication date May 24, 2012
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP STACK HAVING ENCAPSULATED CHIP-IN-CHIP
- Publication number 20110175215
- Publication date Jul 21, 2011
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermoelectric 3D Cooling
- Publication number 20110104846
- Publication date May 5, 2011
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROGRAMMABLE THROUGH SILICON VIA
- Publication number 20110034021
- Publication date Feb 10, 2011
- International Business Machines Corporation
- Kai Di Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leakage Current Mitigation in a Semiconductor Device
- Publication number 20100327958
- Publication date Dec 30, 2010
- Jong-Ru Guo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Forming Semiconductor Chip Connections
- Publication number 20100301475
- Publication date Dec 2, 2010
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CHIP-STACK SYNCHRONIZATION
- Publication number 20100277210
- Publication date Nov 4, 2010
- International Business Machines Corporation
- Ping-Chuan Wang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
3D CHIP-STACK WITH FUSE-TYPE THROUGH SILICON VIA
- Publication number 20100261318
- Publication date Oct 14, 2010
- International Business Machines Corporation
- Kai Di Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROGRAMMABLE THROUGH SILICON VIA
- Publication number 20100182040
- Publication date Jul 22, 2010
- International Business Machines Corporation
- Kai Di Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP-STACK WITH FUSE-TYPE THROUGH SILICON VIA
- Publication number 20100182041
- Publication date Jul 22, 2010
- International Business Machines Corporation
- Kai Di Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC 3D COOLING
- Publication number 20100176506
- Publication date Jul 15, 2010
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE INDUCTOR FOR ASIC APPLICATION
- Publication number 20100039191
- Publication date Feb 18, 2010
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD AND APPARATUS FOR MAKING COPLANAR ISOLATED REGIONS OF DIFFER...
- Publication number 20090121312
- Publication date May 14, 2009
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Design Structure for an Automatic Driver/Transmission Line/Receiver...
- Publication number 20090115448
- Publication date May 7, 2009
- International Business Machines Corporation
- Wagdi W. Abadeer
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MEMORY ARRAY PERIPHERAL STRUCTURES AND USE
- Publication number 20090073796
- Publication date Mar 19, 2009
- International Business Machines Corporation
- Ishtiaq Ahsan
- G11 - INFORMATION STORAGE
Information Patent Application
Hybrid Fully-Silicided (FUSI)/Partially-Silicided (PASI) Structures
- Publication number 20090007037
- Publication date Jan 1, 2009
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Fully-Silicided (FUSI)/Partially-Silicided (PASI) Structures
- Publication number 20090001477
- Publication date Jan 1, 2009
- Louis Lu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fin-Local Interconnect Structure
- Publication number 20090001426
- Publication date Jan 1, 2009
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fin-Local Interconnect Structure
- Publication number 20090007036
- Publication date Jan 1, 2009
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR FABRICATING DOUBLE-SIDED SOI WAFER SCALE PACK...
- Publication number 20080318360
- Publication date Dec 25, 2008
- HOWARD HAO CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST STRUCTURES AND METHODOLOGY FOR DETECTING HOT DEFECTS
- Publication number 20080286888
- Publication date Nov 20, 2008
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID ORIENTED SUBSTRATES AND CRYSTAL IMPRINTING METHODS FOR FORMI...
- Publication number 20080283920
- Publication date Nov 20, 2008
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE TO REDUCE CONTACT RESISTANCE ON THIN SILICON-O...
- Publication number 20080272412
- Publication date Nov 6, 2008
- International Business Machines Corporation
- Brian J. Greene
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE TO REDUCE CONTACT RESISTANCE ON THIN SILICON-O...
- Publication number 20080274597
- Publication date Nov 6, 2008
- International Business Machines Corporation
- Brian J. Greene
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC FUSE WITH CONFORMAL FUSE ELEMENT FORMED OVER A FREESTAND...
- Publication number 20080258857
- Publication date Oct 23, 2008
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURES FOR BIPOLAR JUNCTION TRANSISTORS AN...
- Publication number 20080224175
- Publication date Sep 18, 2008
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR IMPLEMENTING ENHANCED HAND SHAKE PROTOCOL IN MICROELE...
- Publication number 20080227425
- Publication date Sep 18, 2008
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Systems and Methods for Controlling of Electro-Migration
- Publication number 20080217614
- Publication date Sep 11, 2008
- Hayden Clavie Cranford
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Automatic Driver/Transmission Line/Receiver Impedance Matching Circ...
- Publication number 20080218290
- Publication date Sep 11, 2008
- International Business Machines Corporation
- Wagdi W. Abadeer
- H03 - BASIC ELECTRONIC CIRCUITRY

Louis Lu-Chen Hsu

Person

Patents Grantslast 30 patents

Forming semiconductor chip connections

3D chip-stack with fuse-type through silicon via

Active inductor for ASIC application

Thermoelectric 3D cooling

Structures incorporating semiconductor device structures with reduc...

Structures incorporating interconnect structures with improved elec...

Contact forming method and related semiconductor device

Dielectric material with a reduced dielectric constant and methods...

Method and apparatus for making coplanar isolated regions of differ...

Programmable through silicon via

Semiconductor FinFET structures with encapsulated gate electrodes a...

Leakage current mitigation in a semiconductor device

Semiconductor device structures with self-aligned doped regions and...

Thermoelectric 3D cooling

Hybrid oriented substrates and crystal imprinting methods for formi...

Three-dimensional chip-stack synchronization

Programmable through silicon via

Method and structure to reduce contact resistance on thin silicon-o...

3D chip-stack with fuse-type through silicon via

Apparatus for implementing enhanced hand shake protocol in microele...

Crystal imprinting methods for fabricating substrates with thin act...

Electronic fuses in semiconductor integrated circuits

BEOL interconnect structures with simultaneous high-k and low-k die...

Device and method for fabricating double-sided SOI wafer scale pack...

Semiconductor device structures for bipolar junction transistors an...

Dielectric material with reduced dielectric constant and methods of...

Structure and method for producing multiple size interconnections

Method and structure to reduce contact resistance on thin silicon-o...

Process for making a MCSFET

Interconnect structures with improved electromigration resistance a...

Patents Applicationslast 30 patents

FINFET WITH REDUCED GATE TO FIN OVERLAY SENSITIVITY

FIELD EFFECT TRANSISTORS WITH LOW K SIDEWALL SPACERS AND METHODS OF...

3D CHIP STACK HAVING ENCAPSULATED CHIP-IN-CHIP

Thermoelectric 3D Cooling

PROGRAMMABLE THROUGH SILICON VIA

Leakage Current Mitigation in a Semiconductor Device

Forming Semiconductor Chip Connections

THREE-DIMENSIONAL CHIP-STACK SYNCHRONIZATION

3D CHIP-STACK WITH FUSE-TYPE THROUGH SILICON VIA

PROGRAMMABLE THROUGH SILICON VIA

3D CHIP-STACK WITH FUSE-TYPE THROUGH SILICON VIA

THERMOELECTRIC 3D COOLING

ACTIVE INDUCTOR FOR ASIC APPLICATION

METHOD AND APPARATUS FOR MAKING COPLANAR ISOLATED REGIONS OF DIFFER...

Design Structure for an Automatic Driver/Transmission Line/Receiver...

MEMORY ARRAY PERIPHERAL STRUCTURES AND USE

Hybrid Fully-Silicided (FUSI)/Partially-Silicided (PASI) Structures

Hybrid Fully-Silicided (FUSI)/Partially-Silicided (PASI) Structures

Integrated Fin-Local Interconnect Structure

Integrated Fin-Local Interconnect Structure

DEVICE AND METHOD FOR FABRICATING DOUBLE-SIDED SOI WAFER SCALE PACK...

TEST STRUCTURES AND METHODOLOGY FOR DETECTING HOT DEFECTS

HYBRID ORIENTED SUBSTRATES AND CRYSTAL IMPRINTING METHODS FOR FORMI...

METHOD AND STRUCTURE TO REDUCE CONTACT RESISTANCE ON THIN SILICON-O...

METHOD AND STRUCTURE TO REDUCE CONTACT RESISTANCE ON THIN SILICON-O...

ELECTRONIC FUSE WITH CONFORMAL FUSE ELEMENT FORMED OVER A FREESTAND...

SEMICONDUCTOR DEVICE STRUCTURES FOR BIPOLAR JUNCTION TRANSISTORS AN...

APPARATUS FOR IMPLEMENTING ENHANCED HAND SHAKE PROTOCOL IN MICROELE...

Systems and Methods for Controlling of Electro-Migration

Automatic Driver/Transmission Line/Receiver Impedance Matching Circ...