Louis W. Nicholls

Person

Durham, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 12,191,241
- Issue date Jan 7, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,876,039
- Issue date Jan 16, 2024
- Amkor Technol Singapore Holding Pte. Ltd.
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for increasing the allowable die size in TMV...
- Patent number 11,488,892
- Issue date Nov 1, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Louis W. Nicholls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,362,027
- Issue date Jun 14, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 11,088,064
- Issue date Aug 10, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making semiconductor devices
- Patent number 10,714,408
- Issue date Jul 14, 2020
- Amkor Technology, Inc.
- Louis W. Nicholls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 10,418,318
- Issue date Sep 17, 2019
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for increasing the allowable die size in TMV...
- Patent number 10,347,562
- Issue date Jul 9, 2019
- Amkor Technology, Inc.
- Louis W. Nicholls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 10,224,270
- Issue date Mar 5, 2019
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for increasing the allowable die size in TMV...
- Patent number 9,721,872
- Issue date Aug 1, 2017
- Amkor Technology, Inc.
- Louis W. Nicholls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 9,462,690
- Issue date Oct 4, 2016
- Amkor Technologies, Inc.
- Robert Francis Darveaux
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 8,536,458
- Issue date Sep 17, 2013
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for detecting an error in the placement of a l...
- Patent number 5,864,776
- Issue date Jan 26, 1999
- Mitsubishi Electric America, Inc.
- Waite R. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for controlling plating thickness of a workpiece
- Patent number 5,788,829
- Issue date Aug 4, 1998
- Mitsubishi Semiconductor America, Inc.
- Swati V. Joshi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus using an anode basket for electroplating a wor...
- Patent number 5,776,327
- Issue date Jul 7, 1998
- Mitsubishi Semiconuctor Americe, Inc.
- Robert R. Botts
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Anode basket for controlling plating thickness distribution
- Patent number 5,744,013
- Issue date Apr 28, 1998
- Mitsubishi Semiconductor America, Inc.
- Robert R Botts
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Lead frame dryer
- Patent number 5,737,846
- Issue date Apr 14, 1998
- Mitsubishi Semiconductor America, Inc.
- Waite R. Warren
- F26 - DRYING
Information Patent Grant
System for ultrasonic removal of air bubbles from the surface of an...
- Patent number 5,653,860
- Issue date Aug 5, 1997
- Mitsubishi Semiconductor America, Inc.
- Louis W. Nicholls
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240162131
- Publication date May 16, 2024
- Amkor Technology Singapore Holding Pte. Ltd
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20220319969
- Publication date Oct 6, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE PITCH COPPER PILLAR PACKAGE AND METHOD
- Publication number 20220189866
- Publication date Jun 16, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20210272887
- Publication date Sep 2, 2021
- Amkor Technology Singapore Holding Pte. Ltd
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV...
- Publication number 20210166992
- Publication date Jun 3, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Louis W. Nicholls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE PITCH COPPER PILLAR PACKAGE AND METHOD
- Publication number 20200219802
- Publication date Jul 9, 2020
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV...
- Publication number 20190371706
- Publication date Dec 5, 2019
- Amkor Technology, Inc.
- Louis W. Nicholls
- H01 - BASIC ELECTRIC ELEMENTS

Louis W. Nicholls

Person

Patents Grantslast 30 patents

Fine pitch copper pillar package and method

Semiconductor devices and methods of manufacturing semiconductor de...

Methods and structures for increasing the allowable die size in TMV...

Semiconductor devices and methods of manufacturing semiconductor de...

Fine pitch copper pillar package and method

Semiconductor devices and methods of making semiconductor devices

Fine pitch copper pillar package and method

Methods and structures for increasing the allowable die size in TMV...

Fine pitch copper pillar package and method

Methods and structures for increasing the allowable die size in TMV...

Fine pitch copper pillar package and method

Fine pitch copper pillar package and method

Apparatus and method for detecting an error in the placement of a l...

Method and apparatus for controlling plating thickness of a workpiece

Method and apparatus using an anode basket for electroplating a wor...

Anode basket for controlling plating thickness distribution

Lead frame dryer

System for ultrasonic removal of air bubbles from the surface of an...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

FINE PITCH COPPER PILLAR PACKAGE AND METHOD

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV...

FINE PITCH COPPER PILLAR PACKAGE AND METHOD

METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV...