Lu-Chen Hwan

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Radio frequency identification tag
- Patent number 9,136,585
- Issue date Sep 15, 2015
- Mutual-Pak Technology Co., Ltd.
- Lu-Chen Hwan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light emitting diode and method of the same
- Patent number 9,105,814
- Issue date Aug 11, 2015
- Lu-Chen Hwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package module and method of the same
- Patent number 8,344,500
- Issue date Jan 1, 2013
- Mutual-Pak Technology Co., Ltd.
- Lu-Chen Hwan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Test module for radio frequency identification chips and method of...
- Patent number 8,344,734
- Issue date Jan 1, 2013
- Mutual-Pak Technology Co., Ltd.
- Lu-Chen Hwan
- G01 - MEASURING TESTING
Information Patent Grant
Method for making cable with a conductive bump array, and method fo...
- Patent number 7,999,191
- Issue date Aug 16, 2011
- Mutual Pak Technology Co., Ltd.
- Lu-Chen Hwan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure for integrated circuit device and method of the same
- Patent number 7,943,426
- Issue date May 17, 2011
- Mutual Pak Technology Co., Ltd.
- Lu-Chen Hwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing integrated circuit device having antenna c...
- Patent number 7,886,421
- Issue date Feb 15, 2011
- Mutual Pak Technology Co., Ltd.
- Lu-Chen Hwan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Package structure for integrated circuit device
- Patent number 7,772,698
- Issue date Aug 10, 2010
- Mutual Pak Technology Co., Ltd.
- Lu-Chen Hwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing integrated circuit device having antenna c...
- Patent number 7,698,805
- Issue date Apr 20, 2010
- Mutual Pak Technology Co., Ltd.
- Lu-Chen Hwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method for an electronic element
- Patent number 7,459,345
- Issue date Dec 2, 2008
- Mutual-Pak Technology Co., Ltd.
- Lu-Chen Hwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming wiring on a substrate
- Patent number 7,413,670
- Issue date Aug 19, 2008
- Mutual Pak Technology Co., Ltd.
- Lu-Chen Hwan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making cable with a conductive bump array, and method fo...
- Patent number 7,312,142
- Issue date Dec 25, 2007
- Mutual Pak Technology Co., Ltd.
- Lu-Chen Hwan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer-level package and IC module assembly method for the wafer-lev...
- Patent number 7,273,768
- Issue date Sep 25, 2007
- Mutual-Pak Technology Co. Ltd.
- Lu-Chen Hwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound filled in lead IC packaging product
- Patent number 6,940,183
- Issue date Sep 6, 2005
- Lu-Chen Hwan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT-EMITTING DIODE STRUCTURE
- Publication number 20190348589
- Publication date Nov 14, 2019
- Mutual-Pak Technology Co., Ltd.
- Lu-Chen HWAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ELEMENT AND CHIP PACKAGE
- Publication number 20150171041
- Publication date Jun 18, 2015
- MUTUAL-PAK TECHNOLOGY CO., LTD.
- Po Ching CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RADIO FREQUENCY IDENTIFICATION TAG
- Publication number 20130140368
- Publication date Jun 6, 2013
- MUTUAL-PAK TECHNOLOGY CO., LTD.
- Lu-Chen Hwan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE STRUCTURE FOR INTEGRATED CIRCUIT DEVICE AND METHOD OF THE SAME
- Publication number 20100267204
- Publication date Oct 21, 2010
- MUTUAL PAK TECHNOLOGY CO., LTD.
- Lu-Chen Hwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING INTEGRATED CIRCUIT DEVICE HAVING ANTENNA C...
- Publication number 20100229375
- Publication date Sep 16, 2010
- MUTUAL PAK TECHNOLOGY CO., LTD.
- Lu-Chen Hwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST MODULE FOR RADIO FREQUENCY IDENTIFICATION CHIPS AND METHOD OF...
- Publication number 20100090707
- Publication date Apr 15, 2010
- MUTUAL PAK TECHNOLOGY CO., LTD.
- Lu-Chen Hwan
- G01 - MEASURING TESTING
Information Patent Application
LIGHT EMITTING DIODE AND METHOD OF THE SAME
- Publication number 20100012963
- Publication date Jan 21, 2010
- MUTUAL PAK TECHNOLOGY CO., LTD.
- Lu-Chen Hwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE MODULE AND METHOD OF THE SAME
- Publication number 20090294953
- Publication date Dec 3, 2009
- MUTUAL PAK TECHNOLOGY CO., LTD.
- Lu-Chen Hwan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE FOR INTEGRATED CIRCUIT DEVICE AND METHOD OF THE SAME
- Publication number 20090267230
- Publication date Oct 29, 2009
- MUTUAL PAK TECHNOLOGY CO., LTD.
- Lu-Chen Hwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR INTEGRATED CIRCUIT DEVICE AND METHOD OF THE SAME
- Publication number 20080277785
- Publication date Nov 13, 2008
- MUTUAL PAK TECHNOLOGY CO., LTD.
- Lu-Chen Hwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING INTEGRATED CIRCUIT DEVICE HAVING ANTENNA C...
- Publication number 20080184550
- Publication date Aug 7, 2008
- MUTUAL PAK TECHNOLOGY CO., LTD.
- Lu-Chen Hwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING CABLE WITH A CONDUCTIVE BUMP ARRAY, AND METHOD FO...
- Publication number 20080066945
- Publication date Mar 20, 2008
- MUTUAL PAK TECHNOLOGY CO., LTD.
- Lu-Chen Hwan
- G02 - OPTICS
Information Patent Application
Wafer-level package and IC module assembly method for the wafer-lev...
- Publication number 20070048901
- Publication date Mar 1, 2007
- Lu-Chen Hwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for making cable with a conductive bump array, and method fo...
- Publication number 20060234460
- Publication date Oct 19, 2006
- Lu-Chen Hwan
- G02 - OPTICS
Information Patent Application
Packaging method for an electronic element
- Publication number 20060084191
- Publication date Apr 20, 2006
- Lu-Chen Hwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming wiring on a substrate
- Publication number 20050284841
- Publication date Dec 29, 2005
- Lu-Chen Hwan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Lu-Chen Hwan

Person

Patents Grantslast 30 patents

Radio frequency identification tag

Light emitting diode and method of the same

Integrated circuit package module and method of the same

Test module for radio frequency identification chips and method of...

Method for making cable with a conductive bump array, and method fo...

Package structure for integrated circuit device and method of the same

Method for manufacturing integrated circuit device having antenna c...

Package structure for integrated circuit device

Method for manufacturing integrated circuit device having antenna c...

Packaging method for an electronic element

Method for forming wiring on a substrate

Method for making cable with a conductive bump array, and method fo...

Wafer-level package and IC module assembly method for the wafer-lev...

Compound filled in lead IC packaging product

Patents Applicationslast 30 patents

LIGHT-EMITTING DIODE STRUCTURE

CHIP ELEMENT AND CHIP PACKAGE

RADIO FREQUENCY IDENTIFICATION TAG

PACKAGE STRUCTURE FOR INTEGRATED CIRCUIT DEVICE AND METHOD OF THE SAME

METHOD FOR MANUFACTURING INTEGRATED CIRCUIT DEVICE HAVING ANTENNA C...

TEST MODULE FOR RADIO FREQUENCY IDENTIFICATION CHIPS AND METHOD OF...

LIGHT EMITTING DIODE AND METHOD OF THE SAME

INTEGRATED CIRCUIT PACKAGE MODULE AND METHOD OF THE SAME

PACKAGE STRUCTURE FOR INTEGRATED CIRCUIT DEVICE AND METHOD OF THE SAME

PACKAGE STRUCTURE FOR INTEGRATED CIRCUIT DEVICE AND METHOD OF THE SAME

METHOD FOR MANUFACTURING INTEGRATED CIRCUIT DEVICE HAVING ANTENNA C...

METHOD FOR MAKING CABLE WITH A CONDUCTIVE BUMP ARRAY, AND METHOD FO...

Wafer-level package and IC module assembly method for the wafer-lev...

Method for making cable with a conductive bump array, and method fo...

Packaging method for an electronic element

Method for forming wiring on a substrate