Lu-Ming LAI

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic package structure
- Patent number 12,184,266
- Issue date Dec 31, 2024
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng Tseng
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 12,168,605
- Issue date Dec 17, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsu-Liang Hsiao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical module
- Patent number 12,085,768
- Issue date Sep 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Shih-Chieh Tang
- G02 - OPTICS
Information Patent Grant
Optical module and method of making the same
- Patent number 11,835,363
- Issue date Dec 5, 2023
- Advanced Semiconductor Engineering, Inc.
- Ying-Chung Chen
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device package
- Patent number 11,817,397
- Issue date Nov 14, 2023
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,784,296
- Issue date Oct 10, 2023
- Advanced Semiconductor Engineering, Inc.
- Mei-Yi Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical package structure
- Patent number 11,682,684
- Issue date Jun 20, 2023
- Advanced Semiconductor Engineering, Inc.
- Cheng-Ling Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,588,081
- Issue date Feb 21, 2023
- Advanced Semiconductor Engineering, Inc.
- Hsin-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of manufacturing the same
- Patent number 11,588,470
- Issue date Feb 21, 2023
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng Tseng
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package structures and methods of manufacturing the same
- Patent number 11,565,934
- Issue date Jan 31, 2023
- Advanced Semiconductor Engineering, Inc.
- Yu-Hsuan Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package including reinforced structure
- Patent number 11,562,969
- Issue date Jan 24, 2023
- Advanced Semiconductor Engineering, Inc.
- Yu-Che Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,535,509
- Issue date Dec 27, 2022
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,495,511
- Issue date Nov 8, 2022
- Advanced Semiconductor Engineering, Inc.
- Yu-Che Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 11,437,292
- Issue date Sep 6, 2022
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,427,466
- Issue date Aug 30, 2022
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package structure
- Patent number 11,296,651
- Issue date Apr 5, 2022
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical device and method of manufacturing the same
- Patent number 11,276,797
- Issue date Mar 15, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsiang-Cheng Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 11,276,806
- Issue date Mar 15, 2022
- Advanced Semiconductor Engineering, Inc.
- Yi Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical package
- Patent number 11,276,720
- Issue date Mar 15, 2022
- Advanced Semiconductor Engineering, Inc.
- Shih-Chieh Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module and method of making the same
- Patent number 11,262,197
- Issue date Mar 1, 2022
- Advanced Semiconductor Engineering, Inc.
- Ying-Chung Chen
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,217,499
- Issue date Jan 4, 2022
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,211,536
- Issue date Dec 28, 2021
- Advanced Semiconductor Engineering, Inc.
- Mei-Yi Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 11,174,157
- Issue date Nov 16, 2021
- Advanced Semiconductor Engineering Inc.
- Chi Sheng Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package structure and manufacturing method thereof
- Patent number 11,091,365
- Issue date Aug 17, 2021
- Advanced Semiconductor Engineering, Inc.
- Ching-Han Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Lead frame and method for manufacturing the same
- Patent number 11,088,054
- Issue date Aug 10, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with inner and outer cavities
- Patent number 11,081,413
- Issue date Aug 3, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsin Lin Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,014,806
- Issue date May 25, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Liang Hsiao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor substrate and method of manufacturing the same
- Patent number 10,916,492
- Issue date Feb 9, 2021
- Advanced Semiconductor Engineering, Inc.
- Tsann Huei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device package and method of manufacturing the same
- Patent number 10,862,014
- Issue date Dec 8, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsin-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectromechanical systems package structure
- Patent number 10,841,679
- Issue date Nov 17, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsu-Liang Hsiao
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL MODULE
- Publication number 20240427092
- Publication date Dec 26, 2024
- Advanced Semiconductor Engineering, Inc.
- Shih-Chieh TANG
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE AND METHOD OF MAKING THE SAME
- Publication number 20240102799
- Publication date Mar 28, 2024
- Advanced Semiconductor Engineering, Inc.
- Ying-Chung CHEN
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240038677
- Publication date Feb 1, 2024
- Advanced Semiconductor Engineering, Inc.
- Ying-Chung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE
- Publication number 20230208394
- Publication date Jun 29, 2023
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
OPTICAL MODULE
- Publication number 20230063405
- Publication date Mar 2, 2023
- Advanced Semiconductor Engineering, Inc.
- Shih-Chieh TANG
- G02 - OPTICS
Information Patent Application
BODY-PART TRACKING DEVICE AND BODY-PART TRACKING METHOD
- Publication number 20220404908
- Publication date Dec 22, 2022
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220199550
- Publication date Jun 23, 2022
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE AND METHOD OF MAKING THE SAME
- Publication number 20220187068
- Publication date Jun 16, 2022
- Advanced Semiconductor Engineering, Inc.
- Ying-Chung CHEN
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20220123192
- Publication date Apr 21, 2022
- Advanced Semiconductor Engineering, Inc.
- Mei-Yi WU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICAL PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220115425
- Publication date Apr 14, 2022
- Advanced Semiconductor Engineering, Inc.
- Cheng-Ling HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220068747
- Publication date Mar 3, 2022
- Advanced Semiconductor Engineering, Inc.
- Yu-Che HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210358823
- Publication date Nov 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20210280755
- Publication date Sep 9, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsin-Ying HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20210276860
- Publication date Sep 9, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Liang HSIAO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210257988
- Publication date Aug 19, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210210662
- Publication date Jul 8, 2021
- Advanced Semiconductor Engineering, Inc.
- Yi Wen CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210206628
- Publication date Jul 8, 2021
- Advanced Semiconductor Engineering, Inc.
- Yu-Hsuan TSAI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210183839
- Publication date Jun 17, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsin-Ying HO
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210147219
- Publication date May 20, 2021
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICAL PACKAGE
- Publication number 20210134857
- Publication date May 6, 2021
- Advanced Semiconductor Engineering, Inc.
- Shih-Chieh TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210111083
- Publication date Apr 15, 2021
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210082791
- Publication date Mar 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR PACKAGING THE SAME
- Publication number 20210082835
- Publication date Mar 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Yu-Che HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20210036658
- Publication date Feb 4, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210017018
- Publication date Jan 21, 2021
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200402879
- Publication date Dec 24, 2020
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200328322
- Publication date Oct 15, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsiang-Chen TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20200259058
- Publication date Aug 13, 2020
- Advanced Semiconductor Engineering, Inc.
- Mei-Yi WU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE PACKAGES AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200194328
- Publication date Jun 18, 2020
- Advanced Semiconductor Engineering, Inc.
- Cheng-Ling HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE AND METHOD OF MAKING THE SAME
- Publication number 20200080841
- Publication date Mar 12, 2020
- Advanced Semiconductor Engineering, Inc.
- Ying-Chung CHEN
- G01 - MEASURING TESTING

Lu-Ming LAI

Person

Patents Grantslast 30 patents

Electronic package structure

Semiconductor device package and a method of manufacturing the same

Optical module

Optical module and method of making the same

Semiconductor device package

Semiconductor device package and a method of manufacturing the same

Optical package structure

Semiconductor device package

Semiconductor package structure and method of manufacturing the same

Semiconductor package structures and methods of manufacturing the same

Semiconductor device package including reinforced structure

Semiconductor package structure and method for manufacturing the same

Semiconductor package structure and method for manufacturing the same

Semiconductor package device and method of manufacturing the same

Semiconductor package structure and method for manufacturing the same

Semiconductor package structure

Optical device and method of manufacturing the same

Semiconductor device package and method for manufacturing the same

Optical package

Optical module and method of making the same

Semiconductor package structure and method for manufacturing the same

Semiconductor device package and a method of manufacturing the same

Semiconductor device packages and methods of manufacturing the same

MEMS package structure and manufacturing method thereof

Lead frame and method for manufacturing the same

Semiconductor package with inner and outer cavities

Semiconductor device package and a method of manufacturing the same

Semiconductor substrate and method of manufacturing the same

Optical device package and method of manufacturing the same

Microelectromechanical systems package structure

Patents Applicationslast 30 patents

OPTICAL MODULE

OPTICAL MODULE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC PACKAGE STRUCTURE

OPTICAL MODULE

BODY-PART TRACKING DEVICE AND BODY-PART TRACKING METHOD

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

OPTICAL MODULE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

OPTICAL PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

OPTICAL PACKAGE

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

LEAD FRAME AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR PACKAGING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

DEVICE PACKAGES AND METHOD OF MANUFACTURING THE SAME

OPTICAL MODULE AND METHOD OF MAKING THE SAME