Lu Zhong

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including independent film layer for embedding...
- Patent number 9,773,766
- Issue date Sep 26, 2017
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Ning Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waterfall wire bonding
- Patent number 9,704,797
- Issue date Jul 11, 2017
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Zhong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding and thermal dissipation for semiconductor device
- Patent number 9,337,153
- Issue date May 10, 2016
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Peng Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die laminating device with independent drives
- Patent number 9,331,045
- Issue date May 3, 2016
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Wei Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High yield semiconductor device
- Patent number 9,240,393
- Issue date Jan 19, 2016
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Cheeman Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including alternating stepped semiconductor di...
- Patent number 9,230,942
- Issue date Jan 5, 2016
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Shiv Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extrinsic gettering on semiconductor devices
- Patent number 9,064,836
- Issue date Jun 23, 2015
- SanDisk Semiconductor (Shanghai) Co., Ltd.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BRIDGE STRUCTURE FOR EMBEDDING SEMICONDUCTOR DIE
- Publication number 20170179101
- Publication date Jun 22, 2017
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING COLOR IMAGES ON MEMORY DEVICES AND MEMORY DEVIC...
- Publication number 20160086827
- Publication date Mar 24, 2016
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Peng Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING ALTERNATING STEPPED SEMICONDUCTOR DI...
- Publication number 20150228621
- Publication date Aug 13, 2015
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Shiv Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING INDEPENDENT FILM LAYER FOR EMBEDDING...
- Publication number 20150221624
- Publication date Aug 6, 2015
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Ning Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY COATING ON SUBSTRATE FOR DIE ATTACH
- Publication number 20150214184
- Publication date Jul 30, 2015
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Wei Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE STRUCTURE FOR EMBEDDING SEMICONDUCTOR DIE
- Publication number 20150155247
- Publication date Jun 4, 2015
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE LAMINATING DEVICE WITH INDEPENDENT DRIVES
- Publication number 20150115479
- Publication date Apr 30, 2015
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Wei Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH YIELD SEMICONDUCTOR DEVICE
- Publication number 20150061157
- Publication date Mar 5, 2015
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Cheeman Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING COLOR IMAGES ON MEMORY DEVICES AND MEMORY DEVIC...
- Publication number 20140346686
- Publication date Nov 27, 2014
- Fu Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WATERFALL WIRE BONDING
- Publication number 20140183727
- Publication date Jul 3, 2014
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Zhong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI SHIELDING AND THERMAL DISSIPATION FOR SEMICONDUCTOR DEVICE
- Publication number 20140015116
- Publication date Jan 16, 2014
- Sandisk Information Technology (Shanghai) Co.,
- Peng Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-PACKAGE STRUCTURE FOR MULTIPLE DIE STACKS
- Publication number 20130015589
- Publication date Jan 17, 2013
- Chih-Chin Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY COATING ON SUBSTRATE FOR DIE ATTACH
- Publication number 20120279651
- Publication date Nov 8, 2012
- Wei Gu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device including independent film layer for embedding...

Waterfall wire bonding

EMI shielding and thermal dissipation for semiconductor device

Semiconductor die laminating device with independent drives

High yield semiconductor device

Semiconductor device including alternating stepped semiconductor di...

Extrinsic gettering on semiconductor devices

Patents Applicationslast 30 patents

BRIDGE STRUCTURE FOR EMBEDDING SEMICONDUCTOR DIE

METHODS FOR FORMING COLOR IMAGES ON MEMORY DEVICES AND MEMORY DEVIC...

SEMICONDUCTOR DEVICE INCLUDING ALTERNATING STEPPED SEMICONDUCTOR DI...

SEMICONDUCTOR DEVICE INCLUDING INDEPENDENT FILM LAYER FOR EMBEDDING...

EPOXY COATING ON SUBSTRATE FOR DIE ATTACH

BRIDGE STRUCTURE FOR EMBEDDING SEMICONDUCTOR DIE

SEMICONDUCTOR DIE LAMINATING DEVICE WITH INDEPENDENT DRIVES

HIGH YIELD SEMICONDUCTOR DEVICE

METHODS FOR FORMING COLOR IMAGES ON MEMORY DEVICES AND MEMORY DEVIC...

WATERFALL WIRE BONDING

EMI SHIELDING AND THERMAL DISSIPATION FOR SEMICONDUCTOR DEVICE

CHIP-ON-PACKAGE STRUCTURE FOR MULTIPLE DIE STACKS

EPOXY COATING ON SUBSTRATE FOR DIE ATTACH