Luc L. Belanger

Person

Quebec, CA

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnections for flip-chip using lead-free solders and having i...
- Patent number 8,314,500
- Issue date Nov 20, 2012
- Ultratech, Inc.
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of UBM and solder bumps and methods of fabrication
- Patent number 8,003,512
- Issue date Aug 23, 2011
- International Business Machines Corporation
- Luc L. Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Injection molded soldering process and arrangement for three-dimens...
- Patent number 7,952,205
- Issue date May 31, 2011
- International Business Machines Corporation
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection for flip-chip using lead-free solders and having im...
- Patent number 7,932,169
- Issue date Apr 26, 2011
- International Business Machines Corporation
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Injection molded soldering process and arrangement for three-dimens...
- Patent number 7,820,483
- Issue date Oct 26, 2010
- International Business Machines Corporation
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluxless solder transfer and reflow process
- Patent number 7,332,424
- Issue date Feb 19, 2008
- International Business Machines Corporation
- Luc Bélanger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING UNDERBUMP METALLURGY STRUCTURE EMPLOYING SPUTTER-...
- Publication number 20120202343
- Publication date Aug 9, 2012
- International Business Machines Corporation
- Luc Belanger
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
INJECTION MOLDED SOLDERING PROCESS AND ARRANGEMENT FOR THREE-DIMENS...
- Publication number 20100276813
- Publication date Nov 4, 2010
- International Business Machines Corporation
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL STRUCTURE OF UBM AND SOLDER BUMPS AND METHODS OF FABRICATION
- Publication number 20100193949
- Publication date Aug 5, 2010
- International Business Machines Corporation
- Luc L. Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnection for flip-chip using lead-free solders and having im...
- Publication number 20100062597
- Publication date Mar 11, 2010
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM ALLOY
- Publication number 20090140423
- Publication date Jun 4, 2009
- International Business Machines Corporation
- Luc Belanger
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM CO...
- Publication number 20090134016
- Publication date May 28, 2009
- International Business Machines Corporation
- Luc Belanger
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
INJECTION MOLDED SOLDERING PROCESS AND ARRANGEMENT FOR THREE-DIMENS...
- Publication number 20080185703
- Publication date Aug 7, 2008
- International Business Machines Corporation
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING I...
- Publication number 20080157395
- Publication date Jul 3, 2008
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluxless solder transfer and reflow process
- Publication number 20060035454
- Publication date Feb 16, 2006
- IBM Corporation
- Luc Belanger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Injection molded continuously solidified solder method and apparatus
- Publication number 20050263571
- Publication date Dec 1, 2005
- Luc Belanger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Luc L. Belanger

Person

Patents Grantslast 30 patents

Interconnections for flip-chip using lead-free solders and having i...

Structure of UBM and solder bumps and methods of fabrication

Injection molded soldering process and arrangement for three-dimens...

Interconnection for flip-chip using lead-free solders and having im...

Injection molded soldering process and arrangement for three-dimens...

Fluxless solder transfer and reflow process

Patents Applicationslast 30 patents

METHOD OF FORMING UNDERBUMP METALLURGY STRUCTURE EMPLOYING SPUTTER-...

INJECTION MOLDED SOLDERING PROCESS AND ARRANGEMENT FOR THREE-DIMENS...

NOVEL STRUCTURE OF UBM AND SOLDER BUMPS AND METHODS OF FABRICATION

Interconnection for flip-chip using lead-free solders and having im...

UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM ALLOY

UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM CO...

INJECTION MOLDED SOLDERING PROCESS AND ARRANGEMENT FOR THREE-DIMENS...

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING I...

Fluxless solder transfer and reflow process

Injection molded continuously solidified solder method and apparatus