Lucas Benjamin HENDERSON

Person

Ludwigshafen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Composition for cobalt plating comprising additive for void-free su...
- Patent number 12,098,473
- Issue date Sep 24, 2024
- BASF SE
- Sathana Kitayaporn
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composition for cobalt electroplating comprising leveling agent
- Patent number 11,377,748
- Issue date Jul 5, 2022
- BASF SE
- Nadine Engelhardt
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A DEFECT...
- Publication number 20250051950
- Publication date Feb 13, 2025
- BASF SE
- Charlotte Emnet
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A GRAIN R...
- Publication number 20250051949
- Publication date Feb 13, 2025
- BASF SE
- Charlotte Emnet
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Composition For Copper Electroplating On A Cobalt Seed
- Publication number 20230265576
- Publication date Aug 24, 2023
- BASF SE
- Charlotte EMNET
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Alkaline Composition For Copper Electroplating Comprising A Defect...
- Publication number 20230203695
- Publication date Jun 29, 2023
- BASF SE
- Charlotte Emnet
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A GRAIN R...
- Publication number 20230203694
- Publication date Jun 29, 2023
- BASF SE
- Charlotte Emnet
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TWIN-MONOMER COMPOSITION AND DIELECTRIC FILM THEREOF
- Publication number 20220324885
- Publication date Oct 13, 2022
- BASF SE
- Szilard CSIHONY
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Composition for Cobalt Electroplating Comprising Leveling Agent
- Publication number 20220298664
- Publication date Sep 22, 2022
- BASF SE
- Nadine ENGELHARDT
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SU...
- Publication number 20220018035
- Publication date Jan 20, 2022
- BASF SE
- Sathana Katayaporn
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
EPOXY RESIN COMPOSITION
- Publication number 20210395513
- Publication date Dec 23, 2021
- BASF SE
- Jean-Pierre Berkan LINDNER
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COMPOSITION FOR COBALT ELECTROPLATING COMPRISING LEVELING AGENT
- Publication number 20200347503
- Publication date Nov 5, 2020
- BASF SE
- Nadine ENGELHARDT
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Lucas Benjamin HENDERSON

Person

Patents Grantslast 30 patents

Composition for cobalt plating comprising additive for void-free su...

Composition for cobalt electroplating comprising leveling agent

Patents Applicationslast 30 patents

ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A DEFECT...

ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A GRAIN R...

Composition For Copper Electroplating On A Cobalt Seed

Alkaline Composition For Copper Electroplating Comprising A Defect...

ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A GRAIN R...

TWIN-MONOMER COMPOSITION AND DIELECTRIC FILM THEREOF

Composition for Cobalt Electroplating Comprising Leveling Agent

COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SU...

EPOXY RESIN COMPOSITION

COMPOSITION FOR COBALT ELECTROPLATING COMPRISING LEVELING AGENT