Ludovic Ecarnot

Person

Vaulnaveys-Le-Haut, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of fabricating semiconductor structures including cavities...
- Patent number 12,344,524
- Issue date Jul 1, 2025
- Soitec
- Mariam Sadaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor on insulator structure for a front side type imager
- Patent number 12,198,975
- Issue date Jan 14, 2025
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front-side-type image sensor
- Patent number 12,148,755
- Issue date Nov 19, 2024
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a substrate for a front-facing image sensor
- Patent number 12,100,727
- Issue date Sep 24, 2024
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a CFET device
- Patent number 11,876,020
- Issue date Jan 16, 2024
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for a front-side-type image sensor and method for produci...
- Patent number 11,855,120
- Issue date Dec 26, 2023
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for a front-side-type image sensor and method for produci...
- Patent number 11,282,889
- Issue date Mar 22, 2022
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a structure for forming a tridimensional m...
- Patent number 11,205,702
- Issue date Dec 21, 2021
- Soitec
- Christophe Figuet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor on insulator type structure...
- Patent number 11,127,624
- Issue date Sep 21, 2021
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for front side type imager and method of manufacturing su...
- Patent number 11,127,775
- Issue date Sep 21, 2021
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabrication of a semiconductor structure including an in...
- Patent number 11,114,314
- Issue date Sep 7, 2021
- Soitec
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for determining a suitable implanting energy in a donor subs...
- Patent number 10,777,447
- Issue date Sep 15, 2020
- Soitec
- Ludovic Ecarnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor structures including cavities...
- Patent number 10,703,627
- Issue date Jul 7, 2020
- SOITEC
- Mariam Sadaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of forming semiconductor structures
- Patent number 10,163,682
- Issue date Dec 25, 2018
- Soitec
- Cédric Malaquin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring a layer from a single-crystal substrate
- Patent number 9,768,057
- Issue date Sep 19, 2017
- Soitec
- Ludovic Ecarnot
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method to thin a silicon-on-insulator substrate
- Patent number 8,962,492
- Issue date Feb 24, 2015
- Soitec
- Patrick Reynaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Finishing method for a silicon on insulator substrate
- Patent number 8,389,412
- Issue date Mar 5, 2013
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a compound-material wafer
- Patent number 7,892,861
- Issue date Feb 22, 2011
- S.O.I. Tec Silicon on Insulator Technologies
- Ludovic Ecarnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing the surface roughness of a semiconductor wafer
- Patent number 7,883,628
- Issue date Feb 8, 2011
- S.O.I. Tec Silicon on Insulator Technologies
- Eric Neyret
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing the surface roughness of a semiconductor wafer
- Patent number 7,749,910
- Issue date Jul 6, 2010
- S.O.I. Tec Silicon on Insulator Technologies
- Eric Neyret
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for minimizing slip line faults on a semiconductor wafer sur...
- Patent number 7,138,344
- Issue date Nov 21, 2006
- S.O.I.Tec Silicon on Insulator Technologies S.A.
- Eric Neyret
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing free surface roughness of a semiconductor wafer
- Patent number 6,962,858
- Issue date Nov 8, 2005
- S.O.I.Tec Silicon on Insulator Technologies S.A.
- Eric Neyret
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESS FOR FABRICATING A DOUBLE SEMICONDUCTOR-ON-INSULATOR STRUCTURE
- Publication number 20250140600
- Publication date May 1, 2025
- SOITEC
- Carine Duret
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR FABRICATING A DOUBLE SEMICONDUCTOR-ON-INSULATOR STRUCTURE
- Publication number 20250140601
- Publication date May 1, 2025
- SOITEC
- Carine Duret
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-SIDE-TYPE IMAGE SENSOR
- Publication number 20250072111
- Publication date Feb 27, 2025
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR A FRONT-FACING IMAGE SENSOR
- Publication number 20250015122
- Publication date Jan 9, 2025
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLEMENTARY FIELD-EFFECT TRANSISTOR DEVICE INCLUDING AT LEAST ONE...
- Publication number 20240145314
- Publication date May 2, 2024
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DONOR SUBSTRATE FOR THE TRANSFER OF A THIN LAYER AND ASSOCIATED TRA...
- Publication number 20240030061
- Publication date Jan 25, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Larry Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING A THIN LAYER ONTO A SUPPORT SUBSTRATE PROVI...
- Publication number 20230230874
- Publication date Jul 20, 2023
- SOITEC
- Bruno Clemenceau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR HYDROPHILICALLY BONDING SUBSTRATES
- Publication number 20220319910
- Publication date Oct 6, 2022
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Vincent Larrey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR A FRONT-SIDE-TYPE IMAGE SENSOR AND METHOD FOR PRODUCI...
- Publication number 20220157882
- Publication date May 19, 2022
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SUBSTRATE FOR A FRONT-FACING IMAGE SENSOR
- Publication number 20220059603
- Publication date Feb 24, 2022
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-SIDE-TYPE IMAGE SENSOR AND METHOD FR PRODUCING SUCH A SENSOR
- Publication number 20210384223
- Publication date Dec 9, 2021
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ON INSULATOR STRUCTURE FOR A FRONT SIDE TYPE IMAGER
- Publication number 20210366763
- Publication date Nov 25, 2021
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A CFET DEVICE
- Publication number 20210202326
- Publication date Jul 1, 2021
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING CAVITIES...
- Publication number 20200331750
- Publication date Oct 22, 2020
- SOITEC
- Mariam Sadaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FABRICATION OF A SEMICONDUCTOR STRUCTURE INCLUDING AN IN...
- Publication number 20200328094
- Publication date Oct 15, 2020
- SOITEC
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A STRUCTURE FOR FORMING A TRIDIMENSIONAL M...
- Publication number 20200295138
- Publication date Sep 17, 2020
- Christophe Figuet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ON INSULATOR TYPE STRUCTURE, NOTABLY FOR A FRONT SIDE...
- Publication number 20200152689
- Publication date May 14, 2020
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR A FRONT-SIDE-TYPE IMAGE SENSOR AND METHOD FOR PRODUCI...
- Publication number 20200127041
- Publication date Apr 23, 2020
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR FRONT SIDE TYPE IMAGER AND METHOD OF MANUFACTURING SU...
- Publication number 20190348462
- Publication date Nov 14, 2019
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETERMINING A SUITABLE IMPLANTING ENERGY IN A DONOR SUBS...
- Publication number 20190074215
- Publication date Mar 7, 2019
- SOITEC
- Ludovic Ecarnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR STRUCTURES
- Publication number 20170345709
- Publication date Nov 30, 2017
- SOITEC
- Cédric Malaquin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING CAVITIES...
- Publication number 20170210617
- Publication date Jul 27, 2017
- SOITEC
- Mariam Sadaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR TRANSFERRING A LAYER FROM A SINGLE-CRYSTAL SUBSTRATE
- Publication number 20160351438
- Publication date Dec 1, 2016
- SOITEC
- Ludovic Ecarnot
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
FINISHING METHOD FOR A SILICON ON INSULATOR SUBSTRATE
- Publication number 20120021613
- Publication date Jan 26, 2012
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO THIN A SILICON-ON-INSULATOR SUBSTRATE
- Publication number 20120009797
- Publication date Jan 12, 2012
- Patrick Reynaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating a compound-material and method for choosing...
- Publication number 20070231931
- Publication date Oct 4, 2007
- Ludovic Ecarnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of reducing the surface roughness of a semiconductor wafer
- Publication number 20060035445
- Publication date Feb 16, 2006
- Eric Neyret
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of reducing the surface roughness of a semiconductor wafer
- Publication number 20060024908
- Publication date Feb 2, 2006
- S.I.O.TEC Silicon on Insulator Technologes S.A.
- Eric Neyret
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for reducing free surface roughness of a semiconductor wafer
- Publication number 20040171257
- Publication date Sep 2, 2004
- Eric Neyret
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for minimizing slip line faults on a semiconductor wafer sur...
- Publication number 20040106303
- Publication date Jun 3, 2004
- Eric Neyret
- H01 - BASIC ELECTRIC ELEMENTS

Ludovic Ecarnot

Person

Patents Grantslast 30 patents

Methods of fabricating semiconductor structures including cavities...

Semiconductor on insulator structure for a front side type imager

Front-side-type image sensor

Method for manufacturing a substrate for a front-facing image sensor

Method for manufacturing a CFET device

Substrate for a front-side-type image sensor and method for produci...

Substrate for a front-side-type image sensor and method for produci...

Method for manufacturing a structure for forming a tridimensional m...

Method of manufacturing a semiconductor on insulator type structure...

Substrate for front side type imager and method of manufacturing su...

Method for fabrication of a semiconductor structure including an in...

Method for determining a suitable implanting energy in a donor subs...

Methods of fabricating semiconductor structures including cavities...

Methods of forming semiconductor structures

Method for transferring a layer from a single-crystal substrate

Method to thin a silicon-on-insulator substrate

Finishing method for a silicon on insulator substrate

Method for fabricating a compound-material wafer

Method of reducing the surface roughness of a semiconductor wafer

Method of reducing the surface roughness of a semiconductor wafer

Method for minimizing slip line faults on a semiconductor wafer sur...

Method for reducing free surface roughness of a semiconductor wafer

Patents Applicationslast 30 patents

PROCESS FOR FABRICATING A DOUBLE SEMICONDUCTOR-ON-INSULATOR STRUCTURE

PROCESS FOR FABRICATING A DOUBLE SEMICONDUCTOR-ON-INSULATOR STRUCTURE

FRONT-SIDE-TYPE IMAGE SENSOR

STRUCTURE FOR A FRONT-FACING IMAGE SENSOR

COMPLEMENTARY FIELD-EFFECT TRANSISTOR DEVICE INCLUDING AT LEAST ONE...

DONOR SUBSTRATE FOR THE TRANSFER OF A THIN LAYER AND ASSOCIATED TRA...

METHOD FOR TRANSFERRING A THIN LAYER ONTO A SUPPORT SUBSTRATE PROVI...

PROCESS FOR HYDROPHILICALLY BONDING SUBSTRATES

SUBSTRATE FOR A FRONT-SIDE-TYPE IMAGE SENSOR AND METHOD FOR PRODUCI...

METHOD FOR MANUFACTURING A SUBSTRATE FOR A FRONT-FACING IMAGE SENSOR

FRONT-SIDE-TYPE IMAGE SENSOR AND METHOD FR PRODUCING SUCH A SENSOR

SEMICONDUCTOR ON INSULATOR STRUCTURE FOR A FRONT SIDE TYPE IMAGER

METHOD FOR MANUFACTURING A CFET DEVICE

METHODS OF FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING CAVITIES...

METHOD FOR FABRICATION OF A SEMICONDUCTOR STRUCTURE INCLUDING AN IN...

METHOD FOR MANUFACTURING A STRUCTURE FOR FORMING A TRIDIMENSIONAL M...

SEMICONDUCTOR ON INSULATOR TYPE STRUCTURE, NOTABLY FOR A FRONT SIDE...

SUBSTRATE FOR A FRONT-SIDE-TYPE IMAGE SENSOR AND METHOD FOR PRODUCI...

SUBSTRATE FOR FRONT SIDE TYPE IMAGER AND METHOD OF MANUFACTURING SU...

METHOD FOR DETERMINING A SUITABLE IMPLANTING ENERGY IN A DONOR SUBS...

METHODS OF FORMING SEMICONDUCTOR STRUCTURES

METHODS OF FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING CAVITIES...

METHOD FOR TRANSFERRING A LAYER FROM A SINGLE-CRYSTAL SUBSTRATE

FINISHING METHOD FOR A SILICON ON INSULATOR SUBSTRATE

METHOD TO THIN A SILICON-ON-INSULATOR SUBSTRATE

Method for fabricating a compound-material and method for choosing...

Method of reducing the surface roughness of a semiconductor wafer

Method of reducing the surface roughness of a semiconductor wafer

Method for reducing free surface roughness of a semiconductor wafer

Method for minimizing slip line faults on a semiconductor wafer sur...