Ludwig Heitzer

Person

Falkenfels, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Radiation source device
- Patent number 12,158,448
- Issue date Dec 3, 2024
- Infineon Technologies AG
- Derek Debie
- G01 - MEASURING TESTING
Information Patent Grant
Tilted chip assembly for optical devices
- Patent number 10,571,682
- Issue date Feb 25, 2020
- Infineon Technologies AG
- Ludwig Heitzer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Tilted chip assembly for optical devices
- Patent number 10,539,779
- Issue date Jan 21, 2020
- Infineon Technologies AG
- Ludwig Heitzer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor battery and semiconductor device including a semicond...
- Patent number 10,424,819
- Issue date Sep 24, 2019
- Infineon Technologies Dresden GmbH & Co. KG
- Hans Ehm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture thereof
- Patent number 10,043,768
- Issue date Aug 7, 2018
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for attaching a semiconductor die to a carrier
- Patent number 9,881,909
- Issue date Jan 30, 2018
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor package and semiconductor pa...
- Patent number 9,576,935
- Issue date Feb 21, 2017
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture thereof
- Patent number 9,030,019
- Issue date May 12, 2015
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including an encapsulated semiconductor chip and manufacturi...
- Patent number 8,421,226
- Issue date Apr 16, 2013
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component of VQFN design and method for producing the same
- Patent number 8,330,260
- Issue date Dec 11, 2012
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing same
- Patent number 8,173,488
- Issue date May 8, 2012
- Intel Mobile Communications GmbH
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic housing and semiconductor component with said plastic housing
- Patent number 7,919,857
- Issue date Apr 5, 2011
- Infineon Technologies AG
- Michael Bauer
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing an electronic component and corresponding...
- Patent number 7,834,460
- Issue date Nov 16, 2010
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a thinned semiconductor chip and method f...
- Patent number 7,749,864
- Issue date Jul 6, 2010
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit in a package-in-package configuration and produc...
- Patent number 7,714,416
- Issue date May 11, 2010
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with a shielding and/or heat dissipating element
- Patent number 7,683,460
- Issue date Mar 23, 2010
- Infineon Technologies AG
- Ludwig Heitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit in a package-on-package configuration and method...
- Patent number 7,662,664
- Issue date Feb 16, 2010
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for applying a structure of joining material to the back sur...
- Patent number 7,592,236
- Issue date Sep 22, 2009
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for coating a structure comprising semiconductor chips
- Patent number 7,547,645
- Issue date Jun 16, 2009
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with semiconductor chip and adhesive film and...
- Patent number 7,470,601
- Issue date Dec 30, 2008
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a thinned semiconductor chip and method f...
- Patent number 7,294,916
- Issue date Nov 13, 2007
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240030200
- Publication date Jan 25, 2024
- Infineon Technologies Austria AG
- Christian Irrgang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE HAVING AN EMBEDDED INLAY
- Publication number 20230369177
- Publication date Nov 16, 2023
- Marcus Boehm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FOR PARTICLE MEASUREMENT AND METHOD FOR OPERAT...
- Publication number 20230341311
- Publication date Oct 26, 2023
- Infineon Tehcnlogies AG
- Klaus ELIAN
- G01 - MEASURING TESTING
Information Patent Application
RADIATION SOURCE DEVICE
- Publication number 20230194478
- Publication date Jun 22, 2023
- INFINEON TECHNOLOGIES AG
- Derek Debie
- G01 - MEASURING TESTING
Information Patent Application
TILTED CHIP ASSEMBLY FOR OPTICAL DEVICES
- Publication number 20190049716
- Publication date Feb 14, 2019
- INFINEON TECHNOLOGIES AG
- Ludwig HEITZER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Battery and Semiconductor Device Including a Semicond...
- Publication number 20170271722
- Publication date Sep 21, 2017
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Hans Ehm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture Thereof
- Publication number 20160379945
- Publication date Dec 29, 2016
- INFINEON TECHNOLOGIES AG
- Thorston MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Attaching a Semiconductor Die to a Carrier
- Publication number 20160126227
- Publication date May 5, 2016
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Semiconductor Package and Semiconductor Pa...
- Publication number 20150303135
- Publication date Oct 22, 2015
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture Thereof
- Publication number 20120146231
- Publication date Jun 14, 2012
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Including an Encapsulated Semiconductor Chip and Manufacturi...
- Publication number 20110204513
- Publication date Aug 25, 2011
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Method of Manufacturing Same
- Publication number 20100078822
- Publication date Apr 1, 2010
- Michael BAUER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A THINNED SEMICONDUCTOR CHIP AND METHOD F...
- Publication number 20080242057
- Publication date Oct 2, 2008
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER FOR CHIP CONTACT ELEMENT
- Publication number 20080079175
- Publication date Apr 3, 2008
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module with a shielding and/or heat dissipating element
- Publication number 20080073756
- Publication date Mar 27, 2008
- Infineon Technologies AG
- Ludwig Heitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP ASSEMBLY
- Publication number 20080054451
- Publication date Mar 6, 2008
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plastic Housing and Semiconductor Component with Said Plastic Housi...
- Publication number 20080045063
- Publication date Feb 21, 2008
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- G01 - MEASURING TESTING
Information Patent Application
Electronic Device and Method For Producing the Same
- Publication number 20080029865
- Publication date Feb 7, 2008
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Circuit in a Package-On-Package Configuration and Method...
- Publication number 20080017967
- Publication date Jan 24, 2008
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Component of VQFN Design and Method for Producing the Same
- Publication number 20080017986
- Publication date Jan 24, 2008
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT IN A PACKAGE-IN-PACKAGE CONFIGURATION AND PRODUC...
- Publication number 20080017972
- Publication date Jan 24, 2008
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing an electronic component and corresponding...
- Publication number 20070290346
- Publication date Dec 20, 2007
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for coating a structure comprising semiconductor chips
- Publication number 20070105394
- Publication date May 10, 2007
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for applying a structure of joining material to the back sur...
- Publication number 20070087532
- Publication date Apr 19, 2007
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with semiconductor chip and adhesive film and...
- Publication number 20070082463
- Publication date Apr 12, 2007
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A THINNED SEMICONDUCTOR CHIP AND METHOD F...
- Publication number 20070042568
- Publication date Feb 22, 2007
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS

Ludwig Heitzer

Person

Patents Grantslast 30 patents

Radiation source device

Tilted chip assembly for optical devices

Tilted chip assembly for optical devices

Semiconductor battery and semiconductor device including a semicond...

Semiconductor device and method of manufacture thereof

Method for attaching a semiconductor die to a carrier

Method for fabricating a semiconductor package and semiconductor pa...

Semiconductor device and method of manufacture thereof

Device including an encapsulated semiconductor chip and manufacturi...

Electronic component of VQFN design and method for producing the same

Electronic device and method of manufacturing same

Plastic housing and semiconductor component with said plastic housing

Method for manufacturing an electronic component and corresponding...

Semiconductor device with a thinned semiconductor chip and method f...

Electronic circuit in a package-in-package configuration and produc...

Module with a shielding and/or heat dissipating element

Electronic circuit in a package-on-package configuration and method...

Method for applying a structure of joining material to the back sur...

Method for coating a structure comprising semiconductor chips

Semiconductor device with semiconductor chip and adhesive film and...

Semiconductor device with a thinned semiconductor chip and method f...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD

MOLDED SEMICONDUCTOR PACKAGE HAVING AN EMBEDDED INLAY

SEMICONDUCTOR DEVICE FOR PARTICLE MEASUREMENT AND METHOD FOR OPERAT...

RADIATION SOURCE DEVICE

TILTED CHIP ASSEMBLY FOR OPTICAL DEVICES

Semiconductor Battery and Semiconductor Device Including a Semicond...

Semiconductor Device and Method of Manufacture Thereof

Method for Attaching a Semiconductor Die to a Carrier

Method for Fabricating a Semiconductor Package and Semiconductor Pa...

Semiconductor Device and Method of Manufacture Thereof

Device Including an Encapsulated Semiconductor Chip and Manufacturi...

Electronic Device and Method of Manufacturing Same

SEMICONDUCTOR DEVICE WITH A THINNED SEMICONDUCTOR CHIP AND METHOD F...

LAYER FOR CHIP CONTACT ELEMENT

Module with a shielding and/or heat dissipating element

MULTI-CHIP ASSEMBLY

Plastic Housing and Semiconductor Component with Said Plastic Housi...

Electronic Device and Method For Producing the Same

Electronic Circuit in a Package-On-Package Configuration and Method...

Electronic Component of VQFN Design and Method for Producing the Same

ELECTRONIC CIRCUIT IN A PACKAGE-IN-PACKAGE CONFIGURATION AND PRODUC...

Method for manufacturing an electronic component and corresponding...

Method for coating a structure comprising semiconductor chips

Method for applying a structure of joining material to the back sur...

Semiconductor device with semiconductor chip and adhesive film and...

SEMICONDUCTOR DEVICE WITH A THINNED SEMICONDUCTOR CHIP AND METHOD F...