Luis J. Matienzo

Person

Endicott, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device comprising electrically stable copper filled elec...
- Patent number 8,293,141
- Issue date Oct 23, 2012
- International Business Machines Corporation
- Michael Gaynes
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of making multilayered circuitized substrate assembly
- Patent number 7,823,274
- Issue date Nov 2, 2010
- Endicott Interconnect Technologies, Inc.
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically stable copper filled electrically conductive adhesive
- Patent number 7,763,188
- Issue date Jul 27, 2010
- International Business Machines Corporation
- Michael Gaynes
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Circuitized substrate with sintered paste connections, multilayered...
- Patent number 7,342,183
- Issue date Mar 11, 2008
- Endicott Interconnect Technologies, Inc.
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making mutilayered circuitized substrate assembly having...
- Patent number 7,334,323
- Issue date Feb 26, 2008
- Endicott Interconnect Technologies, Inc.
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and method for improved adhesion between two polymer films
- Patent number 7,309,529
- Issue date Dec 18, 2007
- International Business Machines Corporation
- Frank D. Egitto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of treating conductive layer for use in a circuitized substr...
- Patent number 7,307,022
- Issue date Dec 11, 2007
- Endicott Interconnect Technologies, Inc.
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and method for improved adhesion between two polymer films
- Patent number 7,067,193
- Issue date Jun 27, 2006
- International Business Machines Corporation
- Frank D. Egitto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Promoting adhesion between a polymer and a metallic substrate
- Patent number 6,908,684
- Issue date Jun 21, 2005
- International Business Machines Corporation
- Anastasios P. Angelopoulos
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for bonding heat sinks to overmolds and device formed thereby
- Patent number 6,770,968
- Issue date Aug 3, 2004
- International Business Machines Corporation
- Frank D. Egitto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wire bonding to dual metal covered pad surfaces
- Patent number 6,759,597
- Issue date Jul 6, 2004
- International Business Machines Corporation
- Lawrence Richard Cutting
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Promoting adhesion between a polymer and a metallic substrate
- Patent number 6,730,409
- Issue date May 4, 2004
- International Business Machines Corporation
- Anastasios P. Angelopoulos
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for bonding heat sinks to overmolds and device formed thereby
- Patent number 6,719,871
- Issue date Apr 13, 2004
- International Business Machines Corporation
- Frank D. Egitto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Flip-chip package with optimized encapsulant adhesion and method
- Patent number 6,713,858
- Issue date Mar 30, 2004
- International Business Machines Corporation
- Ramesh R. Kodnani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Formation of a metallic interlocking structure
- Patent number 6,693,031
- Issue date Feb 17, 2004
- International Business Machines Corporation
- Gerald G. Advocate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and method for improved adhesion between two polymer films
- Patent number 6,656,313
- Issue date Dec 2, 2003
- International Business Machines Corporation
- Frank D. Egitto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Stable interfaces between electrically conductive adhesives and metals
- Patent number 6,613,184
- Issue date Sep 2, 2003
- International Business Machines Corporation
- Frank Daniel Egitto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Solder ball with chemically and mechanically enhanced surface prope...
- Patent number 6,607,613
- Issue date Aug 19, 2003
- International Business Machines Corporation
- Frank D. Egitto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip package with optimized encapsulant adhesion and method
- Patent number 6,596,559
- Issue date Jul 22, 2003
- International Business Machines Corporation
- Ramesh R. Kodnani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for bonding heat sinks to overmolds and device formed thereby
- Patent number 6,576,996
- Issue date Jun 10, 2003
- International Business Machines Corporation
- Frank D. Egitto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Fabrication of a metalized blind via
- Patent number 6,576,549
- Issue date Jun 10, 2003
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of a metalized blind via
- Patent number 6,522,014
- Issue date Feb 18, 2003
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding to dual metal covered pad surfaces
- Patent number 6,519,845
- Issue date Feb 18, 2003
- International Business Machines Corporation
- Lawrence Richard Cutting
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of uniformly depositing seed and a conductor and the resulta...
- Patent number 6,447,914
- Issue date Sep 10, 2002
- International Business Machines Corporation
- Anastasios P. Angelopoulos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for preventing adhesive bleed onto surfaces
- Patent number 6,420,253
- Issue date Jul 16, 2002
- International Business Machines Corporation
- Bernd K. Appelt
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Thermally enhanced and mechanically balanced flip chip package and...
- Patent number 6,410,988
- Issue date Jun 25, 2002
- International Business Machines Corporation
- David V. Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic interlocking structure
- Patent number 6,348,737
- Issue date Feb 19, 2002
- International Business Machines Corporation
- Gerald G. Advocate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly
- Patent number 6,348,738
- Issue date Feb 19, 2002
- International Business Machines Corporation
- Jean Dery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High adhesion performance roll sputtered strike layer
- Patent number 6,337,004
- Issue date Jan 8, 2002
- International Business Machines Corporation
- Kim Joseph Blackwell
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of forming a flip chip assembly, and a flip chip assembly fo...
- Patent number 6,306,683
- Issue date Oct 23, 2001
- International Business Machines Corporation
- Jean Dery
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIQUID CRYSTAL POLYMER (LCP) SURFACE LAYER ADHESION ENHANCEMENT
- Publication number 20130033671
- Publication date Feb 7, 2013
- Endicott Interconnect Technologies, Inc.
- Mark Schadt
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE METAL NUB FOR ENHANCED ELECTRICAL INTERCONNECTION, AND I...
- Publication number 20120243155
- Publication date Sep 27, 2012
- Endicott Interconnect Technologies, Inc.
- Luis J. Matienzo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFECTIVE CONDUCTIVE SURFACE PAD REPAIR FOR MICROELECTRONIC CIRCUIT...
- Publication number 20120228013
- Publication date Sep 13, 2012
- Endicott Interconnect Technologies, Inc.
- Luis J. Matienzo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR VIA PLATING IN ELECTRONIC PACKAGES CONTAINING FLUOROPOLY...
- Publication number 20110260299
- Publication date Oct 27, 2011
- Endicott Interconnect Technologies, Inc.
- Robert D. Edwards
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chemical modification of chromate conversion coated aluminum work p...
- Publication number 20110139364
- Publication date Jun 16, 2011
- Luis J. Matienzo
- B32 - LAYERED PRODUCTS
Information Patent Application
Adhesive bleed prevention method and product produced from same
- Publication number 20090035455
- Publication date Feb 5, 2009
- Endicott Interconnect Technologies, Inc.
- Roy H. Magnuson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY STABLE COPPER FILLED ELECTRICALLY CONDUCTIVE ADHESIVE
- Publication number 20080230262
- Publication date Sep 25, 2008
- Internationa Business Machines Corporation
- Michael Gaynes
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PROCESS FOR PREPARING AN ELECTRICALLY STABLE COPPER FILLED ELECTRIC...
- Publication number 20080223604
- Publication date Sep 18, 2008
- International Business Machines Corporation
- Michael Gaynes
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Circuitized substrate with sintered paste connections and multilaye...
- Publication number 20080105457
- Publication date May 8, 2008
- Endicott Interconnect Technologies, Inc.
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuitized substrate with increased roughness conductive layer as...
- Publication number 20080054476
- Publication date Mar 6, 2008
- Endicott Interconnect Technologies, Inc.
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making multilayered circuitized substrate assembly
- Publication number 20080022520
- Publication date Jan 31, 2008
- Endicott Interconnect Technologies, Inc.
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making a circuitized substrate with sintered paste connec...
- Publication number 20070006452
- Publication date Jan 11, 2007
- Endicott Interconnect Technologies, Inc.
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuitized substrate with sintered paste connections, multilayered...
- Publication number 20070007032
- Publication date Jan 11, 2007
- Endicott Interconnect Technologies, Inc.
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrically stable copper filled electrically conductive adhesive
- Publication number 20060197065
- Publication date Sep 7, 2006
- International Business Machines Corporation
- Michael Gaynes
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method of treating conductive layer for use in a circuitized substr...
- Publication number 20060121738
- Publication date Jun 8, 2006
- Endicott Interconnect Technologies, Inc.
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure and method for improved adhesion between two polymer films
- Publication number 20050064199
- Publication date Mar 24, 2005
- Frank D. Egitto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Promoting adhesion between a polymer and a metallic substrate
- Publication number 20040166438
- Publication date Aug 26, 2004
- International Business Machines Corporation
- Anastasios P. Angelopoulos
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Structure and method for improved adhesion between two polymer films
- Publication number 20040076839
- Publication date Apr 22, 2004
- Frank D. Egitto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Flip-chip package with optimized encapsulant adhesion and method
- Publication number 20030203535
- Publication date Oct 30, 2003
- International Business Machines Corporation
- Ramesh R. Kodnani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method for bonding heat sinks to overmolds and device formed thereby
- Publication number 20030123229
- Publication date Jul 3, 2003
- Frank D. Egitto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Fabrication of a metalized blind via
- Publication number 20030054635
- Publication date Mar 20, 2003
- Frank D. Egitto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for improved adhesion between two polymer films
- Publication number 20020195197
- Publication date Dec 26, 2002
- International Business Machines Corporation
- Frank D. Egitto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation of a metallic interlocking structure
- Publication number 20020056890
- Publication date May 16, 2002
- International Business Machines Corporation
- Gerald G. Advocate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for bonding heat sinks to overmolds and device formed thereby
- Publication number 20020005245
- Publication date Jan 17, 2002
- Frank D. Egitto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method and structure for preventing adhesive bleed onto surfaces
- Publication number 20010028117
- Publication date Oct 11, 2001
- International Business Machines Corporation
- Bernd K. Appelt
- B82 - NANO-TECHNOLOGY
Information Patent Application
Flip-chip package with optimized encapsulant adhesion and method
- Publication number 20010012642
- Publication date Aug 9, 2001
- International Business Machines Corporation
- Ramesh R. Kodnani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder ball with chemically and mechanically enhanced surface prope...
- Publication number 20010012570
- Publication date Aug 9, 2001
- Frank D. Egitto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for bonding heat sinks to overmolds and device formed thereby
- Publication number 20010001183
- Publication date May 17, 2001
- Frank D. Egitto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Luis J. Matienzo

Person

Patents Grantslast 30 patents

Electronic device comprising electrically stable copper filled elec...

Method of making multilayered circuitized substrate assembly

Electrically stable copper filled electrically conductive adhesive

Circuitized substrate with sintered paste connections, multilayered...

Method of making mutilayered circuitized substrate assembly having...

Structure and method for improved adhesion between two polymer films

Method of treating conductive layer for use in a circuitized substr...

Structure and method for improved adhesion between two polymer films

Promoting adhesion between a polymer and a metallic substrate

Method for bonding heat sinks to overmolds and device formed thereby

Wire bonding to dual metal covered pad surfaces

Promoting adhesion between a polymer and a metallic substrate

Method for bonding heat sinks to overmolds and device formed thereby

Flip-chip package with optimized encapsulant adhesion and method

Formation of a metallic interlocking structure

Structure and method for improved adhesion between two polymer films

Stable interfaces between electrically conductive adhesives and metals

Solder ball with chemically and mechanically enhanced surface prope...

Flip-chip package with optimized encapsulant adhesion and method

Method for bonding heat sinks to overmolds and device formed thereby

Fabrication of a metalized blind via

Fabrication of a metalized blind via

Wire bonding to dual metal covered pad surfaces

Method of uniformly depositing seed and a conductor and the resulta...

Method for preventing adhesive bleed onto surfaces

Thermally enhanced and mechanically balanced flip chip package and...

Metallic interlocking structure

Flip chip assembly

High adhesion performance roll sputtered strike layer

Method of forming a flip chip assembly, and a flip chip assembly fo...

Patents Applicationslast 30 patents

LIQUID CRYSTAL POLYMER (LCP) SURFACE LAYER ADHESION ENHANCEMENT

CONDUCTIVE METAL NUB FOR ENHANCED ELECTRICAL INTERCONNECTION, AND I...

DEFECTIVE CONDUCTIVE SURFACE PAD REPAIR FOR MICROELECTRONIC CIRCUIT...

METHOD FOR VIA PLATING IN ELECTRONIC PACKAGES CONTAINING FLUOROPOLY...

Chemical modification of chromate conversion coated aluminum work p...

Adhesive bleed prevention method and product produced from same

ELECTRICALLY STABLE COPPER FILLED ELECTRICALLY CONDUCTIVE ADHESIVE

PROCESS FOR PREPARING AN ELECTRICALLY STABLE COPPER FILLED ELECTRIC...

Circuitized substrate with sintered paste connections and multilaye...

Circuitized substrate with increased roughness conductive layer as...

Method of making multilayered circuitized substrate assembly

Method of making a circuitized substrate with sintered paste connec...

Circuitized substrate with sintered paste connections, multilayered...

Electrically stable copper filled electrically conductive adhesive

Method of treating conductive layer for use in a circuitized substr...

Structure and method for improved adhesion between two polymer films

Promoting adhesion between a polymer and a metallic substrate

Structure and method for improved adhesion between two polymer films

Flip-chip package with optimized encapsulant adhesion and method

Method for bonding heat sinks to overmolds and device formed thereby

Fabrication of a metalized blind via

Structure and method for improved adhesion between two polymer films

Formation of a metallic interlocking structure

Method for bonding heat sinks to overmolds and device formed thereby

Method and structure for preventing adhesive bleed onto surfaces

Flip-chip package with optimized encapsulant adhesion and method

Solder ball with chemically and mechanically enhanced surface prope...

Method for bonding heat sinks to overmolds and device formed thereby