Claims
- 1. An apparatus comprising:a molded polymer formed on a substrate; a silica layer on a surface of the molded polymer; an adherent bonded to the silica layer; and an article bonded to the adherent.
- 2. The apparatus of claim 1, wherein the molded polymer comprises an overmold, the substrate comprises an electronic component, the silica comprises plasma converted silicone oil, and the article comprises a heat sink.
- 3. The apparatus of claim 1, wherein the adherent comprises a silicone-based paste adhesive with a metal oxide filler.
- 4. The apparatus of claim 1, wherein the adherent comprises a porous polymer film impregnated with adhesive.
- 5. The apparatus of claim 4, wherein the film comprises polytetrafluoroethylene, the adhesive comprises polybutadine, and the film is further impregnated with a metal oxide heat transfer medium.
- 6. The apparatus of claim 5, wherein the metal oxide heat transfer medium comprises zinc oxide.
Parent Case Info
This application is a divisional of Ser. No. 09/248,341, filed on Feb. 11, 1999.
US Referenced Citations (12)
Foreign Referenced Citations (3)
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JP |
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09153576 |
Jun 1997 |
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