Ma Zhaohui

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Bond pad with micro-protrusions for direct metallic bonding
- Patent number 10,923,448
- Issue date Feb 16, 2021
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die assemblies with heat sink and associated systems...
- Patent number 10,636,678
- Issue date Apr 28, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die assemblies with heat sink and associated systems...
- Patent number 10,153,178
- Issue date Dec 11, 2018
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing multi-die semiconductor device packages an...
- Patent number 9,865,578
- Issue date Jan 9, 2018
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of processing wafer-level assemblies to reduce warpage, and...
- Patent number 9,786,612
- Issue date Oct 10, 2017
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising protected side surfaces and relate...
- Patent number 9,786,643
- Issue date Oct 10, 2017
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die assemblies with heat sink and associated systems...
- Patent number 9,716,019
- Issue date Jul 25, 2017
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of processing wafer-level assemblies to reduce warpage, and...
- Patent number 9,589,933
- Issue date Mar 7, 2017
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die assemblies with heat sink and associated systems...
- Patent number 9,349,670
- Issue date May 24, 2016
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of protecting peripheries of in-process semiconductor wafer...
- Patent number 9,337,064
- Issue date May 10, 2016
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor device packages
- Patent number 9,202,714
- Issue date Dec 1, 2015
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...
- Publication number 20190109019
- Publication date Apr 11, 2019
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...
- Publication number 20170323802
- Publication date Nov 9, 2017
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING
- Publication number 20170287864
- Publication date Oct 5, 2017
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROCESSING WAFER-LEVEL ASSEMBLIES TO REDUCE WARPAGE, AND...
- Publication number 20170179045
- Publication date Jun 22, 2017
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING MULTI DIE SEMICONDUCTOR DEVICE PACKAGES AN...
- Publication number 20160358898
- Publication date Dec 8, 2016
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...
- Publication number 20160233110
- Publication date Aug 11, 2016
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING
- Publication number 20160093583
- Publication date Mar 31, 2016
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROTECTING PERIPHERIES OF IN-PROCESS SEMICONDUCTOR WAFER...
- Publication number 20160079094
- Publication date Mar 17, 2016
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...
- Publication number 20160035648
- Publication date Feb 4, 2016
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING PROTECTED SIDE SURFACES AND RELATE...
- Publication number 20160013154
- Publication date Jan 14, 2016
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROCESSING WAFER-LEVEL ASSEMBLIES TO REDUCE WARPAGE, AND...
- Publication number 20150371969
- Publication date Dec 24, 2015
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20130280861
- Publication date Oct 24, 2013
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and method for testing semiconductor element, and manufactur...
- Publication number 20080150561
- Publication date Jun 26, 2008
- Advanpack Solutions Pte Ltd
- Chew Hwee-Seng Jimmy
- G01 - MEASURING TESTING

Person

Patents Grantslast 30 patents

Bond pad with micro-protrusions for direct metallic bonding

Semiconductor die assemblies with heat sink and associated systems...

Semiconductor die assemblies with heat sink and associated systems...

Methods of manufacturing multi-die semiconductor device packages an...

Methods of processing wafer-level assemblies to reduce warpage, and...

Semiconductor devices comprising protected side surfaces and relate...

Semiconductor die assemblies with heat sink and associated systems...

Methods of processing wafer-level assemblies to reduce warpage, and...

Semiconductor die assemblies with heat sink and associated systems...

Methods of protecting peripheries of in-process semiconductor wafer...

Methods for forming semiconductor device packages

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...

SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...

BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING

METHODS OF PROCESSING WAFER-LEVEL ASSEMBLIES TO REDUCE WARPAGE, AND...

METHODS OF MANUFACTURING MULTI DIE SEMICONDUCTOR DEVICE PACKAGES AN...

SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...

BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING

METHODS OF PROTECTING PERIPHERIES OF IN-PROCESS SEMICONDUCTOR WAFER...

SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...

SEMICONDUCTOR DEVICES COMPRISING PROTECTED SIDE SURFACES AND RELATE...

METHODS OF PROCESSING WAFER-LEVEL ASSEMBLIES TO REDUCE WARPAGE, AND...

METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES

Device and method for testing semiconductor element, and manufactur...