Maciej Wojnowski

Person

Munchen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having an antenna arranged over an active main...
- Patent number 12,094,842
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency devices and methods for producing radio-frequency d...
- Patent number 12,040,543
- Issue date Jul 16, 2024
- Infineon Technologies AG
- Walter Hartner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising a radar semiconductor chip and ass...
- Patent number 12,014,998
- Issue date Jun 18, 2024
- Infineon Technologies AG
- Ernst Seler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor system having an inductor module attached to a...
- Patent number 11,996,771
- Issue date May 28, 2024
- Infineon Technologies Austria AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission of wireless signal having information on a local oscil...
- Patent number 11,879,966
- Issue date Jan 23, 2024
- Infineon Technologies AG
- Josef Boeck
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Chip package with substrate integrated waveguide and waveguide inte...
- Patent number 11,824,019
- Issue date Nov 21, 2023
- Infineon Technologies AG
- Tuncay Erdoel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising a radar semiconductor chip and ass...
- Patent number 11,658,135
- Issue date May 23, 2023
- Infineon Technologies AG
- Ernst Seler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a power semiconductor system
- Patent number 11,539,291
- Issue date Dec 27, 2022
- Infineon Technologies Austria AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with plastic waveguide
- Patent number 11,387,533
- Issue date Jul 12, 2022
- Infineon Technologies AG
- Maciej Wojnowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of EBG structures (single layer/multi-layer) for isolat...
- Patent number 11,355,838
- Issue date Jun 7, 2022
- Infineon Technologies AG
- Ashutosh Baheti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a non-galvanic connection
- Patent number 11,251,146
- Issue date Feb 15, 2022
- Infineon Technologies AG
- Walter Hartner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an antenna
- Patent number 11,195,787
- Issue date Dec 7, 2021
- Infineon Technologies AG
- Ngoc-Hoa Huynh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having cutouts in an encapsulation material a...
- Patent number 11,145,563
- Issue date Oct 12, 2021
- Infineon Technologies AG
- Christian Geissler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a chip arrangement, chip arrangement, method of f...
- Patent number 10,930,541
- Issue date Feb 23, 2021
- Infineon Technologies AG
- Thomas Kilger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including redistribution layer pad having a void
- Patent number 10,916,484
- Issue date Feb 9, 2021
- Infineon Technologies AG
- Robert Fehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing inductor modules and power semiconductor s...
- Patent number 10,833,583
- Issue date Nov 10, 2020
- Infineon Technologies Austria AG
- Petteri Palm
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Radar module with wafer level package and underfill
- Patent number 10,692,824
- Issue date Jun 23, 2020
- Infineon Technologies AG
- Rudolf Lachner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor systems having inductor modules, and methods of...
- Patent number 10,601,314
- Issue date Mar 24, 2020
- Infineon Technologies Austria AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector block with two sorts of through connections, and electron...
- Patent number 10,217,695
- Issue date Feb 26, 2019
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a passive component formed in a redi...
- Patent number 10,186,481
- Issue date Jan 22, 2019
- Infineon Technologies AG
- Maciej Wojnowski
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Integrated antennas in wafer level package
- Patent number 10,121,751
- Issue date Nov 6, 2018
- Infineon Technologies AG
- Rudolf Lachner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package having a semiconduc...
- Patent number 9,922,946
- Issue date Mar 20, 2018
- Infineon Technologies AG
- Ernst Seler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless communication system, a radar system and a method for dete...
- Patent number 9,910,145
- Issue date Mar 6, 2018
- Infineon Technologies AG
- Josef Boeck
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of manufacturing a semiconductor package having an integrate...
- Patent number 9,653,426
- Issue date May 16, 2017
- Infineon Technologies AG
- Ernst Seler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transition between a plastic waveguide and a semiconductor chip, wh...
- Patent number 9,583,811
- Issue date Feb 28, 2017
- Infineon Technologies AG
- Ernst Seler
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Common-mode suppressor based on differential transmission line
- Patent number 9,577,852
- Issue date Feb 21, 2017
- Infineon Technologies AG
- Maciej Wojnowski
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Integrated-circuit module with waveguide transition element
- Patent number 9,356,332
- Issue date May 31, 2016
- Infineon Technologies AG
- Ernst Seler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated antennas in wafer level package
- Patent number 9,349,696
- Issue date May 24, 2016
- Infineon Technologies AG
- Rudolf Lachner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated microwave component
- Patent number 9,337,159
- Issue date May 10, 2016
- Infineon Technologies AG
- Ernst Seler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter-wave system including a waveguide transition connected t...
- Patent number 9,337,522
- Issue date May 10, 2016
- Infineon Technologies AG
- Saverio Trotta
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
GAS SENSOR DEVICES, METHODS FOR PRODUCING SAME, AND METHODS FOR GEN...
- Publication number 20230314345
- Publication date Oct 5, 2023
- INFINEON TECHNOLOGIES AG
- Bernhard RIEDER
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING A RADAR SEMICONDUCTOR CHIP AND ASS...
- Publication number 20230275046
- Publication date Aug 31, 2023
- INFINEON TECHNOLOGIES AG
- Ernst SELER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR SYSTEM HAVING AN INDUCTOR MODULE ATTACHED TO A...
- Publication number 20230127874
- Publication date Apr 27, 2023
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH SUBSTRATE INTEGRATED WAVEGUIDE AND WAVEGUIDE INTE...
- Publication number 20220415830
- Publication date Dec 29, 2022
- INFINEON TECHNOLOGIES AG
- Tuncay ERDOEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY DEVICES AND METHODS FOR PRODUCING RADIO-FREQUENCY D...
- Publication number 20220247089
- Publication date Aug 4, 2022
- INFINEON TECHNOLOGIES AG
- Walter HARTNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING AN ANTENNA
- Publication number 20220148951
- Publication date May 12, 2022
- INFINEON TECHNOLOGIES AG
- Ngoc-Hoa Huynh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION OF WIRELESS SIGNAL HAVING INFORMATION ON A LOCAL OSCIL...
- Publication number 20210247510
- Publication date Aug 12, 2021
- INFINEON TECHNOLOGIES AG
- Josef Boeck
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHODS OF PRODUCING INDUCTOR MODULES AND POWER SEMICONDUCTOR SYSTE...
- Publication number 20210036610
- Publication date Feb 4, 2021
- Petteri Palm
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICES HAVING A NON-GALVANIC CONNECTION
- Publication number 20200321295
- Publication date Oct 8, 2020
- INFINEON TECHNOLOGIES AG
- Walter HARTNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integration of EBG Structures (Single Layer/Multi-Layer) for Isolat...
- Publication number 20200303815
- Publication date Sep 24, 2020
- INFINEON TECHNOLOGIES AG
- Ashutosh Baheti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING A RADAR SEMICONDUCTOR CHIP AND ASS...
- Publication number 20200251430
- Publication date Aug 6, 2020
- INFINEON TECHNOLOGIES AG
- Ernst SELER
- G01 - MEASURING TESTING
Information Patent Application
Methods of Manufacturing Inductor Modules and Power Semiconductor S...
- Publication number 20200212798
- Publication date Jul 2, 2020
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH PLASTIC WAVEGUIDE
- Publication number 20200021002
- Publication date Jan 16, 2020
- INFINEON TECHNOLOGIES AG
- Maciej Wojnowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CUTOUTS IN AN ENCAPSULATION MATERIAL A...
- Publication number 20200006174
- Publication date Jan 2, 2020
- INFINEON TECHNOLOGIES AG
- Christian GEISSLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On-Chip Antennas for Semiconductor Devices and Related Manufacturin...
- Publication number 20190221531
- Publication date Jul 18, 2019
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Chip Arrangement, Chip Arrangement, Method of F...
- Publication number 20190221465
- Publication date Jul 18, 2019
- INFINEON TECHNOLOGIES AG
- Thomas Kilger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Systems Having Inductor Modules, and Methods of...
- Publication number 20190081562
- Publication date Mar 14, 2019
- Infineon Technologies Austria AG
- Petteri Palm
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
RADAR MODULE WITH WAFER LEVEL PACKAGE AND UNDERFILL
- Publication number 20190067223
- Publication date Feb 28, 2019
- INFINEON TECHNOLOGIES AG
- Rudolf Lachner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING REDISTRIBUTION LAYER PAD HAVING A VOID
- Publication number 20180374769
- Publication date Dec 27, 2018
- INFINEON TECHNOLOGIES AG
- Robert Fehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION OF WIRELESS SIGNAL HAVING INFORMATION ON A LOCAL OSCIL...
- Publication number 20180180730
- Publication date Jun 28, 2018
- INFINEON TECHNOLOGIES AG
- Josef Boeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices with On-Chip Antennas and Manufacturing Thereof
- Publication number 20170309582
- Publication date Oct 26, 2017
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A PASSIVE COMPONENT FORMED IN A REDI...
- Publication number 20170271260
- Publication date Sep 21, 2017
- INFINEON TECHNOLOGIES AG
- Maciej Wojnowski
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING AN ANTENNA
- Publication number 20170236776
- Publication date Aug 17, 2017
- INFINEON TECHNOLOGIES AG
- Ngoc-Hoa Huynh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Semiconductor Package Having a Semiconduc...
- Publication number 20170213800
- Publication date Jul 27, 2017
- INFINEON TECHNOLOGIES AG
- Ernst Seler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connector block with two sorts of through connections, and electron...
- Publication number 20170162476
- Publication date Jun 8, 2017
- INFINEON TECHNOLOGIES AG
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Semiconductor Package Having an Integrate...
- Publication number 20160247780
- Publication date Aug 25, 2016
- INFINEON TECHNOLOGIES AG
- Ernst Seler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ANTENNAS IN WAFER LEVEL PACKAGE
- Publication number 20160240495
- Publication date Aug 18, 2016
- INFINEON TECHNOLOGIES AG
- Rudolf Lachner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMON-MODE SUPPRESSOR BASED ON DIFFERENTIAL TRANSMISSION LINE
- Publication number 20160127157
- Publication date May 5, 2016
- INFINEON TECHNOLOGIES AG
- Maciej Wojnowski
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Microwave Chip Package Device
- Publication number 20160043455
- Publication date Feb 11, 2016
- INFINEON TECHNOLOGIES AG
- Ernst Seler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS COMMUNICATION SYSTEM, A RADAR SYSTEM AND A METHOD FOR DETE...
- Publication number 20150177373
- Publication date Jun 25, 2015
- INFINEON TECHNOLOGIES AG
- Josef Boeck
- G01 - MEASURING TESTING

Maciej Wojnowski

Person

Patents Grantslast 30 patents

Semiconductor device having an antenna arranged over an active main...

Radio-frequency devices and methods for producing radio-frequency d...

Semiconductor devices comprising a radar semiconductor chip and ass...

Power semiconductor system having an inductor module attached to a...

Transmission of wireless signal having information on a local oscil...

Chip package with substrate integrated waveguide and waveguide inte...

Semiconductor devices comprising a radar semiconductor chip and ass...

Method of manufacturing a power semiconductor system

Semiconductor package with plastic waveguide

Integration of EBG structures (single layer/multi-layer) for isolat...

Semiconductor devices having a non-galvanic connection

Semiconductor device including an antenna

Semiconductor devices having cutouts in an encapsulation material a...

Method of forming a chip arrangement, chip arrangement, method of f...

Electronic device including redistribution layer pad having a void

Methods of manufacturing inductor modules and power semiconductor s...

Radar module with wafer level package and underfill

Power semiconductor systems having inductor modules, and methods of...

Connector block with two sorts of through connections, and electron...

Semiconductor device including a passive component formed in a redi...

Integrated antennas in wafer level package

Method of manufacturing a semiconductor package having a semiconduc...

Wireless communication system, a radar system and a method for dete...

Method of manufacturing a semiconductor package having an integrate...

Transition between a plastic waveguide and a semiconductor chip, wh...

Common-mode suppressor based on differential transmission line

Integrated-circuit module with waveguide transition element

Integrated antennas in wafer level package

Semiconductor package with integrated microwave component

Millimeter-wave system including a waveguide transition connected t...

Patents Applicationslast 30 patents

GAS SENSOR DEVICES, METHODS FOR PRODUCING SAME, AND METHODS FOR GEN...

SEMICONDUCTOR DEVICES COMPRISING A RADAR SEMICONDUCTOR CHIP AND ASS...

POWER SEMICONDUCTOR SYSTEM HAVING AN INDUCTOR MODULE ATTACHED TO A...

CHIP PACKAGE WITH SUBSTRATE INTEGRATED WAVEGUIDE AND WAVEGUIDE INTE...

RADIO-FREQUENCY DEVICES AND METHODS FOR PRODUCING RADIO-FREQUENCY D...

SEMICONDUCTOR DEVICE INCLUDING AN ANTENNA

TRANSMISSION OF WIRELESS SIGNAL HAVING INFORMATION ON A LOCAL OSCIL...

METHODS OF PRODUCING INDUCTOR MODULES AND POWER SEMICONDUCTOR SYSTE...

SEMICONDUCTOR DEVICES HAVING A NON-GALVANIC CONNECTION

Integration of EBG Structures (Single Layer/Multi-Layer) for Isolat...

SEMICONDUCTOR DEVICES COMPRISING A RADAR SEMICONDUCTOR CHIP AND ASS...

Methods of Manufacturing Inductor Modules and Power Semiconductor S...

SEMICONDUCTOR PACKAGE WITH PLASTIC WAVEGUIDE

SEMICONDUCTOR DEVICES HAVING CUTOUTS IN AN ENCAPSULATION MATERIAL A...

On-Chip Antennas for Semiconductor Devices and Related Manufacturin...

Method of Forming a Chip Arrangement, Chip Arrangement, Method of F...

Power Semiconductor Systems Having Inductor Modules, and Methods of...

RADAR MODULE WITH WAFER LEVEL PACKAGE AND UNDERFILL

ELECTRONIC DEVICE INCLUDING REDISTRIBUTION LAYER PAD HAVING A VOID

TRANSMISSION OF WIRELESS SIGNAL HAVING INFORMATION ON A LOCAL OSCIL...

Semiconductor Devices with On-Chip Antennas and Manufacturing Thereof

SEMICONDUCTOR DEVICE INCLUDING A PASSIVE COMPONENT FORMED IN A REDI...

SEMICONDUCTOR DEVICE INCLUDING AN ANTENNA

Method of Manufacturing a Semiconductor Package Having a Semiconduc...

Connector block with two sorts of through connections, and electron...

Method of Manufacturing a Semiconductor Package Having an Integrate...

INTEGRATED ANTENNAS IN WAFER LEVEL PACKAGE

COMMON-MODE SUPPRESSOR BASED ON DIFFERENTIAL TRANSMISSION LINE

Microwave Chip Package Device

WIRELESS COMMUNICATION SYSTEM, A RADAR SYSTEM AND A METHOD FOR DETE...