Makarand R. Kulkarni

Person

Richardson, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Antenna in package having antenna on package substrate
- Patent number 12,322,856
- Issue date Jun 3, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with shunt and patterned metal trace
- Patent number 12,211,800
- Issue date Jan 28, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die multichip module package
- Patent number 12,015,019
- Issue date Jun 18, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device
- Patent number 11,955,479
- Issue date Apr 9, 2024
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated metal layer in power packages
- Patent number 11,784,114
- Issue date Oct 10, 2023
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recess lead for a surface mount package
- Patent number 11,430,720
- Issue date Aug 30, 2022
- Texas Instruments Incorporated
- Naweed Anjum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple underfills for flip chip packages
- Patent number 11,217,460
- Issue date Jan 4, 2022
- Texas Instruments Incorporated
- Makarand Ramkrishna Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate having differential coaxial vias
- Patent number 11,160,163
- Issue date Oct 26, 2021
- Texas Instruments Incorporated
- Snehamay Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die multichip module package
- Patent number 11,081,472
- Issue date Aug 3, 2021
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device
- Patent number 10,475,786
- Issue date Nov 12, 2019
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneous via and trench patterning using different etch rates
- Patent number 8,614,143
- Issue date Dec 24, 2013
- Texas Instruments Incorporated
- Makarand R. Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3T DRAM cell with added capacitance on storage node
- Patent number 8,379,433
- Issue date Feb 19, 2013
- Texas Instruments Incorporated
- Theodore W. Houston
- G11 - INFORMATION STORAGE
Information Patent Grant
In line test circuit and method for determining interconnect electr...
- Patent number 7,855,090
- Issue date Dec 21, 2010
- Texas Instruments Incorporated
- Makarand R. Kulkarni
- G01 - MEASURING TESTING
Information Patent Grant
In-line test circuit and method for determining interconnect electr...
- Patent number 7,786,475
- Issue date Aug 31, 2010
- Texas Instruments Incorporated
- Makarand R. Kulkarni
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE
- Publication number 20250233301
- Publication date Jul 17, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SHUNT AND PATTERNED METAL TRACE
- Publication number 20250140708
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR EMBEDDING FOR FLIP CHIP PACKAGES
- Publication number 20240332433
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Li Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESS LEAD FOR A SURFACE MOUNT PACKAGE
- Publication number 20240071889
- Publication date Feb 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Naweed Anjum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATED METAL LAYER IN POWER PACKAGES
- Publication number 20240047330
- Publication date Feb 8, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria NOQUIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING A ROUTABLE LEADFRAME
- Publication number 20230411170
- Publication date Dec 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- BRADLEY GLASSCOCK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILEVEL PACKAGE SUBSTRATE DEVICE WITH BGA PIN OUT AND COAXIAL SI...
- Publication number 20230063343
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SHUNT AND PATTERNED METAL TRACE
- Publication number 20220384353
- Publication date Dec 1, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE
- Publication number 20220209391
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATED METAL LAYER IN POWER PACKAGES
- Publication number 20220181241
- Publication date Jun 9, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria NOQUIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNT PACKAGE FOR A SEMICONDUCTOR DEVICE
- Publication number 20220028767
- Publication date Jan 27, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Naweed Anjum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Die Multichip Module Package
- Publication number 20210320093
- Publication date Oct 14, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE MULTICHIP MODULE PACKAGE
- Publication number 20210082889
- Publication date Mar 18, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE DEVICES WITH MULTIPLE POLYIMIDE LAYERS
- Publication number 20200381342
- Publication date Dec 3, 2020
- TEXAS INSTRUMENTS INCORPORATED
- YongSeok PARK
- G01 - MEASURING TESTING
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20200066716
- Publication date Feb 27, 2020
- TEXAS INSTRUMENTS INCORPORATED
- YIQI TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20190363080
- Publication date Nov 28, 2019
- TEXAS INSTRUMENTS INCORPORATED
- YIQI TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE UNDERFILLS FOR FLIP CHIP PACKAGES
- Publication number 20190348303
- Publication date Nov 14, 2019
- TEXAS INSTRUMENTS INCORPORATED
- MAKARAND RAMKRISHNA KULKARNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATE HAVING DIFFERENTIAL COAXIAL VIAS
- Publication number 20190159333
- Publication date May 23, 2019
- TEXAS INSTRUMENTS INCORPORATED
- SNEHAMAY SINHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN LINE TEST CIRCUIT AND METHOD FOR DETERMINING INTERCONNNECT ELECT...
- Publication number 20100297793
- Publication date Nov 25, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Makarand R. Kulkarni
- G01 - MEASURING TESTING
Information Patent Application
SIMULTANEOUS VIA AND TRENCH PATTERNING USING DIFFERENT ETCH RATES
- Publication number 20100136781
- Publication date Jun 3, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Makarand R. Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN LINE TEST CIRCUIT AND METHOD FOR DETERMINING INTERCONNECT ELECTR...
- Publication number 20070269912
- Publication date Nov 22, 2007
- Texas Instruments, Incorporated
- Makarand R. Kulkarni
- G01 - MEASURING TESTING

Makarand R. Kulkarni

Person

Patents Grantslast 30 patents

Antenna in package having antenna on package substrate

Semiconductor package with shunt and patterned metal trace

Stacked die multichip module package

Packaged semiconductor device

Plated metal layer in power packages

Recess lead for a surface mount package

Multiple underfills for flip chip packages

Electronic substrate having differential coaxial vias

Stacked die multichip module package

Packaged semiconductor device

Simultaneous via and trench patterning using different etch rates

3T DRAM cell with added capacitance on storage node

In line test circuit and method for determining interconnect electr...

In-line test circuit and method for determining interconnect electr...

Patents Applicationslast 30 patents

ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE

SEMICONDUCTOR PACKAGE WITH SHUNT AND PATTERNED METAL TRACE

CAPACITOR EMBEDDING FOR FLIP CHIP PACKAGES

RECESS LEAD FOR A SURFACE MOUNT PACKAGE

PLATED METAL LAYER IN POWER PACKAGES

INTEGRATED CIRCUIT HAVING A ROUTABLE LEADFRAME

MULTILEVEL PACKAGE SUBSTRATE DEVICE WITH BGA PIN OUT AND COAXIAL SI...

SEMICONDUCTOR PACKAGE WITH SHUNT AND PATTERNED METAL TRACE

ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE

PLATED METAL LAYER IN POWER PACKAGES

SURFACE MOUNT PACKAGE FOR A SEMICONDUCTOR DEVICE

Stacked Die Multichip Module Package

STACKED DIE MULTICHIP MODULE PACKAGE

HIGH VOLTAGE DEVICES WITH MULTIPLE POLYIMIDE LAYERS

PACKAGED SEMICONDUCTOR DEVICE

PACKAGED SEMICONDUCTOR DEVICE

MULTIPLE UNDERFILLS FOR FLIP CHIP PACKAGES

ELECTRONIC SUBSTRATE HAVING DIFFERENTIAL COAXIAL VIAS

IN LINE TEST CIRCUIT AND METHOD FOR DETERMINING INTERCONNNECT ELECT...

SIMULTANEOUS VIA AND TRENCH PATTERNING USING DIFFERENT ETCH RATES

IN LINE TEST CIRCUIT AND METHOD FOR DETERMINING INTERCONNECT ELECTR...