Makoto Ohkawa

Person

Kariya-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, cutting equipment for cutting semiconductor d...
- Patent number 7,199,026
- Issue date Apr 3, 2007
- Denso Corporation
- Makoto Ohkawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of etching metallic thin film on thin film resistor
- Patent number 6,809,034
- Issue date Oct 26, 2004
- Denso Corporation
- Ichiro Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of etching metallic thin film on thin film resistor
- Patent number 6,770,564
- Issue date Aug 3, 2004
- Denso Corporation
- Ichiro Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device by polishing
- Patent number 6,656,755
- Issue date Dec 2, 2003
- Denso Corporation
- Makoto Ohkawa
- B24 - GRINDING POLISHING
Information Patent Grant
Method of measuring thickness of a semiconductor layer and method o...
- Patent number 6,645,045
- Issue date Nov 11, 2003
- Denso Corporation
- Makoto Ohkawa
- G01 - MEASURING TESTING
Information Patent Grant
Method of processing metal and method of manufacturing semiconducto...
- Patent number 6,645,875
- Issue date Nov 11, 2003
- Denso Corporation
- Makoto Ohkawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and method for manufacturing semiconductor device us...
- Patent number 6,279,585
- Issue date Aug 28, 2001
- Denso Corporation
- Satoshi Shiraki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device having thin-film resistor
- Patent number 5,989,970
- Issue date Nov 23, 1999
- Nippondenso Co., Ltd.
- Makoto Ohkawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device equipped with a heat-fusible thin film resisto...
- Patent number 5,625,218
- Issue date Apr 29, 1997
- Nippondenso Co., Ltd.
- Hideya Yamadera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with thin film resistor having reduced film th...
- Patent number 5,525,831
- Issue date Jun 11, 1996
- Nippondenso Co., Ltd.
- Makoto Ohkawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature sintering ceramic material composition and process...
- Patent number 4,829,029
- Issue date May 9, 1989
- Nippondenso Co., Ltd.
- Nobuaki Kawahara
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device and cutting equipment for cutting semiconducto...
- Publication number 20070235842
- Publication date Oct 11, 2007
- DENSO CORPORATION
- Makoto Ohkawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, cutting equipment for cutting semiconductor d...
- Publication number 20050082644
- Publication date Apr 21, 2005
- DENSO Corporation
- Makoto Ohkawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of measuring thickness of a semiconductor layer and method o...
- Publication number 20020173084
- Publication date Nov 21, 2002
- Makoto Ohkawa
- G01 - MEASURING TESTING
Information Patent Application
Method of etching metallic thin film on thin film resistor
- Publication number 20020115299
- Publication date Aug 22, 2002
- Ichiro Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of processing metal and method of manufacturing semiconducto...
- Publication number 20010029080
- Publication date Oct 11, 2001
- Makoto Ohkawa
- H01 - BASIC ELECTRIC ELEMENTS

Makoto Ohkawa

Person

Patents Grantslast 30 patents

Semiconductor device, cutting equipment for cutting semiconductor d...

Method of etching metallic thin film on thin film resistor

Method of etching metallic thin film on thin film resistor

Method for manufacturing semiconductor device by polishing

Method of measuring thickness of a semiconductor layer and method o...

Method of processing metal and method of manufacturing semiconducto...

Etching method and method for manufacturing semiconductor device us...

Method for fabricating semiconductor device having thin-film resistor

Semiconductor device equipped with a heat-fusible thin film resisto...

Semiconductor device with thin film resistor having reduced film th...

Low temperature sintering ceramic material composition and process...

Patents Applicationslast 30 patents

Semiconductor device and cutting equipment for cutting semiconducto...

Semiconductor device, cutting equipment for cutting semiconductor d...

Method of measuring thickness of a semiconductor layer and method o...

Method of etching metallic thin film on thin film resistor

Method of processing metal and method of manufacturing semiconducto...