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Makoto Shibuya
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Fuchu, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Flip chip packaged devices with thermal pad
Patent number
11,955,456
Issue date
Apr 9, 2024
Texas Instruments Incorporated
Anindya Poddar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having an interdigitated mold arrangement
Patent number
11,942,384
Issue date
Mar 26, 2024
Texas Instruments Incorporated
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leaded wafer chip scale packages
Patent number
11,848,244
Issue date
Dec 19, 2023
Texas Instruments Incorporated
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Double side heat dissipation for silicon chip package
Patent number
11,842,952
Issue date
Dec 12, 2023
Texas Instruments Incorporated
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor apparatus and method having a lead frame with floatin...
Patent number
11,764,142
Issue date
Sep 19, 2023
Texas Instruments Incorporated
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power converter module
Patent number
11,601,065
Issue date
Mar 7, 2023
Texas Instruments Incorporated
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with dies mounted on opposing surfaces of a leadframe
Patent number
11,574,855
Issue date
Feb 7, 2023
Texas Instruments Incorporated
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
IC package with half-bridge power module
Patent number
11,387,179
Issue date
Jul 12, 2022
Texas Instruments Incorporated
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor apparatus and method having a lead frame with floatin...
Patent number
11,217,522
Issue date
Jan 4, 2022
Texas Instruments Incorporated
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package with pre-wetted contact sidewall surfaces
Patent number
11,217,513
Issue date
Jan 4, 2022
Texas Instruments Incorporated
Daiki Komatsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with dies mounted on opposing surfaces of a leadframe
Patent number
11,088,055
Issue date
Aug 10, 2021
Texas Instruments Incorporated
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packages with wettable flanks and methods of man...
Patent number
11,062,980
Issue date
Jul 13, 2021
Texas Instruments Incorporated
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for an improved integrated circuit package
Patent number
11,004,742
Issue date
May 11, 2021
Texas Instruments Incorporated
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package with pre-wetted contact sidewall surfaces
Patent number
10,636,729
Issue date
Apr 28, 2020
Texas Instruments Incorporated
Daiki Komatsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low stress integrated circuit package
Patent number
10,566,269
Issue date
Feb 18, 2020
Texas Instruments Incorporated
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed repassivation for wafer chip scale packaging
Patent number
10,541,220
Issue date
Jan 21, 2020
Texas Instruments Incorporated
Daiki Komatsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated clip and lead and method of making a circuit
Patent number
10,283,409
Issue date
May 7, 2019
Texas Instruments Incorporated
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame assembly
Patent number
10,181,435
Issue date
Jan 15, 2019
Texas Instruments Incorporated
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package with sensor and method of making
Patent number
10,077,186
Issue date
Sep 18, 2018
Texas Instruments Incorporated
Makoto Shibuya
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Integrated circuit package with sensor and method of making
Patent number
9,688,530
Issue date
Jun 27, 2017
Texas Instruments Incorporated
Makoto Shibuya
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Integrated clip and lead and method of making a circuit
Patent number
9,673,097
Issue date
Jun 6, 2017
Texas Instruments Incorporated
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power module packaging with dual side cooling
Patent number
9,620,440
Issue date
Apr 11, 2017
Texas Instruments Incorporated
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic apparatus
Patent number
8,024,018
Issue date
Sep 20, 2011
Fujitsu Toshiba Mobile Communications Limited
Makoto Shibuya
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Power steering device for four-wheel drive vehicle
Patent number
7,717,224
Issue date
May 18, 2010
Fuji Jukogyo Kabashiki Kaisha
Takeshi Yoneda
B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information
Patent Grant
Torque distribution control system for a four-wheel drive motor veh...
Patent number
5,099,944
Issue date
Mar 31, 1992
Fuji Jukogyo Kabushiki Kaisha
Hayashi Kageyama
B60 - VEHICLES IN GENERAL
Patents Applications
last 30 patents
Information
Patent Application
LEADFRAME BASED POWER MODULE
Publication number
20240178104
Publication date
May 30, 2024
TEXAS INSTRUMENTS INCORPORATED
MAKOTO SHIBUYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING SAME
Publication number
20240128246
Publication date
Apr 18, 2024
TEXAS INSTRUMENTS INCORPORATED
Kwang-Soo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM
Publication number
20240120308
Publication date
Apr 11, 2024
TEXAS INSTRUMENTS INCORPORATED
Kwang-Soo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLD, LEAD FRAME, METHOD, AND ELECTRONIC DEVICE WITH EXPOSED DIE PA...
Publication number
20240105537
Publication date
Mar 28, 2024
TEXAS INSTRUMENTS INCORPORATED
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOVING BLADE CAVITY TECHNOLOGY FOR HIGH DENSE UNITS PER STRIP DESIGN
Publication number
20240055275
Publication date
Feb 15, 2024
TEXAS INSTRUMENTS INCORPORATED
Makoto Shibuya
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
POWER CONVERTER MODULE
Publication number
20230386963
Publication date
Nov 30, 2023
TEXAS INSTRUMENTS INCORPORATED
WOOCHAN KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECT BOND COPPER SUBSTRATE WITH METAL FILLED CERAMIC SUBSTRATE IN...
Publication number
20230307314
Publication date
Sep 28, 2023
TEXAS INSTRUMENTS INCORPORATED
Kwnag-Soo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE MEMBERS ATOP SEMICONDUCTOR PACKAGES
Publication number
20230275007
Publication date
Aug 31, 2023
TEXAS INSTRUMENTS INCORPORATED
Makoto SHIBUYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SENSOR PACKAGE WITH CAVITY CREATED USING SACRIFICIAL MATERIAL
Publication number
20230253281
Publication date
Aug 10, 2023
TEXAS INSTRUMENTS INCORPORATED
Daiki Komatsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC PACKAGE WITH FIELD EFFECT TRANSISTOR
Publication number
20230238350
Publication date
Jul 27, 2023
TEXAS INSTRUMENTS INCORPORATED
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER CONVERTER MODULE
Publication number
20230198422
Publication date
Jun 22, 2023
TEXAS INSTRUMENTS INCORPORATED
WOOCHAN KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADFRAME WITH PRE-SEPARATED LEADS
Publication number
20230133029
Publication date
May 4, 2023
Texas Instruments Incorporated
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING AN INTERDIGITATED MOLD ARRANGEMENT
Publication number
20230137762
Publication date
May 4, 2023
TEXAS INSTRUMENTS INCORPORATED
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADED WAFER CHIP SCALE PACKAGES
Publication number
20230095630
Publication date
Mar 30, 2023
TEXAS INSTRUMENTS INCORPORATED
Makoto SHIBUYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER CONVERTER MODULE
Publication number
20230060830
Publication date
Mar 2, 2023
TEXAS INSTRUMENTS INCORPORATED
WOOCHAN KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH RAISED DAM ON CLIP OR LEADFRAME
Publication number
20230038411
Publication date
Feb 9, 2023
Texas Instruments Incorporated
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP CHIP PACKAGED DEVICES WITH THERMAL PAD
Publication number
20230005880
Publication date
Jan 5, 2023
TEXAS INSTRUMENTS INCORPORATED
Anindya Poddar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES
Publication number
20220352055
Publication date
Nov 3, 2022
TEXAS INSTRUMENTS INCORPORATED
Makoto SHIBUYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR APPARATUS AND METHOD HAVING A LEAD FRAME WITH FLOATIN...
Publication number
20220230952
Publication date
Jul 21, 2022
TEXAS INSTRUMENTS INCORPORATED
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE WITH SURFACE CONTACT WIRE EXTENSIONS
Publication number
20220208660
Publication date
Jun 30, 2022
TEXAS INSTRUMENTS INCORPORATED
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE WITH DIES MOUNTED ON OPPOSING SURFACES OF A LEADFRAME
Publication number
20210375730
Publication date
Dec 2, 2021
TEXAS INSTRUMENTS INCORPORATED
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR AN IMPROVED INTEGRATED CIRCUIT PACKAGE
Publication number
20210265214
Publication date
Aug 26, 2021
TEXAS INSTRUMENTS INCORPORATED
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC PACKAGE WITH HALF-BRIDGE POWER MODULE
Publication number
20210175165
Publication date
Jun 10, 2021
TEXAS INSTRUMENTS INCORPORATED
MAKOTO SHIBUYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Double Side Heat Dissipation for Silicon Chip Package
Publication number
20210151365
Publication date
May 20, 2021
TEXAS INSTRUMENTS INCORPORATED
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR APPARATUS AND METHOD HAVING A LEAD FRAME WITH FLOATIN...
Publication number
20200395287
Publication date
Dec 17, 2020
TEXAS INSTRUMENTS INCORPORATED
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REPASSIVATION APPLICATION FOR WAFER-LEVEL CHIP-SCALE PACKAGE
Publication number
20200388508
Publication date
Dec 10, 2020
TEXAS INSTRUMENTS INCORPORATED
Makoto Shibuya
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Application
Integrated Circuit Package With Pre-Wetted Contact Sidewall Surfaces
Publication number
20200286816
Publication date
Sep 10, 2020
TEXAS INSTRUMENTS INCORPORATED
Daiki Komatsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE WITH DIES MOUNTED ON OPPOSING SURFACES OF A LEADFRAME
Publication number
20200194357
Publication date
Jun 18, 2020
TEXAS INSTRUMENTS INCORPORATED
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED REPASSIVATION FOR WAFER CHIP SCALE PACKAGING
Publication number
20200043878
Publication date
Feb 6, 2020
TEXAS INSTRUMENTS INCORPORATED
Daiki Komatsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER CHIP SCALE PACKAGING WITH BALL ATTACH BEFORE REPASSIVATION
Publication number
20200043778
Publication date
Feb 6, 2020
TEXAS INSTRUMENTS INCORPORATED
Daiki Komatsu
H01 - BASIC ELECTRIC ELEMENTS