Makoto Shibuya

Person

Fuchu, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Conductive members atop semiconductor packages
- Patent number 12,272,626
- Issue date Apr 8, 2025
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chip scale packaging with ball attach before repassivation
- Patent number 12,230,539
- Issue date Feb 18, 2025
- Texas Instruments Incorporated
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for an improved integrated circuit package
- Patent number 12,119,263
- Issue date Oct 15, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating wirebonded members on package surfaces
- Patent number 12,046,542
- Issue date Jul 23, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with surface contact wire extensions
- Patent number 12,040,260
- Issue date Jul 16, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip packaged devices with thermal pad
- Patent number 11,955,456
- Issue date Apr 9, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an interdigitated mold arrangement
- Patent number 11,942,384
- Issue date Mar 26, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leaded wafer chip scale packages
- Patent number 11,848,244
- Issue date Dec 19, 2023
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double side heat dissipation for silicon chip package
- Patent number 11,842,952
- Issue date Dec 12, 2023
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and method having a lead frame with floatin...
- Patent number 11,764,142
- Issue date Sep 19, 2023
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter module
- Patent number 11,601,065
- Issue date Mar 7, 2023
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with dies mounted on opposing surfaces of a leadframe
- Patent number 11,574,855
- Issue date Feb 7, 2023
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package with half-bridge power module
- Patent number 11,387,179
- Issue date Jul 12, 2022
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and method having a lead frame with floatin...
- Patent number 11,217,522
- Issue date Jan 4, 2022
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with pre-wetted contact sidewall surfaces
- Patent number 11,217,513
- Issue date Jan 4, 2022
- Texas Instruments Incorporated
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with dies mounted on opposing surfaces of a leadframe
- Patent number 11,088,055
- Issue date Aug 10, 2021
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with wettable flanks and methods of man...
- Patent number 11,062,980
- Issue date Jul 13, 2021
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for an improved integrated circuit package
- Patent number 11,004,742
- Issue date May 11, 2021
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with pre-wetted contact sidewall surfaces
- Patent number 10,636,729
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress integrated circuit package
- Patent number 10,566,269
- Issue date Feb 18, 2020
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed repassivation for wafer chip scale packaging
- Patent number 10,541,220
- Issue date Jan 21, 2020
- Texas Instruments Incorporated
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated clip and lead and method of making a circuit
- Patent number 10,283,409
- Issue date May 7, 2019
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame assembly
- Patent number 10,181,435
- Issue date Jan 15, 2019
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with sensor and method of making
- Patent number 10,077,186
- Issue date Sep 18, 2018
- Texas Instruments Incorporated
- Makoto Shibuya
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit package with sensor and method of making
- Patent number 9,688,530
- Issue date Jun 27, 2017
- Texas Instruments Incorporated
- Makoto Shibuya
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated clip and lead and method of making a circuit
- Patent number 9,673,097
- Issue date Jun 6, 2017
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module packaging with dual side cooling
- Patent number 9,620,440
- Issue date Apr 11, 2017
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus
- Patent number 8,024,018
- Issue date Sep 20, 2011
- Fujitsu Toshiba Mobile Communications Limited
- Makoto Shibuya
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Power steering device for four-wheel drive vehicle
- Patent number 7,717,224
- Issue date May 18, 2010
- Fuji Jukogyo Kabashiki Kaisha
- Takeshi Yoneda
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
Torque distribution control system for a four-wheel drive motor veh...
- Patent number 5,099,944
- Issue date Mar 31, 1992
- Fuji Jukogyo Kabushiki Kaisha
- Hayashi Kageyama
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
DUAL PACKAGE SWITCHING POWER DEVICE
- Publication number 20250079268
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SWITCHING POWER DEVICE
- Publication number 20250070101
- Publication date Feb 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Converter Package with Integrated Inductor
- Publication number 20250046684
- Publication date Feb 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES
- Publication number 20240379509
- Publication date Nov 14, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE FOR PRESS FIT ASSEMBLY
- Publication number 20240332141
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES
- Publication number 20240290676
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICES AND METHODS OF MAKING SAME
- Publication number 20240258214
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH VERTICALLY STACKED PASSIVE COMPONENT
- Publication number 20240258288
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME BASED POWER MODULE
- Publication number 20240178104
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- MAKOTO SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING SAME
- Publication number 20240128246
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM
- Publication number 20240120308
- Publication date Apr 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD, LEAD FRAME, METHOD, AND ELECTRONIC DEVICE WITH EXPOSED DIE PA...
- Publication number 20240105537
- Publication date Mar 28, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOVING BLADE CAVITY TECHNOLOGY FOR HIGH DENSE UNITS PER STRIP DESIGN
- Publication number 20240055275
- Publication date Feb 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
POWER CONVERTER MODULE
- Publication number 20230386963
- Publication date Nov 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- WOOCHAN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BOND COPPER SUBSTRATE WITH METAL FILLED CERAMIC SUBSTRATE IN...
- Publication number 20230307314
- Publication date Sep 28, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Kwnag-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MEMBERS ATOP SEMICONDUCTOR PACKAGES
- Publication number 20230275007
- Publication date Aug 31, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE WITH CAVITY CREATED USING SACRIFICIAL MATERIAL
- Publication number 20230253281
- Publication date Aug 10, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH FIELD EFFECT TRANSISTOR
- Publication number 20230238350
- Publication date Jul 27, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER MODULE
- Publication number 20230198422
- Publication date Jun 22, 2023
- TEXAS INSTRUMENTS INCORPORATED
- WOOCHAN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME WITH PRE-SEPARATED LEADS
- Publication number 20230133029
- Publication date May 4, 2023
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN INTERDIGITATED MOLD ARRANGEMENT
- Publication number 20230137762
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADED WAFER CHIP SCALE PACKAGES
- Publication number 20230095630
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER MODULE
- Publication number 20230060830
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- WOOCHAN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH RAISED DAM ON CLIP OR LEADFRAME
- Publication number 20230038411
- Publication date Feb 9, 2023
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGED DEVICES WITH THERMAL PAD
- Publication number 20230005880
- Publication date Jan 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES
- Publication number 20220352055
- Publication date Nov 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD HAVING A LEAD FRAME WITH FLOATIN...
- Publication number 20220230952
- Publication date Jul 21, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH SURFACE CONTACT WIRE EXTENSIONS
- Publication number 20220208660
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH DIES MOUNTED ON OPPOSING SURFACES OF A LEADFRAME
- Publication number 20210375730
- Publication date Dec 2, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR AN IMPROVED INTEGRATED CIRCUIT PACKAGE
- Publication number 20210265214
- Publication date Aug 26, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS

Makoto Shibuya

Person

Patents Grantslast 30 patents

Conductive members atop semiconductor packages

Wafer chip scale packaging with ball attach before repassivation

Methods and apparatus for an improved integrated circuit package

Heat-dissipating wirebonded members on package surfaces

Electronic package with surface contact wire extensions

Flip chip packaged devices with thermal pad

Semiconductor package having an interdigitated mold arrangement

Leaded wafer chip scale packages

Double side heat dissipation for silicon chip package

Semiconductor apparatus and method having a lead frame with floatin...

Power converter module

Package with dies mounted on opposing surfaces of a leadframe

IC package with half-bridge power module

Semiconductor apparatus and method having a lead frame with floatin...

Integrated circuit package with pre-wetted contact sidewall surfaces

Package with dies mounted on opposing surfaces of a leadframe

Integrated circuit packages with wettable flanks and methods of man...

Methods and apparatus for an improved integrated circuit package

Integrated circuit package with pre-wetted contact sidewall surfaces

Low stress integrated circuit package

Printed repassivation for wafer chip scale packaging

Integrated clip and lead and method of making a circuit

Lead frame assembly

Integrated circuit package with sensor and method of making

Integrated circuit package with sensor and method of making

Integrated clip and lead and method of making a circuit

Power module packaging with dual side cooling

Electronic apparatus

Power steering device for four-wheel drive vehicle

Torque distribution control system for a four-wheel drive motor veh...

Patents Applicationslast 30 patents

DUAL PACKAGE SWITCHING POWER DEVICE

DUAL SWITCHING POWER DEVICE

Converter Package with Integrated Inductor

HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES

SEMICONDUCTOR DEVICE PACKAGE FOR PRESS FIT ASSEMBLY

SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES

PACKAGED ELECTRONIC DEVICES AND METHODS OF MAKING SAME

SEMICONDUCTOR DEVICE PACKAGE WITH VERTICALLY STACKED PASSIVE COMPONENT

LEADFRAME BASED POWER MODULE

SEMICONDUCTOR DEVICES AND METHODS OF MAKING SAME

STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM

MOLD, LEAD FRAME, METHOD, AND ELECTRONIC DEVICE WITH EXPOSED DIE PA...

MOVING BLADE CAVITY TECHNOLOGY FOR HIGH DENSE UNITS PER STRIP DESIGN

POWER CONVERTER MODULE

DIRECT BOND COPPER SUBSTRATE WITH METAL FILLED CERAMIC SUBSTRATE IN...

CONDUCTIVE MEMBERS ATOP SEMICONDUCTOR PACKAGES

SENSOR PACKAGE WITH CAVITY CREATED USING SACRIFICIAL MATERIAL

IC PACKAGE WITH FIELD EFFECT TRANSISTOR

POWER CONVERTER MODULE

LEADFRAME WITH PRE-SEPARATED LEADS

SEMICONDUCTOR PACKAGE HAVING AN INTERDIGITATED MOLD ARRANGEMENT

LEADED WAFER CHIP SCALE PACKAGES

POWER CONVERTER MODULE

SEMICONDUCTOR PACKAGE WITH RAISED DAM ON CLIP OR LEADFRAME

FLIP CHIP PACKAGED DEVICES WITH THERMAL PAD

HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES

SEMICONDUCTOR APPARATUS AND METHOD HAVING A LEAD FRAME WITH FLOATIN...

ELECTRONIC PACKAGE WITH SURFACE CONTACT WIRE EXTENSIONS

PACKAGE WITH DIES MOUNTED ON OPPOSING SURFACES OF A LEADFRAME

METHODS AND APPARATUS FOR AN IMPROVED INTEGRATED CIRCUIT PACKAGE