Mamoru Kobayashi

Person

Hadano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Solder bump measuring method and apparatus
- Patent number 6,340,109
- Issue date Jan 22, 2002
- Hitachi, Ltd.
- Yutaka Hashimoto
- G01 - MEASURING TESTING
Information Patent Grant
Solder bump measuring method and apparatus
- Patent number 6,196,441
- Issue date Mar 6, 2001
- Hitachi, Ltd.
- Yutaka Hashimoto
- G01 - MEASURING TESTING
Information Patent Grant
Solder bump measuring method and apparatus
- Patent number 5,906,309
- Issue date May 25, 1999
- Hitachi, Ltd.
- Yutaka Hashimoto
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuit board assembling system
- Patent number 5,329,690
- Issue date Jul 19, 1994
- Hitachi, Ltd.
- Yoshihisa Tsuji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Computer-integrated manufacturing system and method
- Patent number 5,231,585
- Issue date Jul 27, 1993
- Hitachi Ltd.
- Mamoru Kobayashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board with a uniform conductive layer formed by equ...
- Patent number 5,023,407
- Issue date Jun 11, 1991
- Hitachi, Ltd.
- Mitugu Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for aligning solder balls
- Patent number 4,871,110
- Issue date Oct 3, 1989
- Hitachi, Ltd.
- Hideyuki Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component alignment method
- Patent number 4,672,209
- Issue date Jun 9, 1987
- Hitachi, Ltd.
- Koichi Karasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component alignment apparatus
- Patent number 4,608,494
- Issue date Aug 26, 1986
- Hitachi, Ltd.
- Mamoru Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic wiring machine for printed circuit boards
- Patent number 4,437,603
- Issue date Mar 20, 1984
- Hitachi, Ltd.
- Mamoru Kobayashi
- G05 - CONTROLLING REGULATING

Patents Applicationslast 30 patents

Information Patent Application
Solder bump measuring method and apparatus
- Publication number 20010000904
- Publication date May 10, 2001
- Hitachi, Ltd.
- Yutaka Hashimoto
- G01 - MEASURING TESTING

Mamoru Kobayashi

Person

Patents Grantslast 30 patents

Solder bump measuring method and apparatus

Solder bump measuring method and apparatus

Solder bump measuring method and apparatus

Printed circuit board assembling system

Computer-integrated manufacturing system and method

Printed circuit board with a uniform conductive layer formed by equ...

Method and apparatus for aligning solder balls

Component alignment method

Component alignment apparatus

Automatic wiring machine for printed circuit boards

Patents Applicationslast 30 patents

Solder bump measuring method and apparatus