Mamoru Kurashina

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate, method for manufacturing wiring substrate, electr...
- Patent number 9,754,830
- Issue date Sep 5, 2017
- Fujitsu Limited
- Taiga Fukumori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and semiconductor mountin...
- Patent number 9,326,372
- Issue date Apr 26, 2016
- Fujitsu Limited
- Mamoru Kurashina
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric circuit apparatus and manufacturing method therefor
- Patent number 9,055,685
- Issue date Jun 9, 2015
- Fujitsu Limited
- Mamoru Kurashina
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method and semiconductor mountin...
- Patent number 9,048,332
- Issue date Jun 2, 2015
- Fujitsu Limited
- Mamoru Kurashina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilevel interconnection board and method of fabricating the same
- Patent number 8,257,542
- Issue date Sep 4, 2012
- Fujitsu Limited
- Keishiro Okamoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilevel interconnection board and method of fabricating the same
- Patent number 7,622,184
- Issue date Nov 24, 2009
- Fujitsu Limited
- Keishiro Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layer capacitor element and production process as well as electroni...
- Patent number 7,405,921
- Issue date Jul 29, 2008
- Fujitsu Limited
- Kazuaki Kurihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer capacitor element and production process as well as electroni...
- Patent number 7,161,793
- Issue date Jan 9, 2007
- Fujitsu Limited
- Kazuaki Kurihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for production of optical module and optical module
- Patent number 7,097,366
- Issue date Aug 29, 2006
- Fujitsu Limited
- Tsuyoshi Aoki
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, ELECTR...
- Publication number 20160233128
- Publication date Aug 11, 2016
- Fujitsu Limited
- Taiga Fukumori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MOUNTIN...
- Publication number 20150216040
- Publication date Jul 30, 2015
- Fujitsu Limited
- Mamoru Kurashina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MOUNTIN...
- Publication number 20140264935
- Publication date Sep 18, 2014
- Fujitsu Limited
- Mamoru Kurashina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, ELECTR...
- Publication number 20140021609
- Publication date Jan 23, 2014
- Taiga Fukumori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC CIRCUIT APPARATUS AND MANUFACTURING METHOD THEREFOR
- Publication number 20140022751
- Publication date Jan 23, 2014
- Fujitsu Limited
- Mamoru Kurashina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILEVEL INTERCONNECTION BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20100024963
- Publication date Feb 4, 2010
- Fujitsu Limited
- Keishiro Okamoto
- B32 - LAYERED PRODUCTS
Information Patent Application
Multilayer interconnection substrate, semiconductor device, and sol...
- Publication number 20070221400
- Publication date Sep 27, 2007
- FUJITSU LIMITED
- Mamoru Kurashina
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilevel interconnection board and method of fabricating the same
- Publication number 20070077391
- Publication date Apr 5, 2007
- FUJITSU LIMITED
- Keishiro Okamoto
- B32 - LAYERED PRODUCTS
Information Patent Application
Layer capacitor element and production process as well as electroni...
- Publication number 20060250749
- Publication date Nov 9, 2006
- FUJITSU LIMITED
- Kazuaki Kurihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board and manufacturing method thereof that can easily prov...
- Publication number 20050109533
- Publication date May 26, 2005
- FUJITSU LIMITED
- Mamoru Kurashina
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for production of optical module and optical module
- Publication number 20050069274
- Publication date Mar 31, 2005
- FUJITSU LIMITED
- Tsuyoshi Aoki
- G02 - OPTICS
Information Patent Application
Layer capacitor element and production process as well as electroni...
- Publication number 20040130849
- Publication date Jul 8, 2004
- Kazuaki Kurihara
- H01 - BASIC ELECTRIC ELEMENTS

Mamoru Kurashina

Person

Patents Grantslast 30 patents

Wiring substrate, method for manufacturing wiring substrate, electr...

Semiconductor device manufacturing method and semiconductor mountin...

Electric circuit apparatus and manufacturing method therefor

Semiconductor device manufacturing method and semiconductor mountin...

Multilevel interconnection board and method of fabricating the same

Multilevel interconnection board and method of fabricating the same

Layer capacitor element and production process as well as electroni...

Layer capacitor element and production process as well as electroni...

Method for production of optical module and optical module

Patents Applicationslast 30 patents

WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, ELECTR...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MOUNTIN...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MOUNTIN...

WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, ELECTR...

ELECTRIC CIRCUIT APPARATUS AND MANUFACTURING METHOD THEREFOR

MULTILEVEL INTERCONNECTION BOARD AND METHOD OF FABRICATING THE SAME

Multilayer interconnection substrate, semiconductor device, and sol...

Multilevel interconnection board and method of fabricating the same

Layer capacitor element and production process as well as electroni...

Circuit board and manufacturing method thereof that can easily prov...

Method for production of optical module and optical module

Layer capacitor element and production process as well as electroni...