Mamoru Mita

Person

Hitachi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating an electronic device substrate
- Patent number 8,230,591
- Issue date Jul 31, 2012
- Hitachi Cable, Ltd.
- Akira Chinda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic device substrate and its fabrication method, and electro...
- Patent number 8,101,864
- Issue date Jan 24, 2012
- Hitachi Cable, Ltd.
- Akira Chinda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Lead frame, method of making the same and light receiving/emitting...
- Patent number 7,888,697
- Issue date Feb 15, 2011
- Hitachi Cable Precision Co., Ltd.
- Tadashi Kawanobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a multilayer wiring board, multilayer wiring...
- Patent number 7,780,836
- Issue date Aug 24, 2010
- Hitachi Cable, Ltd.
- Akira Chinda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, method for manufacturing wiring board and electronic...
- Patent number 7,268,408
- Issue date Sep 11, 2007
- Hitachi Cable Ltd.
- Akira Chinda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit tape having adhesive film semiconductor device and a method...
- Patent number 7,202,570
- Issue date Apr 10, 2007
- Renesas Technology Corp.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring tape for semiconductor device including a buffer layer havin...
- Patent number 7,038,325
- Issue date May 2, 2006
- Hitachi Cable, Ltd.
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit tape having adhesive film, semiconductor device, and a meth...
- Patent number 6,791,194
- Issue date Sep 14, 2004
- Hitachi, Ltd.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, tab tape for semiconductor device, method of...
- Patent number 6,506,627
- Issue date Jan 14, 2003
- Hitachi Cable, Ltd.
- Gen Murakamz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, lead-patterning substrate, and electronics de...
- Patent number 6,433,409
- Issue date Aug 13, 2002
- Hitachi Cable Ltd.
- Mamoru Mita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a porous buffer layer for semiconductor...
- Patent number 6,433,440
- Issue date Aug 13, 2002
- Hitachi, Ltd.
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, lead-patterning substrate, and electronics de...
- Patent number 6,426,548
- Issue date Jul 30, 2002
- Hitachi Cable Ltd.
- Mamoru Mita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, tab tape for semiconductor device, method of...
- Patent number 6,323,058
- Issue date Nov 27, 2001
- Hitachi Cable Ltd.
- Gen Murakamz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,297,073
- Issue date Oct 2, 2001
- Hitachi, Ltd.
- Makoto Kitano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding a semiconductor chip to a lead-patterning substr...
- Patent number 6,297,142
- Issue date Oct 2, 2001
- Hitachi Cable Ltd.
- Mamoru Mita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode structure of a wiring substrate of semiconductor device h...
- Patent number 6,137,185
- Issue date Oct 24, 2000
- Hitachi, Ltd.
- Masakazu Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,130,112
- Issue date Oct 10, 2000
- Hitachi, Ltd.
- Makoto Kitano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit tape having adhesive film, semiconductor device, and a meth...
- Patent number 6,114,753
- Issue date Sep 5, 2000
- Hitachi, Ltd.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,049,128
- Issue date Apr 11, 2000
- Hitachi, Ltd.
- Makoto Kitano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, interposer for semiconductor device
- Patent number 6,031,292
- Issue date Feb 29, 2000
- Hitachi Cable, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode structure of wiring substrate of semiconductor device hav...
- Patent number 5,886,409
- Issue date Mar 23, 1999
- Hitachi, Ltd.
- Masakazu Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer for semiconductor device
- Patent number 5,866,948
- Issue date Feb 2, 1999
- Hitachi Cable, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing double-sided circuit tape carrier
- Patent number 5,837,154
- Issue date Nov 17, 1998
- Hitachi Cable, Ltd.
- Norio Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal layer wiring tab tape carrier and process for fabricati...
- Patent number 5,589,668
- Issue date Dec 31, 1996
- Hitachi Cable, Ltd.
- Kenji Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing composite lead frame
- Patent number 5,428,889
- Issue date Jul 4, 1995
- Hitachi Cable, Ltd.
- Mamoru Mita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite lead frame with connected inner and outer leads
- Patent number 5,326,990
- Issue date Jul 5, 1994
- Hitachi Cable, Ltd.
- Mamoru Mita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High pin count and multi-layer wiring lead frame
- Patent number 5,196,725
- Issue date Mar 23, 1993
- Hitachi Cable Limited
- Mamoru Mita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for applying chemical plating to inner surfaces of tubula...
- Patent number 4,309,959
- Issue date Jan 12, 1982
- Hitachi, Ltd.
- Ryozo Yamagishi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE SUBSTRATE AND ITS FABRICATION METHOD, AND ELECTRO...
- Publication number 20090211796
- Publication date Aug 27, 2009
- HITACHI CABLE, LTD.
- Akira Chinda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, METHOD OF MAKING THE SAME AND LIGHT RECEIVING/EMITTING...
- Publication number 20090141498
- Publication date Jun 4, 2009
- HITACHI CABLE PRECISION CO., LTD.
- Tadashi KAWANOBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device substrate and its fabrication method, and electro...
- Publication number 20080201943
- Publication date Aug 28, 2008
- HITACHI CABLE, LTD.
- Akira Chinda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device substrate and its fabrication method, and electro...
- Publication number 20060225918
- Publication date Oct 12, 2006
- HITACHI CABLE, LTD.
- Akira Chinda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit tape having adhesive film semiconductor device and a method...
- Publication number 20040224149
- Publication date Nov 11, 2004
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring tape for semiconductor device including a buffer layer havin...
- Publication number 20040195702
- Publication date Oct 7, 2004
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring board, method for manufacturing wiring board and electronic...
- Publication number 20030178713
- Publication date Sep 25, 2003
- Akira Chinda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit tape having adhesive film, semiconductor device, and a meth...
- Publication number 20020160185
- Publication date Oct 31, 2002
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and wiring tape for semiconductor device
- Publication number 20020158343
- Publication date Oct 31, 2002
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, lead-patterning substrate, and electronics de...
- Publication number 20010002066
- Publication date May 31, 2001
- Hitachi Cable Ltd.
- Mamoru Mita
- H01 - BASIC ELECTRIC ELEMENTS

Mamoru Mita

Person

Patents Grantslast 30 patents

Method for fabricating an electronic device substrate

Electronic device substrate and its fabrication method, and electro...

Lead frame, method of making the same and light receiving/emitting...

Method for fabricating a multilayer wiring board, multilayer wiring...

Wiring board, method for manufacturing wiring board and electronic...

Circuit tape having adhesive film semiconductor device and a method...

Wiring tape for semiconductor device including a buffer layer havin...

Circuit tape having adhesive film, semiconductor device, and a meth...

Semiconductor device, tab tape for semiconductor device, method of...

Semiconductor device, lead-patterning substrate, and electronics de...

Semiconductor device having a porous buffer layer for semiconductor...

Semiconductor device, lead-patterning substrate, and electronics de...

Semiconductor device, tab tape for semiconductor device, method of...

Semiconductor device

Method for bonding a semiconductor chip to a lead-patterning substr...

Electrode structure of a wiring substrate of semiconductor device h...

Semiconductor device

Circuit tape having adhesive film, semiconductor device, and a meth...

Semiconductor device

Semiconductor device, interposer for semiconductor device

Electrode structure of wiring substrate of semiconductor device hav...

Interposer for semiconductor device

Method of manufacturing double-sided circuit tape carrier

Multi-metal layer wiring tab tape carrier and process for fabricati...

Method for manufacturing composite lead frame

Composite lead frame with connected inner and outer leads

High pin count and multi-layer wiring lead frame

Apparatus for applying chemical plating to inner surfaces of tubula...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE SUBSTRATE AND ITS FABRICATION METHOD, AND ELECTRO...

LEAD FRAME, METHOD OF MAKING THE SAME AND LIGHT RECEIVING/EMITTING...

Electronic device substrate and its fabrication method, and electro...

Electronic device substrate and its fabrication method, and electro...

Circuit tape having adhesive film semiconductor device and a method...

Wiring tape for semiconductor device including a buffer layer havin...

Wiring board, method for manufacturing wiring board and electronic...

Circuit tape having adhesive film, semiconductor device, and a meth...

Semiconductor device and wiring tape for semiconductor device

Semiconductor device, lead-patterning substrate, and electronics de...