Mamoru Okada

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Nagano-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing semiconductor wafer and semiconductor wafer
- Patent number 7,507,146
- Issue date Mar 24, 2009
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer thinning method, and thin semiconductor wafer
- Patent number 6,930,023
- Issue date Aug 16, 2005
- Shin-Etsu Handotai Co, Ltd.
- Mamoru Okada
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad, polishing method, and polishing machine for mirror-p...
- Patent number 6,306,021
- Issue date Oct 23, 2001
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Method for Producing Semiconductor Wafer and Semiconductor Wafer
- Publication number 20080096474
- Publication date Apr 24, 2008
- SHIN-ETSU HANDOTAI CO., LTD.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor wafer thinning method, and thin semiconductor wafer
- Publication number 20030113984
- Publication date Jun 19, 2003
- Mamoru Okada
- B24 - GRINDING POLISHING
Information Patent Application
Polishing pad, polishing method, and polishing machine for mirror-p...
- Publication number 20020031990
- Publication date Mar 14, 2002
- Shin-Estu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING