Man K. Lam

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Colorado Springs, CO, US

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Patents Grantslast 30 patents

Information Patent Grant
High performance multi-component electronics power module
- Patent number 10,903,148
- Issue date Jan 26, 2021
- Microchip Technology Incorporated
- Man Kit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) die attached between an offset lead frame d...
- Patent number 10,553,524
- Issue date Feb 4, 2020
- Microchip Technology Incorporated
- Man Kit Lam
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Carrierles surface mounted integrated circuit die
- Patent number 5,138,115
- Issue date Aug 11, 1992
- Atmel Corporation
- Man K. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a repairable multi-chip module
- Patent number 5,137,836
- Issue date Aug 11, 1992
- Atmel Corporation
- Man K. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a carrierless surface mounted integrated circuit die
- Patent number 5,079,835
- Issue date Jan 14, 1992
- Atmel Corporation
- Man K. Lam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
High Performance Multi-Component Electronics Power Module
- Publication number 20190311977
- Publication date Oct 10, 2019
- MICROCHIP TECHNOLOGY INCORPORATED
- Man Kit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Wafer Cutting Using A Polymer Coating To Reduce Physi...
- Publication number 20190131247
- Publication date May 2, 2019
- MICROCHIP TECHNOLOGY INCORPORATED
- Man Kit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit (IC) Die Attached Between An Offset Lead Frame D...
- Publication number 20190131216
- Publication date May 2, 2019
- MICROCHIP TECHNOLOGY INCORPORATED
- Man Kit Lam
- H01 - BASIC ELECTRIC ELEMENTS