MAN-ZHI PENG

Person

Shenzhen, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Camera module of reduced size and method for manufacturing the same
- Patent number 11,917,278
- Issue date Feb 27, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Man-Zhi Peng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Adapter board and method for making adapter board
- Patent number 11,665,820
- Issue date May 30, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Man-Zhi Peng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting structure
- Patent number 11,510,319
- Issue date Nov 22, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Rui-Wu Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for connecting stacked circuit boards
- Patent number 11,483,938
- Issue date Oct 25, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Rui-Wu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board-to-board connecting structure and method for manufacturing th...
- Patent number 11,310,922
- Issue date Apr 19, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Rui-Wu Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Edge-to-edge board connection structure
- Patent number 11,296,444
- Issue date Apr 5, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Ming-Jaan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 11,252,818
- Issue date Feb 15, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Rui-Wu Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for connecting stacked circuits boards
- Patent number 11,051,404
- Issue date Jun 29, 2021
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Rui-Wu Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing interposer
- Patent number 10,910,300
- Issue date Feb 2, 2021
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Man-Zhi Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bendable circuit board and method for manufacturing the same
- Patent number 10,863,620
- Issue date Dec 8, 2020
- Avary Holding (Shenzhen) Co., Limited.
- Ming-Jaan Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 10,849,229
- Issue date Nov 24, 2020
- Avary Holding (Shenzhen) Co., Limited.
- Rui-Wu Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM-IN-PACKAGE MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240203899
- Publication date Jun 20, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- MAN-ZHI PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER, MANUFACTURING METHOD THEREFOR, AND CIRCUIT BOARD ASSEMBLY
- Publication number 20220336230
- Publication date Oct 20, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- MAN-ZHI PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE OF REDUCED SIZE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220232152
- Publication date Jul 21, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- MAN-ZHI PENG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ADAPTER BOARD AND METHOD FOR MAKING ADAPTER BOARD
- Publication number 20220087020
- Publication date Mar 17, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- MAN-ZHI PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD-TO-BOARD CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING TH...
- Publication number 20220061167
- Publication date Feb 24, 2022
- Avary Holding (Shenzhen) Co., Limited.
- RUI-WU LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD-TO-BOARD CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20220052471
- Publication date Feb 17, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- MING-JAAN HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRUCTURE
- Publication number 20210289628
- Publication date Sep 16, 2021
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- Rui-Wu LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADAPTER BOARD AND METHOD FOR MAKING ADAPTOR BOARD
- Publication number 20210235581
- Publication date Jul 29, 2021
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- MAN-ZHI PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING INTERPOSER
- Publication number 20210028099
- Publication date Jan 28, 2021
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- MAN-ZHI PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200253056
- Publication date Aug 6, 2020
- Avary Holding (Shenzhen) Co., Limited.
- RUI-WU LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING STRUCTURE AND METHOD FOR CONNECTING STACKED CIRCUITS BOA...
- Publication number 20200146149
- Publication date May 7, 2020
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- RUI-WU LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200137888
- Publication date Apr 30, 2020
- Avary Holding (Shenzhen) Co., Limited.
- RUI-WU LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CONNECTING STACKED CIRCUIT BOARDS
- Publication number 20200107455
- Publication date Apr 2, 2020
- Avary Holding (Shenzhen) Co., Limited.
- RUI-WU LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

MAN-ZHI PENG

Person

Patents Grantslast 30 patents

Camera module of reduced size and method for manufacturing the same

Adapter board and method for making adapter board

Connecting structure

Method for connecting stacked circuit boards

Board-to-board connecting structure and method for manufacturing th...

Edge-to-edge board connection structure

Printed circuit board and method for manufacturing the same

Method for connecting stacked circuits boards

Method for manufacturing interposer

Bendable circuit board and method for manufacturing the same

Printed circuit board and method for manufacturing the same

Patents Applicationslast 30 patents

SYSTEM-IN-PACKAGE MODULE AND METHOD FOR MANUFACTURING THE SAME

INTERPOSER, MANUFACTURING METHOD THEREFOR, AND CIRCUIT BOARD ASSEMBLY

CAMERA MODULE OF REDUCED SIZE AND METHOD FOR MANUFACTURING THE SAME

ADAPTER BOARD AND METHOD FOR MAKING ADAPTER BOARD

BOARD-TO-BOARD CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING TH...

BOARD-TO-BOARD CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING SAME

CONNECTING STRUCTURE

ADAPTER BOARD AND METHOD FOR MAKING ADAPTOR BOARD

METHOD FOR MANUFACTURING INTERPOSER

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

CONNECTING STRUCTURE AND METHOD FOR CONNECTING STACKED CIRCUITS BOA...

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR CONNECTING STACKED CIRCUIT BOARDS