Patent Application
20240203899
The subject matter herein generally relates to the field of semiconductor manufacture, in particular, to a system-in-package module and a method for manufacturing a system-in-package module.
A system-in-package (SiP) may include a plurality of circuit (IC) chips and/or other circuit components in one semiconductor package to implement one system. Such package typically includes an epoxy molding compound (EMC) that encapsulates the IC chips and other circuit components and an electromagnetic interference (EMI) shield for reducing EMI emission from the package. The EMC is generally formed to encapsulate the IC chips and other components by using a compress molding process or a transfer molding that requires professional molding equipment which is expensive.
Implementations of the present technology will now be described, by way of embodiment, with reference to the attached figures.
the present disclosure.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.
Several definitions that apply throughout this disclosure will now be presented.
The term “connected” is defined as connected, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections. The connection can be such that the objects are permanently connected or releasably connected. The term “substantially” is defined to be essentially conforming to the particular dimension, shape, or other feature that the term modifies, such that the component need not be exact. For example, “substantially cylindrical” means that the object resembles a cylinder, but can have one or more deviations from a true cylinder. The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series, and the like.
Referring to
Step S1, referring to
In the embodiment, the number of the insulation layer 11 is one, and the number of the circuit layer 12 and the protective layer 13 are both two. The two circuit layers 12 are disposed on opposite surfaces of the insulation layer 11, and each of the two protective layer 13 is disposed on a surface of a corresponding one of the two circuit layers 12 facing away from the insulation layer 11. In other embodiments, the number of the insulation layer 11 may be more than one, the number of the circuit layer 12 may be one or more than two, and the number of the protective layer 13 is the same as the number of the circuit layer 12 outside the carrier plate 10.
The insulation layer 11 can be made of liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), Polyether ether ketone (PEEK), polyphenylene oxide (PPO), polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyethylene (PE), etc.
The protective layer 13 may be a cover layer (CVL) or a solder mask for protecting the circuit layer 12.
Specifically, the carrier plate 10 is provided by steps as follows.
Step S11, referring to
The material of the metal layers 102 may be gold, silver, copper, etc. In the embodiment, the material of the metal layer 102 is copper.
Step S12, referring to
Step S13, the protective layer 13 is formed on the surface of the circuit layer 12 facing away from the insulation layer 11, thereby obtaining the carrier plate 10. The connecting pads 121 are exposed from the protective layer 13.
When the protective layer 13 is a cover layer, the cover layer is attached to the surface of the circuit layer 12 by bonding. When the protective layer 13 is a solder mask, the solder mask is formed on the surface of the circuit layer 12 by printing of solder mask ink.
Step S2, referring to
The electronic components 20 includes an active component and/or a passive component. The number of the active component and passive component is not limited and can be one or more.
The electronic components 20 may be mounted on the connecting pads 121 by surface mounting technology.
Step S3, referring to
The plastic encapsulation film 30 has an elongation at break that is in a range of 60% to 150%, so that the plastic encapsulation film 30 will not be ruptured by the electronic components 20 during the subsequent pressing process. The plastic encapsulation film 30 also has a water absorption rate of less than 0.5%, and a thickness in a range of 50 μm to 500 μm.
The plastic encapsulation film 30 includes a resin with a mass percentage of 50% to 80% and an inorganic filler with a mass percentage of 10% to 30%. The resin includes epoxy resin, ethyl acrylate, amino ethyl formate, or other resin materials with high ductility. The inorganic filler includes silica, alumina, hydrated alumina, titanium oxide, magnesium oxide, magnesium hydroxide, alumina doped silica, boehmite, or other known inorganic fillers. The plastic encapsulation film 30 may also include, but is not limited, conventional additives, such as hardeners, catalysts, flame retardants, coupling agents, release agents, etc.
Step S4, referring to
The electromagnetic shielding film 40 includes an electromagnetic shielding layer 41 and a release film 42 stacked on the electromagnetic shielding layer 41. The electromagnetic shielding layer 41 includes metal materials. In the embodiment, the electromagnetic shielding layer 41 is a conductive fabric. In other embodiments, the electromagnetic shielding layer 41 is a metal layer.
The electromagnetic shielding film 40 can be processed by punching to have the predetermined shape. The electromagnetic shielding film 40 with the preset shape only shields the parts of an element that need to be shielded, achieving regional shielding. When the electromagnetic shielding film 40 with the preset shape is used, a part of the element that needs to be shielded is equipped with the electromagnetic shielding film 40, and the other part of the element that does not need to be shielded is exposed from the electromagnetic shielding film 40. When the entire element needs to be shielded, the electromagnetic shielding film 40 does not need to be processed, and the shape of the electromagnetic shielding film 40 is the same as the shape of the plastic encapsulation film 30.
Step S5, referring to
During pressing, the plastic encapsulation film 30 is heated and thus is melt, such that the plastic encapsulation film 30 can tightly fit with the electromagnetic shielding layer 41 to form the composite structure.
Step S6, referring to
If the electromagnetic shielding film 40 is processed into a predetermined shape, a portion of the surface of the carrier plate 10 exposed from the electronic components 20 is exposed from the electromagnetic shielding film 40 after the composite structure is pressed onto the carrier plate 10. In other embodiments, part of the surface of the carrier plate 10 exposed from the electronic components 20 is also covered by the electromagnetic shielding film 40 after the composite structure is pressed onto the carrier plate 10. That is, the electromagnetic shielding film 40 covers an entirety of the plastic encapsulation film 30 and an entirety of the carrier plate 10.
The composite structure is pressed onto the carrier plate 10 by using a conventional vacuum pressing process in a manufacturing process of a circuit board. Compared to the compress molding process or transfer molding process, there is no need for professional molding equipment, thereby reducing costs.
Step S7, referring to
Step S8, referring to
The ground hole 60 may be formed by mechanical drilling or laser drilling. The ground hole 60 can be, but is not limited to, round, rectangular, prismatic, ring-shaped, etc.
Step S9, referring to
The conductive paste 61 includes a pillar 611 and a cap 612. The pillar 611 is infilled into the ground hole 60 and electrically connected to circuit layer 12. The cap 612 covers a portion of the electromagnetic shielding layer 41 located around the ground hole 60 and is electrically connected to the electromagnetic shielding layer 41.
In one embodiment, the conductive paste 60 is infilled into the ground hole 60 by a glue dispensing process. In the glue dispensing process, a cap 612 is naturally formed at one end of the pillar 611 by using the fluidity of conductive paste, improving firmness of the conductive glue 61.
The conductive paste 61 has a viscosity of less than 6000 cps, which helps to fill the ground hole 60 with the conductive paste 61 by the glue dispensing process. The conductive paste 61 may be, but is not limited to, copper paste or silver paste.
Referring to
The carrier plate 10 includes the insulation layer 11, the circuit layer 12, and the protective layer 13. The circuit layer 12 is disposed on a surface of the insulation layer 11, and the protective layer 13 is disposed on the surface of the circuit layer 12 facing away from the insulation layer 11. The circuit layer 12 includes the plurality of connecting pads 121 which are exposed from the protective layer 13. The plurality of electronic components 20 is soldered on the plurality of connecting pads 121.
The plastic encapsulation film 30 has an elongation at break in a range of 60% to 150%, a water absorption rate of less than 0.5%, and a thickness in a range of 50 μm to 500 μm.
The plastic encapsulation film 30 includes the resin with a mass percentage of 50% to 80% and the inorganic filler with a mass percentage of 10% to 30%. The plastic encapsulation film 30 may also include, but is not limited, conventional additives, such as hardeners, catalysts, flame retardants, coupling agents, release agents, etc.
The electromagnetic shielding layer 41 defines the ground hole 60, and the
ground hole 60 extends through the plastic encapsulation film 30. The ground hole 60 is infilled with conductive paste 61. The conductive paste 61 is connected to the circuit layer 12 and the electromagnetic shielding layer 41, thereby achieving a grounding role function.
In the method for manufacturing the system-in-package module 100, the plastic encapsulation film 30 is pressed onto the carrier plate 10 to encapsulate the electronic components 20, there is no need for professional molding equipment, thereby reducing costs. In addition, the electromagnetic shielding film 40/electromagnetic shielding layer is pressed onto the carrier plate 10 to achieve a function of electromagnetic shielding. Before pressing, the electromagnetic shielding film 40 can be processed to obtain a preset shape for regional shielding, making the process simple and easy.
While the present disclosure has been described with reference to particular embodiments, the description is illustrative of the disclosure and is not to be construed as limiting the disclosure. Therefore, those of ordinary skill in the art can make various modifications to the embodiments without departing from the scope of the disclosure as defined by the appended claims.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/CN2022/139349 | Dec 2022 | WO |
| Child | 18233909 | US |
