Manabu Bonkohara

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Interposer and semiconductor module using the same
- Patent number 9,386,685
- Issue date Jul 5, 2016
- ZYCUBE CO., LTD.
- Manabu Bonkohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode, electrode material, and electrode formation method
- Patent number 9,282,638
- Issue date Mar 8, 2016
- ZyCube Co., Ltd.
- Manabu Bonkohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional semiconductor integrated circuit device and metho...
- Patent number 8,907,459
- Issue date Dec 9, 2014
- ZyCube Co., Ltd.
- Manabu Bonkohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device, method of fabricating the same, and cam...
- Patent number 8,300,143
- Issue date Oct 30, 2012
- Manabu Bonkohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packing stack module and method of producing the same
- Patent number 6,188,127
- Issue date Feb 13, 2001
- NEC Corporation
- Naoji Senba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,892,271
- Issue date Apr 6, 1999
- NEC Corporation
- Hidetoshi Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack module
- Patent number 5,883,426
- Issue date Mar 16, 1999
- NEC Corporation
- Kenichi Tokuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier semiconductor device assembly and a method for forming...
- Patent number 5,834,338
- Issue date Nov 10, 1998
- NEC Corporation
- Hidetoshi Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with flexible board and method of fabricating...
- Patent number 5,805,422
- Issue date Sep 8, 1998
- NEC Corporation
- Kenichi Otake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device module comprising a substrate having grooves fixed to circui...
- Patent number 5,763,295
- Issue date Jun 9, 1998
- NEC Corporation
- Kenichi Tokuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device module comprising a substrate having grooves fixed to circui...
- Patent number 5,686,763
- Issue date Nov 11, 1997
- NEC Corporation
- Kenichi Tokuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier semiconductor device assembly
- Patent number 5,602,419
- Issue date Feb 11, 1997
- NEC Corporation
- Hidetoshi Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density multichip module packaging structure
- Patent number 5,570,274
- Issue date Oct 29, 1996
- NEC Corporation
- Masaru Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,063,435
- Issue date Nov 5, 1991
- Sumitomo Electric Industries, Ltd.
- Satoru Okamoto
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 4,763,409
- Issue date Aug 16, 1988
- NEC Corporation
- Kouichi Takekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor built-in integrated circuit packaged unit and process of...
- Patent number 4,714,952
- Issue date Dec 22, 1987
- NEC Corporation
- Kouichi Takekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Framed lead assembly for a semiconductor device comprising insulato...
- Patent number 4,138,691
- Issue date Feb 6, 1979
- Nippon Electric Co., Ltd.
- Manabu Bonkohara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRODE, ELECTRODE MATERIAL, AND ELECTRODE FORMATION METHOD
- Publication number 20140034354
- Publication date Feb 6, 2014
- ZyCube Co., Ltd.
- Manabu Bonkohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE/ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20140015119
- Publication date Jan 16, 2014
- ZyCube Co., Ltd.
- Manabu Bonkohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND SEMICONDUCTOR MODULE USING THE SAME
- Publication number 20140016270
- Publication date Jan 16, 2014
- ZyCube Co., Ltd.
- Manabu Bonkohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through via/the buried via elrctrolde material and the said via str...
- Publication number 20130313687
- Publication date Nov 28, 2013
- ZyCube Co., Ltd.
- Manabu Bonkohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHO...
- Publication number 20110127652
- Publication date Jun 2, 2011
- ZYCUBE CO., LTD.
- Manabu Bonkohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE, METHOD OF FABRICATING THE SAME, AND CAM...
- Publication number 20110122303
- Publication date May 26, 2011
- Manabu Bonkohara
- H01 - BASIC ELECTRIC ELEMENTS

Manabu Bonkohara

Person

Patents Grantslast 30 patents

Interposer and semiconductor module using the same

Electrode, electrode material, and electrode formation method

Three-dimensional semiconductor integrated circuit device and metho...

Solid-state imaging device, method of fabricating the same, and cam...

Semiconductor packing stack module and method of producing the same

Semiconductor device

Stack module

Chip carrier semiconductor device assembly and a method for forming...

Semiconductor package with flexible board and method of fabricating...

Device module comprising a substrate having grooves fixed to circui...

Device module comprising a substrate having grooves fixed to circui...

Chip carrier semiconductor device assembly

High density multichip module packaging structure

Semiconductor device

Method of manufacturing semiconductor device

Capacitor built-in integrated circuit packaged unit and process of...

Framed lead assembly for a semiconductor device comprising insulato...

Patents Applicationslast 30 patents

ELECTRODE, ELECTRODE MATERIAL, AND ELECTRODE FORMATION METHOD

SEMICONDUCTOR DEVICE/ELECTRONIC COMPONENT MOUNTING STRUCTURE

INTERPOSER AND SEMICONDUCTOR MODULE USING THE SAME

Through via/the buried via elrctrolde material and the said via str...

THREE-DIMENSIONAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHO...

SOLID-STATE IMAGING DEVICE, METHOD OF FABRICATING THE SAME, AND CAM...