Manfred Schindler

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Magnetic-field sensor package with integrated passive component
- Patent number 11,422,144
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Manfred Schindler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with component connected with carrier via spacer particles
- Patent number 11,094,619
- Issue date Aug 17, 2021
- Infineon Technologies AG
- Manfred Schindler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with component connected at carrier level
- Patent number 10,515,879
- Issue date Dec 24, 2019
- Infineon Technologies AG
- Manfred Schindler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with component connected with carrier via spacer particles
- Patent number 10,438,878
- Issue date Oct 8, 2019
- Infineon Technologies AG
- Manfred Schindler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 9,553,051
- Issue date Jan 24, 2017
- Infineon Technologies Austria AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-embedded packages with backside die connection
- Patent number 9,437,516
- Issue date Sep 6, 2016
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND DEVICES FOR WHEEL SENSORS
- Publication number 20230041154
- Publication date Feb 9, 2023
- INFINEON TECHNOLOGIES AG
- Wolfgang SCHWEIKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC-FIELD SENSOR PACKAGE WITH INTEGRATED PASSIVE COMPONENT
- Publication number 20200341023
- Publication date Oct 29, 2020
- INFINEON TECHNOLOGIES AG
- Manfred SCHINDLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH COMPONENT CONNECTED WITH CARRIER VIA SPACER PARTICLES
- Publication number 20200043836
- Publication date Feb 6, 2020
- INFINEON TECHNOLOGIES AG
- Manfred Schindler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH COMPONENT CONNECTED AT CARRIER LEVEL
- Publication number 20180350727
- Publication date Dec 6, 2018
- INFINEON TECHNOLOGIES AG
- Manfred Schindler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH COMPONENT CONNECTED WITH CARRIER VIA SPACER PARTICLES
- Publication number 20180294210
- Publication date Oct 11, 2018
- INFINEON TECHNOLOGIES AG
- Manfred Schindler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20160225717
- Publication date Aug 4, 2016
- Infineon Technologies Austria AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Method for Fabricating an Electronic Device
- Publication number 20150214204
- Publication date Jul 30, 2015
- INFINEON TECHNOLOGIES AG
- Manfred Schindler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-Embedded Packages with Backside Die Connection
- Publication number 20150194362
- Publication date Jul 9, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Manfred Schindler

Person

Patents Grantslast 30 patents

Magnetic-field sensor package with integrated passive component

Package with component connected with carrier via spacer particles

Package with component connected at carrier level

Package with component connected with carrier via spacer particles

Electronic component

Chip-embedded packages with backside die connection

Patents Applicationslast 30 patents

SYSTEMS AND DEVICES FOR WHEEL SENSORS

MAGNETIC-FIELD SENSOR PACKAGE WITH INTEGRATED PASSIVE COMPONENT

PACKAGE WITH COMPONENT CONNECTED WITH CARRIER VIA SPACER PARTICLES

PACKAGE WITH COMPONENT CONNECTED AT CARRIER LEVEL

PACKAGE WITH COMPONENT CONNECTED WITH CARRIER VIA SPACER PARTICLES

ELECTRONIC COMPONENT

Electronic Device and Method for Fabricating an Electronic Device

Chip-Embedded Packages with Backside Die Connection