Marco Lepper

Person

Dresden, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device comprising contact structures with protection...
- Patent number 9,590,056
- Issue date Mar 7, 2017
- GLOBALFOUNDRIES Inc.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming protection layers on sidewalls of contact etch...
- Patent number 9,269,809
- Issue date Feb 23, 2016
- GLOBALFOUNDRIES Inc.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming contacts for devices with multiple stress liners
- Patent number 9,023,696
- Issue date May 5, 2015
- GLOBALFOUNDRIES Inc.
- Peter Baars
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top corner rounding by implant-enhanced wet etching
- Patent number 9,023,709
- Issue date May 5, 2015
- GLOBALFOUNDRIES Inc.
- Hans-Peter Moll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mol insitu Pt rework sequence
- Patent number 8,883,586
- Issue date Nov 11, 2014
- GLOBALFOUNDRIES Inc.
- Peter Baars
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI semiconductor device comprising a substrate diode with reduced...
- Patent number 8,673,696
- Issue date Mar 18, 2014
- GLOBALFOUNDRIES Inc.
- Peter Baars
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating a CMOS integrated circuit having a dual str...
- Patent number 8,293,605
- Issue date Oct 23, 2012
- GLOBALFOUNDRIES, INC.
- Peter Baars
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for forming an integrated circuit device and c...
- Patent number 7,785,935
- Issue date Aug 31, 2010
- Qimonda AG
- Ole Bosholm
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING CONTACT STRUCTURES WITH PROTECTION...
- Publication number 20160099321
- Publication date Apr 7, 2016
- GLOBALFOUNDRIES INC.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP CORNER ROUNDING BY IMPLANT-ENHANCED WET ETCHING
- Publication number 20150064872
- Publication date Mar 5, 2015
- GLOBALFOUNDRIES INC.
- Hans-Peter Moll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOL INSITU PT REWORK SEQUENCE
- Publication number 20150028431
- Publication date Jan 29, 2015
- GLOBALFOUNDRIES INC.
- Peter Baars
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING CONTACT STRUCTURES WITH PROTECTION...
- Publication number 20140264641
- Publication date Sep 18, 2014
- GLOBALFOUNDRIES INC.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Contacts for Devices with Multiple Stress Liners
- Publication number 20120299160
- Publication date Nov 29, 2012
- GLOBALFOUNDRIES INC.
- Peter Baars
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOL INSITU PT REWORK SEQUENCE
- Publication number 20120248551
- Publication date Oct 4, 2012
- GLOBALFOUNDRIES INC.
- Peter Baars
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING A CMOS INTEGRATED CIRCUIT HAVING A DUAL STR...
- Publication number 20120220086
- Publication date Aug 30, 2012
- GLOBALFOUNDRIES INC.
- Peter Baars
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI Semiconductor Device Comprising a Substrate Diode with Reduced...
- Publication number 20120217582
- Publication date Aug 30, 2012
- GLOBALFOUNDRIES INC.
- Peter BAARS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method for forming an integrated circuit device and c...
- Publication number 20090121314
- Publication date May 14, 2009
- Ole Bosholm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method for an integrated semiconductor structure and...
- Publication number 20080150141
- Publication date Jun 26, 2008
- Werner Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method for an integrated semiconductor structure and...
- Publication number 20070077720
- Publication date Apr 5, 2007
- Infineon Technologies AG
- Lars Heineck
- H01 - BASIC ELECTRIC ELEMENTS

Marco Lepper

Person

Patents Grantslast 30 patents

Semiconductor device comprising contact structures with protection...

Methods for forming protection layers on sidewalls of contact etch...

Method of forming contacts for devices with multiple stress liners

Top corner rounding by implant-enhanced wet etching

Mol insitu Pt rework sequence

SOI semiconductor device comprising a substrate diode with reduced...

Methods for fabricating a CMOS integrated circuit having a dual str...

Manufacturing method for forming an integrated circuit device and c...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE COMPRISING CONTACT STRUCTURES WITH PROTECTION...

TOP CORNER ROUNDING BY IMPLANT-ENHANCED WET ETCHING

MOL INSITU PT REWORK SEQUENCE

SEMICONDUCTOR DEVICE COMPRISING CONTACT STRUCTURES WITH PROTECTION...

Method of Forming Contacts for Devices with Multiple Stress Liners

MOL INSITU PT REWORK SEQUENCE

METHODS FOR FABRICATING A CMOS INTEGRATED CIRCUIT HAVING A DUAL STR...

SOI Semiconductor Device Comprising a Substrate Diode with Reduced...

Manufacturing method for forming an integrated circuit device and c...

Manufacturing method for an integrated semiconductor structure and...

Manufacturing method for an integrated semiconductor structure and...