Marcus E. Interrante

Person

New Paltz, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit (IC) device package lid attach utilizing nano pa...
- Patent number 11,164,804
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi integrated circuit chip carrier package
- Patent number 10,978,314
- Issue date Apr 13, 2021
- International Business Machines Corporation
- Marcus E. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Managing thermal warpage of a laminate
- Patent number 10,832,987
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous thermal interface material for corner and or edge deg...
- Patent number 10,804,181
- Issue date Oct 13, 2020
- International Business Machines Corporation
- Marcus E. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi integrated circuit chip carrier package
- Patent number 10,541,156
- Issue date Jan 21, 2020
- International Business Machines Corporation
- Marcus E. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing directional stress in an orthotropic encapsulation member...
- Patent number 9,583,408
- Issue date Feb 28, 2017
- International Business Machines Corporation
- Marcus E. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal hot spot cooling for semiconductor devices
- Patent number 9,401,315
- Issue date Jul 26, 2016
- GLOBALFOUNDRIES Inc.
- Paul F. Bodenweber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module assembly with patterned adhesive array
- Patent number 9,293,439
- Issue date Mar 22, 2016
- GLOBALFOUNDRIES Inc.
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D bond and assembly process for severely bowed interposer die
- Patent number 9,224,712
- Issue date Dec 29, 2015
- International Business Machines Corporation
- Marcus E. Interrante
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module assembly with patterned adhesive array
- Patent number 9,093,563
- Issue date Jul 28, 2015
- International Business Machines Corporation
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform solder reflow fixture
- Patent number 8,444,043
- Issue date May 21, 2013
- International Business Machines Corporation
- William E. Bernier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Integrated Circuit (IC) Device Package Lid Attach Utilizing Nano Pa...
- Publication number 20210028079
- Publication date Jan 28, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Thermal Interface Material for Corner and or Edge Deg...
- Publication number 20200294880
- Publication date Sep 17, 2020
- Marcus E. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi Integrated Circuit Chip Carrier Package
- Publication number 20200135495
- Publication date Apr 30, 2020
- Marcus E. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANAGING THERMAL WARPAGE OF A LAMINATE
- Publication number 20190295921
- Publication date Sep 26, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING DIRECTIONAL STRESS IN AN ORTHOTROPIC ENCAPSULATION MEMBER...
- Publication number 20170053845
- Publication date Feb 23, 2017
- International Business Machines Corporation
- Marcus E. INTERRANTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D BOND AND ASSEMBLY PROCESS FOR SEVERELY BOWED INTERPOSER DIE
- Publication number 20150228614
- Publication date Aug 13, 2015
- International Business Machines Corporation
- MARCUS E INTERRANTE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MODULE ASSEMBLY WITH PATTERNED ADHESIVE ARRAY
- Publication number 20150093859
- Publication date Apr 2, 2015
- International Business Machines Corporation
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Module Assembly With Patterned Adhesive Array
- Publication number 20150014836
- Publication date Jan 15, 2015
- International Business Machines Corporation
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS

Marcus E. Interrante

Person

Patents Grantslast 30 patents

Integrated circuit (IC) device package lid attach utilizing nano pa...

Multi integrated circuit chip carrier package

Managing thermal warpage of a laminate

Heterogeneous thermal interface material for corner and or edge deg...

Multi integrated circuit chip carrier package

Reducing directional stress in an orthotropic encapsulation member...

Thermal hot spot cooling for semiconductor devices

Electronic module assembly with patterned adhesive array

3D bond and assembly process for severely bowed interposer die

Electronic module assembly with patterned adhesive array

Uniform solder reflow fixture

Patents Applicationslast 30 patents

Integrated Circuit (IC) Device Package Lid Attach Utilizing Nano Pa...

Heterogeneous Thermal Interface Material for Corner and or Edge Deg...

Multi Integrated Circuit Chip Carrier Package

MANAGING THERMAL WARPAGE OF A LAMINATE

REDUCING DIRECTIONAL STRESS IN AN ORTHOTROPIC ENCAPSULATION MEMBER...

3D BOND AND ASSEMBLY PROCESS FOR SEVERELY BOWED INTERPOSER DIE

ELECTRONIC MODULE ASSEMBLY WITH PATTERNED ADHESIVE ARRAY

Electronic Module Assembly With Patterned Adhesive Array