Margie T. Rios

Person

Mandaue City, PH

People

Patents Grantslast 30 patents

Information Patent Grant
Thin semiconductor device packages
- Patent number 9,685,398
- Issue date Jun 20, 2017
- Fairchild Semiconductor Corporation
- Margie Rios
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with an embedded printed circuit board and st...
- Patent number 8,426,953
- Issue date Apr 23, 2013
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D smart power module
- Patent number 8,088,645
- Issue date Jan 3, 2012
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with stacked dice for a buck converter
- Patent number 8,063,472
- Issue date Nov 22, 2011
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with an embedded printed circuit board and st...
- Patent number 8,030,743
- Issue date Oct 4, 2011
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal stud bumping for flip chip applications
- Patent number 7,932,171
- Issue date Apr 26, 2011
- Fairchild Semiconductor Corporation
- Rajeev Joshi
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
3D smart power module
- Patent number 7,808,101
- Issue date Oct 5, 2010
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless semiconductor package for efficient heat dissipation
- Patent number 7,586,179
- Issue date Sep 8, 2009
- Fairchild Semiconductor Corporation
- Paul Armand Calo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal stud bumping for flip chip applications
- Patent number 7,501,337
- Issue date Mar 10, 2009
- Fairchild Semiconductor Corporation
- Rajeev Joshi
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Dual metal stud bumping for flip chip applications
- Patent number 7,271,497
- Issue date Sep 18, 2007
- Fairchild Semiconductor Corporation
- Rajeev Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for maintaining solder thickness in flipchip attach packagin...
- Patent number 6,943,434
- Issue date Sep 13, 2005
- Fairchild Semiconductor Corporation
- Consuelo N. Tangpuz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THIN SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURE
- Publication number 20160284628
- Publication date Sep 29, 2016
- Fairchild Semiconductor Corporation
- Margie RIOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH AN EMBEDDED PRINTED CIRCUIT BOARD AND ST...
- Publication number 20120001313
- Publication date Jan 5, 2012
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SMART POWER MODULE
- Publication number 20110070699
- Publication date Mar 24, 2011
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SMART POWER MODULE
- Publication number 20090200657
- Publication date Aug 13, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH STACKED DICE FOR A BUCK CONVERTER
- Publication number 20090189266
- Publication date Jul 30, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL METAL STUD BUMPING FOR FLIP CHIP APPLICATIONS
- Publication number 20090186452
- Publication date Jul 23, 2009
- Rajeev Joshi
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SEMICONDUCTOR PACKAGE WITH AN EMBEDDED PRINTED CIRCUIT BOARD AND ST...
- Publication number 20090174046
- Publication date Jul 9, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS SEMICONDUCTOR PACKAGE FOR EFFICIENT HEAT DISSIPATION
- Publication number 20090091010
- Publication date Apr 9, 2009
- Paul Armand Calo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual metal stud bumping for flip chip applications
- Publication number 20060189116
- Publication date Aug 24, 2006
- Rajeev Joshi
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Method for maintaining solder thickness in flipchip attach packagin...
- Publication number 20050224940
- Publication date Oct 13, 2005
- Consuelo N. Tangpuz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual metal stud bumping for flip chip applications
- Publication number 20040178481
- Publication date Sep 16, 2004
- Rajeev Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for maintaining solder thickness in flipchip attach packagin...
- Publication number 20040130009
- Publication date Jul 8, 2004
- Consuelo N. Tangpuz
- H01 - BASIC ELECTRIC ELEMENTS

Margie T. Rios

Person

Patents Grantslast 30 patents

Thin semiconductor device packages

Semiconductor package with an embedded printed circuit board and st...

3D smart power module

Semiconductor package with stacked dice for a buck converter

Semiconductor package with an embedded printed circuit board and st...

Dual metal stud bumping for flip chip applications

3D smart power module

Wireless semiconductor package for efficient heat dissipation

Dual metal stud bumping for flip chip applications

Dual metal stud bumping for flip chip applications

Method for maintaining solder thickness in flipchip attach packagin...

Patents Applicationslast 30 patents

THIN SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURE

SEMICONDUCTOR PACKAGE WITH AN EMBEDDED PRINTED CIRCUIT BOARD AND ST...

3D SMART POWER MODULE

3D SMART POWER MODULE

SEMICONDUCTOR PACKAGE WITH STACKED DICE FOR A BUCK CONVERTER

DUAL METAL STUD BUMPING FOR FLIP CHIP APPLICATIONS

SEMICONDUCTOR PACKAGE WITH AN EMBEDDED PRINTED CIRCUIT BOARD AND ST...

WIRELESS SEMICONDUCTOR PACKAGE FOR EFFICIENT HEAT DISSIPATION

Dual metal stud bumping for flip chip applications

Method for maintaining solder thickness in flipchip attach packagin...

Dual metal stud bumping for flip chip applications

Method for maintaining solder thickness in flipchip attach packagin...