Maria C.Y. Quinones

Person

Cebu City, PH

People

Patents Grantslast 30 patents

Information Patent Grant
Molded packaging for wide band gap semiconductor devices
- Patent number 12,087,677
- Issue date Sep 10, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Clemens Ypil Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concealed gate terminal semiconductor packages and related methods
- Patent number 11,791,247
- Issue date Oct 17, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erwin Ian Vamenta Almagro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with heatsink
- Patent number 11,616,006
- Issue date Mar 28, 2023
- Semiconductor Components Industries, LLC
- Maria Clemens Ypil Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packaging with galvanic isolation
- Patent number 10,943,855
- Issue date Mar 9, 2021
- Semiconductor Components Industries, LLC
- Maria Cristina Estacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation between semiconductor components
- Patent number 10,446,498
- Issue date Oct 15, 2019
- FAIRCHILD SEMICONDUCTOR CORPORATION
- John Constantino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation between semiconductor components
- Patent number 9,735,112
- Issue date Aug 15, 2017
- Fairchild Semiconductor Corporation
- John Constantino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package including low stress configuration
- Patent number 9,583,454
- Issue date Feb 28, 2017
- Fairchild Semiconductor Corporation
- Maria Clemens Y. Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiP substrate
- Patent number 8,372,690
- Issue date Feb 12, 2013
- Fairchild Semiconductor Corporation
- Maria Clemens Y. Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including molded wireless exposed drain packaging
- Patent number 6,989,588
- Issue date Jan 24, 2006
- Fairchild Semiconductor Corporation
- Maria C. Y. Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package including drain clip
- Patent number 6,777,800
- Issue date Aug 17, 2004
- Fairchild Semiconductor Corporation
- Ruben Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging a plurality of devices utilizing a plurality of...
- Patent number 6,762,067
- Issue date Jul 13, 2004
- Fairchild Semiconductor Corporation
- Maria Clemens Y. Quinones
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONCEALED GATE TERMINAL SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20230402350
- Publication date Dec 14, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erwin Ian Vamenta ALMAGRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES
- Publication number 20220238421
- Publication date Jul 28, 2022
- Semiconductor Components Industries, LLC
- Maria Clemens Ypil QUINONES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONCEALED GATE TERMINAL SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20220102248
- Publication date Mar 31, 2022
- Semiconductor Components Industries, LLC
- Erwin Ian Vamenta ALMAGRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGING WITH GALVANIC ISOLATION
- Publication number 20210193561
- Publication date Jun 24, 2021
- Semiconductor Components Industries, LLC
- Maria Cristina ESTACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HEATSINK
- Publication number 20200273782
- Publication date Aug 27, 2020
- Semiconductor Components Industries, LLC
- Maria Clemens Ypil QUINONES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGING WITH GALVANIC ISOLATION
- Publication number 20190067171
- Publication date Feb 28, 2019
- Semiconductor Components Industries, LLC
- Maria Cristina ESTACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION BETWEEN SEMICONDUCTOR COMPONENTS
- Publication number 20170373008
- Publication date Dec 28, 2017
- FAIRCHILD SEMICONDUCTOR CORPORATION
- John CONSTANTINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION BETWEEN SEMICONDUCTOR COMPONENTS
- Publication number 20150200162
- Publication date Jul 16, 2015
- Fairchild Semiconductor Corporation
- John CONSTANTINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEX CLIP CONNECTOR FOR SEMICONDUCTOR DEVICE
- Publication number 20090179313
- Publication date Jul 16, 2009
- Maria Clemens Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE INCLUDING STAND OFF STRUCTURES
- Publication number 20090057855
- Publication date Mar 5, 2009
- Maria Clemens Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device including molded wireless exposed drain packaging
- Publication number 20030052408
- Publication date Mar 20, 2003
- Fairchild Semiconductor Corporation
- Maria C.Y. Quinones
- H01 - BASIC ELECTRIC ELEMENTS

Maria C.Y. Quinones

Person

Patents Grantslast 30 patents

Molded packaging for wide band gap semiconductor devices

Concealed gate terminal semiconductor packages and related methods

Semiconductor package with heatsink

Electronic device packaging with galvanic isolation

Isolation between semiconductor components

Isolation between semiconductor components

Semiconductor die package including low stress configuration

SiP substrate

Semiconductor device including molded wireless exposed drain packaging

Semiconductor die package including drain clip

Method of packaging a plurality of devices utilizing a plurality of...

Patents Applicationslast 30 patents

CONCEALED GATE TERMINAL SEMICONDUCTOR PACKAGES AND RELATED METHODS

MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES

CONCEALED GATE TERMINAL SEMICONDUCTOR PACKAGES AND RELATED METHODS

ELECTRONIC DEVICE PACKAGING WITH GALVANIC ISOLATION

SEMICONDUCTOR PACKAGE WITH HEATSINK

ELECTRONIC DEVICE PACKAGING WITH GALVANIC ISOLATION

ISOLATION BETWEEN SEMICONDUCTOR COMPONENTS

ISOLATION BETWEEN SEMICONDUCTOR COMPONENTS

FLEX CLIP CONNECTOR FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DIE PACKAGE INCLUDING STAND OFF STRUCTURES

Semiconductor device including molded wireless exposed drain packaging