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Maria L. Cobarruviaz
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Cupertino, CA, US
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last 30 patents
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Patent Grant
Redistribution layer and under bump material structure for converti...
Patent number
6,011,314
Issue date
Jan 4, 2000
Hewlett-Packard Company
Jacques Leibovitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-layer fabrication in integrated circuit systems
Patent number
5,399,528
Issue date
Mar 21, 1995
Jacques Leibovitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Controlled etching process for forming fine-geometry circuit lines...
Patent number
5,221,421
Issue date
Jun 22, 1993
Hewlett-Packard Company
Jacques Leibovitz
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Methods for forming high density multi-chip carriers
Patent number
5,200,300
Issue date
Apr 6, 1993
Hewlett-Packard Company
Jacques Leibovitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked solid via formation in integrated circuit systems
Patent number
5,162,260
Issue date
Nov 10, 1992
Hewlett-Packard Company
Jacques Leibovitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked solid via formation in integrated circuit systems
Patent number
5,055,425
Issue date
Oct 8, 1991
Hewlett-Packard Company
Jacques Leibovitz
H01 - BASIC ELECTRIC ELEMENTS